TPA3002D2
- 9-W/Ch Into an 8-
Load From 12-V Supply
- Efficient, Class-D Operation Eliminates Heatsinks and Reduces Power Supply Requirements
- 32-Step DC Volume Control From –40 dB to 36 dB
- Line Outputs For External Headphone Amplifier With Volume Control
- Regulated 5-V Supply Output for Powering TPA6110A2
- Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
- Thermal and Short-Circuit Protection
- APPLICATIONS
- LCD Monitors and TVs
- Powered Speakers
PowerPAD is a trademark of Texas Instruments.
The TPA3002D2 is a 9-W (per channel) efficient, Class-D audio amplifier for driving bridged-tied stereo speakers. The TPA3002D2 can drive stereo speakers as low as 8 . The high efficiency of the TPA3002D2 eliminates the need for external heatsinks when playing music.
Stereo speaker volume is controlled with a dc voltage applied to the volume control terminal offering a range of gain from 40 dB to 36 dB. Line outputs, for driving external headphone amplifier inputs, are also dc voltage controlled with a range of gain from 56 dB to 20 dB.
An integrated 5-V regulated supply is provided for powering an external headphone amplifier.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 9-W Stereo Class-D Audio Power Amplifier w/DC Volume Control datasheet (Rev. C) | 2004年 3月 28日 | |
Application note | Layout Guidelines For TPA300x Series Parts (Rev. A) | 2020年 6月 24日 | ||
Application note | RC Filter Box For Class-D Output Power and THD+N Measurement | 2004年 2月 20日 | ||
EVM User's guide | TPA3002D2EVM - User Guide | 2002年 12月 13日 |
設計與開發
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TPA3002D2EVM — TPA3002D2 評估模組 (EVM)
The TPA3002D2 is a 9-W (per channel) highly efficient Class-D stereo audio power amplifier designed for driving 8-Ohm bridged-tied speakers. The high efficiency of the TPA3002D2 eliminates the need for external heat sinks when playing music and helps maximizes battery life.
Stereo speaker volume is (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTQFP (PHP) | 48 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。