TPA2038D1
- Filter-Free Mono Class-D Speaker Amp
- GAIN Pin Selects Between 6 dB and 12 dB
- 3.2 W into 4 Ω from 5 V supply at 10% THD+N
- Powerful Mono Class-D Speaker Amplifier
- 1% at 1.4 W into 8 Ω from 5 V Supply
- 1% at 2.5 W into 4 Ω from 5 V Supply
- Integrated Image Reject Filter for DAC Noise Reduction
- Low Output Noise of 20 µV
- Low Quiescent Current of 1.5 mA
- Auto-Recovering Short-Circuit Protection
- Thermal-Overload Protection
- 9-Ball 1,21 mm × 1,16 mm 0,4 mm Pitch WCSP
The TPA2038D1 is a 3.2 W into 4-ohm (10% THD) high efficiency filter-free class-D audio power amplifier. The GAIN pin sets gain to either 6 dB or 12 dB.
Features like 95% efficiency, 1.5 mA quiescent current, 0.5 µA shutdown current, 81 dB PSRR, 20 µV output noise, and improved RF immunity make the TPA2038D1 class-D amplifier ideal for cellular handsets. A start-up time is within 4 ms with no turn-on pop.
The TPA2038D1 is available in a 1.21 mm x 1.16 mm, 0.4 mm pitch wafer chip scale package (WCSP).
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 3.2W Mono Class-D with Selectable Gain. datasheet (Rev. A) | 2012年 6月 19日 | |
Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||
Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 | ||
Application note | AN-1737 Managing EMI in Class D Audio Applications (Rev. A) | 2013年 5月 1日 | ||
EVM User's guide | TPA2038D1 EVM User's Guide | 2010年 8月 26日 |
設計與開發
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TPA2038D1YFFEVM — TPA2038D1 評估模組
The TPA2038D1EVM is an easy-to-use evaluation module which consists of a TPA2038D1device and all necessary components to evaluate it. The TPA2038D1 has two gain settings, 6-dB or 12-dB of gain, set by a jumper on the EVM. It is a low-power Class-D audio power amplifier capable of delivering 1.46W (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YFF) | 9 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。