TMUX1204
- Rail to rail operation
- Bidirectional signal path
- 1.8 V Logic compatible
- Fail-safe logic
- Low on-resistance: 5 Ω
- Wide supply range: 1.08 V to 5.5 V
- -40°C to +125°C Operating temperature
- Low supply current: 10 nA
- Transition time: 14 ns
- Break-before-make switching
- ESD protection HBM: 2000 V
The TMUX1204 is a modern complementary metal-oxide semiconductor (CMOS) analog multiplexer (MUX) in a 4:1 single-ended (1-channel) configuration. The TMUX1204 works with a single supply (1.08 V to 5.5 V) which allows for use in a broad array of applications from personal electronics to building automation systems. A low supply current of 10 nA enables use in portable applications.
All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TMUX1204 5-V, 4:1, General Purpose Analog Multiplexer datasheet (Rev. A) | PDF | HTML | 2019年 10月 1日 |
Application brief | 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) | PDF | HTML | 2022年 7月 26日 | |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
Application note | I2C Dynamic Addressing | 2019年 4月 25日 |
設計與開發
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LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
TIDA-010935 — 太陽能電源線通訊參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
USON (DQA) | 10 | Ultra Librarian |
VSSOP (DGS) | 10 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
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