首頁 被動和離散 Diodes ESD 防護二極體
首頁
被動和離散
Diodes
ESD 防護二極體

ESD762

現行

具 8/20-µS 突波的雙路 1.7-pF ±24-V ±20-kV ESD 防護二極體

立即訂購
產品規格表

ESD762

現行
產品規格表 立即訂購

產品詳細資料

Package name SOT-23-3 Peak pulse power (8/20 μs) (max) (W) 90 Vrwm (V) 24 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 1.7 IEC 61000-4-2 contact (±V) 20000 IEC 61000-4-5 (A) 2.5 Features ESD Protection Clamping voltage (V) 38 Dynamic resistance (typ) 0.57 Interface type CAN, GPIO, RS-485/432/422/232, USB 2.0 Breakdown voltage (min) (V) 25.5 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -55 to 150
Package name SOT-23-3 Peak pulse power (8/20 μs) (max) (W) 90 Vrwm (V) 24 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 1.7 IEC 61000-4-2 contact (±V) 20000 IEC 61000-4-5 (A) 2.5 Features ESD Protection Clamping voltage (V) 38 Dynamic resistance (typ) 0.57 Interface type CAN, GPIO, RS-485/432/422/232, USB 2.0 Breakdown voltage (min) (V) 25.5 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -55 to 150
SOT-23 (DBZ) 3 6.9204 mm² 2.92 x 2.37
  • Robust surge protection:
    • IEC 61000-4-5 (8/20 µs): 5.7 A or 2.5 A
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30-kV or ±20-kV contact discharge
    • ±30-kV or ±20-kV air-gap discharge
  • 24 V working voltage
  • Bidirectional ESD protection
  • 2-channel device provides complete ESD and surge protection with single component
  • Low clamping voltage protects downstream components
  • I/O capacitance = 3 pF or 1.7 pF (typical)
  • SOT-23 (DBZ) small, standard, common footprint
  • SOT-323 / SC-70 (DCK) very small, standard, space saving, common footprint
  • Leaded packages used for automatic optical inspection (AOI)
  • Robust surge protection:
    • IEC 61000-4-5 (8/20 µs): 5.7 A or 2.5 A
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30-kV or ±20-kV contact discharge
    • ±30-kV or ±20-kV air-gap discharge
  • 24 V working voltage
  • Bidirectional ESD protection
  • 2-channel device provides complete ESD and surge protection with single component
  • Low clamping voltage protects downstream components
  • I/O capacitance = 3 pF or 1.7 pF (typical)
  • SOT-23 (DBZ) small, standard, common footprint
  • SOT-323 / SC-70 (DCK) very small, standard, space saving, common footprint
  • Leaded packages used for automatic optical inspection (AOI)

The ESD752 and ESD762 are bidirectional ESD protection diodes for USB power delivery (USB-PD) and industrial interfaces. The ESD752 and ESD762 are rated to dissipate contact ESD that meets or exceeds the maximum level specified in the IEC 61000-4-2 level 4 standard (±30-kV or ±20-kV contact and ±30-kV or ±20-kV airgap). The low dynamic resistance and low clamping voltage enables system level protection against transient events. This protection is key because industrial systems require a high level of robustness and reliability.

These devices feature a low IO capacitance per channel and a pin-out to suit two IO lines from damage caused by electrostatic discharge (ESD) and other transients. The IPP = 5.7 A (8/20 µs surge waveform) capability of the ESD752 makes it suitable for protecting USB VBUS against transient surge events as well as industrial I/O lines. Additionally, the 3 pF or 1.7 pF line capacitance of the ESD752 and ESD762 are suitable for protecting the slower speed signals for USB power delivery and IO signals for industrial applications.

The ESD752 and ESD762 are offered in two leaded packages for easy flow through routing.

The ESD752 and ESD762 are bidirectional ESD protection diodes for USB power delivery (USB-PD) and industrial interfaces. The ESD752 and ESD762 are rated to dissipate contact ESD that meets or exceeds the maximum level specified in the IEC 61000-4-2 level 4 standard (±30-kV or ±20-kV contact and ±30-kV or ±20-kV airgap). The low dynamic resistance and low clamping voltage enables system level protection against transient events. This protection is key because industrial systems require a high level of robustness and reliability.

These devices feature a low IO capacitance per channel and a pin-out to suit two IO lines from damage caused by electrostatic discharge (ESD) and other transients. The IPP = 5.7 A (8/20 µs surge waveform) capability of the ESD752 makes it suitable for protecting USB VBUS against transient surge events as well as industrial I/O lines. Additionally, the 3 pF or 1.7 pF line capacitance of the ESD752 and ESD762 are suitable for protecting the slower speed signals for USB power delivery and IO signals for industrial applications.

The ESD752 and ESD762 are offered in two leaded packages for easy flow through routing.
filter 尋找其它 ESD 防護二極體
下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
引腳對引腳且具備與所比較裝置相同的功能
ESD2CAN24-Q1 現行 適用於車載網路的車用雙路 3-pF、±24-V、±30-kV ESD 防護二極體 24-V ESD device for CAN interface 30-KV ESD protection
ESD752 現行 具 8/20-µS 突波的雙路、3-pF、±24-V、±30-kV ESD 防護二極體 24-V ESD device for industrial interface 30-KV ESD protection

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 2
類型 標題 日期
* Data sheet ESD752 and ESD762 24-V, 2-Channel, ESD Protection With 5.7 A of 8/20 µsSurge Protection in a SOT-23 and SOT-323 / SC-70 Package datasheet (Rev. B) PDF | HTML 2022年 11月 22日
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 2022年 8月 18日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

ESDEVM — ESD 評估模組

靜電敏感裝置 (ESD) 評估模組 (EVM) 是我們大多數 ESD 產品組合的開發平台。此電路板配備所有傳統 ESD 元件封裝，可測試任意數量的裝置。裝置可以焊接到其相應的元件封裝上，然後進行測試。對於一般高速 ESD 二極體，會實作阻抗控制的配置以取得 S 參數並取消內嵌電路板軌跡。對於非高速 ESD 二極體，其元件封裝會包含連接至測試點的軌跡，讓您輕鬆執行 DC 測試，例如崩潰電壓、保持電壓、洩漏等。電路板配置也可以透過將訊號針腳短路到訊號所在的任何地方，讓任何裝置針腳都能輕鬆地連接到電源 (VCC) 或接地。
使用指南: PDF | HTML
TI.com 無法提供
參考設計

TIDA-010253 — Battery control unit reference design for energy storage systems

This reference design is a central controller for a high-voltage Lithium-ion (Li-ion), lithium iron phosphate (LiFePO4) battery rack. This design provides driving circuits for high-voltage relay, communication interfaces, (including RS-485, controller area network (CAN), daisy chain, and Ethernet), (...)
Design guide: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
SOT-23 (DBZ) 3 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片