ESD224
- IEC 61000-4-2 Level 4 ESD Protection
- ±12-kV Contact Discharge
- ±15-kV Air Gap Discharge
- IEC 61000-4-4 EFT Protection
- 80 A (5/50 ns)
- IEC 61000-4-5 Surge Protection
- 2 A (8/20 µs)
- IO Capacitance:
- 0.5 pF (Typical)
- HDMI 2.0 Compliant
- Ultra-Low Leakage Current: 0.1 nA (Typical)
- Ultra-Low ESD Clamping Voltage: 8 V at 16-A TLP (System Side)
- Supports High Speed Interfaces up to 6 Gbps
- Industrial Temperature Range: –40°C to +125°C
- Industry Standard DQA Package
The ESD224 is a bidirectional TVS ESD protection diode array for high speed applications such as USB 3.0 and HDMI 2.0. The ESD224 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4). The ESD224 employs on-chip differentially matched series elements to enhance down-stream ESD clamping performance while maintaining the signal compliance for high speed interfaces. The ultra-low clamping performance and high differential bandwidth provided by the ESD224 on-chip ESD protection network enables the device to be HDMI 2.0 compliant while providing robust protection to downstream HDMI devices.
The ESD224 is offered in the industry standard USON-10 (DQA) package. The package features 0.5-mm pin pitch easing implementation and reducing design time.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | ESD224 Low Clamping 4-Channel ESD Protection Device for HDMI Interface datasheet (Rev. A) | PDF | HTML | 2018年 3月 29日 |
Application note | ESD and Surge Protection for USB Interfaces (Rev. B) | PDF | HTML | 2024年 1月 11日 | |
Application brief | ESD Protection for HDMI Applications (Rev. A) | PDF | HTML | 2023年 11月 1日 | |
Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 | |
Application note | ESD224 HDMI 2.0 Compliance and Protection | 2017年 11月 30日 |
設計與開發
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ESDEVM — ESD 評估模組
TIDA-050001 — HDMI 2.0 ESD 保護參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
USON (DQA) | 10 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。