產品詳細資料

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 2 CON (typ) (pF) 3.3 ON-state leakage current (max) (µA) 0.05 Supply current (typ) (µA) 37 Bandwidth (MHz) 3000 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Fail-safe logic, Integrated pulldown resistor on logic pin, Powered-off protection, Supports input voltage beyond supply Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 2 CON (typ) (pF) 3.3 ON-state leakage current (max) (µA) 0.05 Supply current (typ) (µA) 37 Bandwidth (MHz) 3000 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Fail-safe logic, Integrated pulldown resistor on logic pin, Powered-off protection, Supports input voltage beyond supply Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
TSSOP (PW) 14 32 mm² 5 x 6.4 UQFN (RSV) 16 4.68 mm² 2.6 x 1.8
  • Wide Supply Range: 1.5 V to 5.5 V
  • Low On-Capacitance: 3.3 pF
  • Low On-Resistance: 2 Ω
  • High Bandwidth: 3 GHz
  • -40°C to +125°C Operating Temperature
  • 1.8 V Logic Compatible
  • Supports Input Voltage Beyond Supply
  • Integrated Pull Down Resistor on Logic Pins
  • Bidirectional Signal Path
  • Fail-Safe Logic
  • Powered-off Protection up to 3.6 V
    • Pinout compatible to SN74CBTLV3126
    • Pinout compatible (logic variant) of SN74CBTLV3125
  • Wide Supply Range: 1.5 V to 5.5 V
  • Low On-Capacitance: 3.3 pF
  • Low On-Resistance: 2 Ω
  • High Bandwidth: 3 GHz
  • -40°C to +125°C Operating Temperature
  • 1.8 V Logic Compatible
  • Supports Input Voltage Beyond Supply
  • Integrated Pull Down Resistor on Logic Pins
  • Bidirectional Signal Path
  • Fail-Safe Logic
  • Powered-off Protection up to 3.6 V
    • Pinout compatible to SN74CBTLV3126
    • Pinout compatible (logic variant) of SN74CBTLV3125

The TMUX1511 is a complementary metal-oxide semiconductor (CMOS) switch. The TMUX1511 offers 1:1 SPST switch configuration with 4 independently controlled channels. Wide operating supply of 1.5 V to 5.5 V allows for use in a broad array of applications from servers and communication equipment to industrial applications. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins and can pass signals above supply up to VDD x 2, with a maximum input/output voltage of 5.5 V.

Powered-off Protection up to 3.6 V on the signal path of the TMUX1511 provides isolation when the supply voltage is removed (VDD = 0 V). Without this protection feature, switches can back-power the supply rail through an internal ESD diode and cause potential damage to the system.

Fail-Safe Logic circuitry allows voltages on the logic control pins to be applied before the supply pin, protecting the device from potential damage. All logic control inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range.

The TMUX1511 is a complementary metal-oxide semiconductor (CMOS) switch. The TMUX1511 offers 1:1 SPST switch configuration with 4 independently controlled channels. Wide operating supply of 1.5 V to 5.5 V allows for use in a broad array of applications from servers and communication equipment to industrial applications. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins and can pass signals above supply up to VDD x 2, with a maximum input/output voltage of 5.5 V.

Powered-off Protection up to 3.6 V on the signal path of the TMUX1511 provides isolation when the supply voltage is removed (VDD = 0 V). Without this protection feature, switches can back-power the supply rail through an internal ESD diode and cause potential damage to the system.

Fail-Safe Logic circuitry allows voltages on the logic control pins to be applied before the supply pin, protecting the device from potential damage. All logic control inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range.

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類型 標題 日期
* Data sheet TMUX1511 Low-Capacitance, 1:1 (SPST) 4-Channel, Powered-Off Protected Switch with 1.8 V Logic datasheet (Rev. A) PDF | HTML 2018年 12月 3日
Application brief 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) PDF | HTML 2022年 7月 26日
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022年 6月 2日
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021年 12月 1日
Application brief Enabling SPI-Based Flash Memory Expansion by Using Multiplexers (Rev. B) PDF | HTML 2021年 10月 7日
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML 2021年 1月 6日
Technical article Optimizing for protection and precision in servo drive control modules with multip PDF | HTML 2020年 10月 9日
Application brief Choosing the Right Multiplexer for a Discrete Programmable Gain Amplifier (PGA) PDF | HTML 2020年 9月 29日
Technical article Roll with the design punches and overcome power-sequencing challenges PDF | HTML 2019年 7月 29日
Application brief Improve Stability Issues with Low Con Multiplexers (Rev. A) 2018年 12月 10日
Technical article Logic gates and switches with Ioff or powered-off protection: empowering you to po PDF | HTML 2016年 11月 2日

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介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

使用指南: PDF
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介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
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模擬型號

TMUX1511 IBIS Model

SCDM193.ZIP (11 KB) - IBIS Model
模擬型號

TMUX1511 S-Parameter Model

SCDM203.ZIP (7933 KB) - S-Parameter Model
模擬型號

TMUX1511PW PSPICE Model

SCDM236.ZIP (19 KB) - PSpice Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
TSSOP (PW) 14 Ultra Librarian
UQFN (RSV) 16 Ultra Librarian

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