THS4500-EP
- Fully Differential Architecture
- Bandwidth: 370 MHz
- Slew Rate: 2800 V/µs
- IMD3: –90 dBc at 30 MHz
- OIP3: 49 dBm at 30 MHz
- Output Common-Mode Control
- Wide Power-Supply Voltage Range: 5 V, ±5 V, 12 V, 15 V
- Input Common-Mode Range Shifted to Include Negative Power-Supply Rail
- Power-Down Capability (THS4500)
- Evaluation Module Available
The THS4500 is a high-performance, fully differential amplifier from Texas Instruments. The THS4500, featuring power-down capability, sets new performance standards for fully differential amplifiers with unsurpassed linearity, supporting 14-bit operation through 40 MHz. Available in an MSOP-8 with PowerPAD package for a smaller footprint, enhanced ac performance, and improved thermal dissipation capability.
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技術文件
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檢視所有 4 類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Wideband, Low-Distortion, Fully Differential Amplifier, THS4500-EP datasheet | 2013年 6月 6日 | |
* | VID | THS4500-EP VID V6213610 | 2016年 6月 21日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
Application note | Noise Analysis for High Speed Op Amps (Rev. A) | 2005年 1月 17日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HVSSOP (DGN) | 8 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點