TPA2037D1
- Powerful Mono Class-D Speaker Amplifier
- 3.24 W (4 , 5 V, 10% THDN)
- 2.57 W (4 , 5 V, 1% THDN)
- 1.80 W (8 , 5 V, 10% THDN)
- 1.46 W (8 , 5 V, 1% THDN)
- +6 dB Fixed Gain
- Integrated Image Reject Filter for DAC Noise Reduction
- Low Output Noise of 20 µV
- Low Quiescent Current of 1.5 mA
- Differential Input Impedance of 300 k
- Auto-Recovering Short-Circuit Protection
- Thermal-Overload Protection
- Filter-Free Mono Class-D Amp
- 9-Ball 1,21 mm × 1,16 mm 0,4mm Pitch WCSP
- APPLICATIONS
- Wireless or Cellular Handsets and PDAs
- Portable Navigation Devices
- General Portable Audio Devices
The TPA2037D1 is a 3.2 W high efficiency filter-free class-D audio power amplifier (class-D amp) with 6 dB of fixed gain in a 1.21 mm × 1.16 mm wafer chip scale package (WCSP). The device requires only one external component.
Features like 95% efficiency, 1.5 mA quiescent current, 0.1 µA shutdown current, 81-dB PSRR, 20 µV output noise, and improved RF immunity make the TPA2037D1 class-D amplifier ideal for cellular handsets. A start-up time of 4 ms with no audible pop makes the TPA2037D1 ideal for PDA and smart-phone applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 3.2W Mono Class-D Audio Power Amplifier with 6-dB Gain and Auto Short-Circuit Re datasheet (Rev. B) | 2010年 6月 1日 | |
Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||
Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 | ||
Application note | AN-1737 Managing EMI in Class D Audio Applications (Rev. A) | 2013年 5月 1日 | ||
EVM User's guide | TPA2037D1EVM User's Guide | 2009年 12月 8日 |
設計與開發
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TPA2037D1YFFEVM — TPA2037D1YFFEVM
The TPA2037D1EVM is an easy-to-use evaluation module which consists of a TPA2037D1 device and all necessary components to evaluate it. The TPA2037D1 is a 6-dB fixed-gain low-power Class-D audio power amplifier capable of delivering 1.46W into 8 Ω and 2.57W into 4 Ω at 1% THD+N (YFF package).
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YFF) | 9 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點