TPA3124D2
- 10-W/Ch Into an 8- Load From a 24-V Supply
- 15-W/Ch into a 4- Load from a 22-V Supply
- 30-W/Ch into a 8- Load from a 22-V Supply
- Operates From 10 V to 26 V
- Can Run From +24 V LCD Backlight Supply
- Efficient Class-D Operation Eliminates Need for Heat Sinks
- Four Selectable, Fixed-Gain Settings
- Internal Oscillator (No External Components Required)
- Single-Ended Analog Inputs
- Thermal and Short-Circuit Protection With Auto Recovery
- Space-Saving Surface Mount 24-Pin TSSOP Package
- Advanced Power-Off Pop Reduction
- APPLICATIONS
- Flat Panel Televisions
- DLP TVs
- CRT TVs
- Powered Speakers
DLP Is a trademark of Texas Instruments.
System Two, Audio Precision are trademarks of Audio Precision, Inc.
All other trademarks are the property of their respective owners.
The TPA3124D2 is a 15-W (per channel), efficient, class-D audio power amplifier for driving stereo speakers in a single-ended configuration or a mono speaker in a bridge-tied-load configuration. The TPA3124D2 can drive stereo speakers as low as 4 . The efficiency of the TPA3124D2 eliminates the need for an external heat sink when playing music.
The gain of the amplifier is controlled by two gain select pins. The gain selections are 20, 26, 32, and 36 dB.
The patented start-up and shutdown sequences minimize pop noise in the speakers without additional circuitry.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 15-W Stereo Class-D Audio Power Amplifier datasheet | 2008年 5月 23日 | |
Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||
Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 | ||
Application note | AN-1737 Managing EMI in Class D Audio Applications (Rev. A) | 2013年 5月 1日 | ||
EVM User's guide | TPA3124D2EVM - User Guide (Rev. A) | 2008年 11月 4日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTSSOP (PWP) | 24 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。