產品詳細資料

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.35 THD + N at 1 kHz (%) 1 Iq (typ) (mA) 0.7 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.35 THD + N at 1 kHz (%) 1 Iq (typ) (mA) 0.7 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultra-Low Quiescent Current in Shutdown Mode...0.15 µA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultra-Low Quiescent Current in Shutdown Mode...0.15 µA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

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類型 標題 日期
* Data sheet TPA301: 350-mW Mono Audio Power Amplifier datasheet (Rev. E) 2004年 6月 24日
Application note PowerPAD™ Thermally Enhanced Package (Rev. H) 2018年 7月 6日
User guide TPA301EVM - User Guide (Rev. A) 2001年 4月 17日

設計與開發

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開發板

TPA301EVM — TPA301 評估模組 (EVM)

A low-voltage bridge-tied load (BTL) audio power amplifier capable of delivering 350-mW to the load. It is characterized at 3.3-V and 5-V, but will operate from 2-V to 5.5-V. To minimize power consumption, this device features a shutdown mode, holding IDD <0.15 µA. Package: 8-pin SOIC.

使用指南: PDF
向經銷商購買
子卡

BOOSTXL-AUDIO — 音頻訊號處理 BoosterPack 插入式模組

When plugged into a LaunchPad™ Development Kit, the BOOSTXL-AUDIO Audio BoosterPack™ Plug-in Module can capture audio input from a microphone and output audio through an on-board speaker. Headphone input and output is also supported. This audio input/output stream lets developers (...)

使用指南: PDF
模擬型號

TPA301 PSpice Model

SLOM361.ZIP (21 KB) - PSpice Model
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
參考設計

TIDM-VOICEBANDAUDIO — 使用 PWM DAC 的語音頻帶音訊重播

Low cost audio output based upon timer generating PWM & external low-pass filter with amplifier stages for either headphone or speaker. Audio data is stored in an on-board SPI Flash. A PC GUI with launchpad passthrough code is provided to load SPI Flash with audio data.
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
HVSSOP (DGN) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian

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