TPA0211
- 2 W Into 4 Ω From 5-V Supply
- 0.6 W Into 4 Ω From 3-V Supply
- Wide Power Supply Compatibility: 3 V to 5 V
- Low Supply Current:
- 4 mA Typical at 5 V
- 4 mA Typical at 3 V
- Shutdown Control: 1 µA Typical
- Shutdown Pin Is TTL Compatible
- –40°C to 85°C Operating Temperature Range
- Space-Saving, Thermally-Enhanced MSOP-PowerPAD™ Packaging
The TPA0211 is a 2-W mono bridge-tied-load (BTL) amplifier designed to drive speakers with as low as 4-Ω impedance. The device is ideal for small wireless communicators, notebook PCs, PDAs, anyplace a mono speaker and stereo headphones are required. From a 5-V supply, the TPA0211 can deliver 2 W of power into a 4-Ω speaker.
The gain of the input stage is set by the user-selected input resistor and a 50-kΩ internal feedback resistor (AV = –RF / RI). The power stage is internally configured with a gain of –1.25 V/V in SE mode, and –2.5 V/V in BTL mode. Thus, the overall gain of the amplifier is –62.5 kΩ/RI in SE mode and –125 kΩ/RI in BTL mode. The input terminals are high-impedance CMOS inputs, and can be used as summing nodes.
The TPA0211 is available in the 8-pin thermally-enhanced MSOP-PowerPAD package (DGN) and operates over an ambient temperature range of –40°C to 85°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPA0211 2-W Mono Audio Power Amplifier datasheet (Rev. E) | PDF | HTML | 2016年 11月 11日 |
Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||
User guide | TPA0211EVM - User Guide | 2000年 10月 6日 |
設計與開發
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TPA0211EVM — TPA0211 評估模組
A 2W mono amplifier that will operate in both bridge-tied load (BTL) and single-ended (SE) modes. This makes the TPA0211 ideal for applications that require a mono earphone and speaker. In addition, integrated DEPOP circuitry eliminates speaker noise when the amplifier turns on, off, or exits (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HVSSOP (DGN) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。