LM4941
- Improved RF Suppression, By Up to 20dB Over Previous Designs in Selected Applications
- Fully Differential Amplification
- Available in Space-Saving DSBGA Package
- Ultra Low Current Shutdown Mode
- Can Drive Capacitive Loads up to 100pF
- Improved Pop & Click Circuitry Eliminates Noises During Turn-On and Turn-Off Transitions
- 2.4 - 5.5V Operation
- No Output Coupling Capacitors, Snubber Networks or Bootstrap Capacitors Required
Key Specifications
- Improved PSRR at 217Hz 95dB (typ)
- Power Output, VDD = 5.0V, RL = 8Ω, 1% THD+N 1.25W (typ)
- Power Output, VDD = 3.0V, RL = 8Ω, 1% THD+N 430mW (typ)
- Shutdown Current 0.1µA (typ)
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The LM4941 is a fully differential audio power amplifier primarily designed for demanding applications in mobile phones and other portable communication device applications. It is capable of delivering 1.25 watts of continuous average power to a 8Ω load with less than 1% distortion (THD+N) from a 5VDC power supply. The LM4941 does not require output coupling capacitors or bootstrap capacitors, and therefore is ideally suited for mobile phone and other small form factor applications where minimal PCB space is a primary requirement.
The LM4941 also features proprietary internal circuitry that suppresses the coupling of RF signals into the chip. This is important because certain types of RF signals (such as GSM) can couple into audio amplifiers in such a way that part of the signal is heard through the speaker. The RF suppression circuitry in the LM4941 makes it well-suited for portable applications in which strong RF signals generated by an antenna from or a cellular phone or other portable electronic device may couple audibly into the amplifier.
Other features include a low-power consumption shutdown mode, internal thermal shutdown protection, and advanced pop & click circuitry.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LM4941 1.25W Fully Diff Audio Pwr Amp w/RF Suppression & Shutdown datasheet (Rev. C) | 2013年 5月 1日 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點