TMUX7308F
- Wide supply range:
- Dual supply: ±5 V to ±22 V
- Single supply: 8 V to 44 V
- Integrated fault protection:
- Overvoltage protection, source to supplies or source to drain: ±85 V
- Overvoltage protection: ±60 V
- Powered-off protection: ±60 V
- Non-fault channels continue to operate
- Known state without logic inputs present
- Output clamped to the supply in overvoltage condition
- Latch-up immune
- 1.8-V Logic capable
- Fail-safe logic: up to 44 V independent of supply
- Integrated pull-down resistor on logic pins
- Break-before-make switching
- Industry standard TSSOP and smaller WQFN packages
The TMUX7308F and TMUX7309F are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX7308F and TMUX7309F devices suitable for applications where power supply sequencing cannot be precisely controlled.
The device blocks fault voltage up to +60 V or –60 V relative to ground in both powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of switch input conditions and logic control status. Under normal operation conditions, if the analog input signal level on any Sx pin exceeds the supply voltage (V DD or V SS) by a threshold voltage (V T), the channel turns OFF and the Sx pin becomes high impedance. When the fault channel is selected, the drain pin (D or Dx) is pulled to the supply (V DD or V SS) that was exceeded.
The low capacitance, low charge injection, and integrated fault protection enables the TMUX7308F and TMUX7309F devices to be used in front end data acquisition applications where high performance and high robustness are both critical. The devices are available in a standard TSSOP package and smaller WQFN package (ideal if PCB space is limited).
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設計與開發
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本使用指南概述 TMUX73XXF 評估模組 (EVM) 及其適用應用。此電路板有助於對採用 TSSOP (PW) 封裝的德州儀器 TMUX73XXF 系列元件,快速進行原型設計和 DC 特性分析。此外,其也具備板載測試點,可提供測試各種訊號的彈性。
LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
WQFN (RRP) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。