TPA3156D2
- 2 × 70 W Into a 4-Ω BTL Load at 24 V
- Wide Voltage Range: 4.5 V to 26 V
- Efficient Class-D Operation
- Very Low Idle Current: <23 mA for recommended LC filter configurations
- Greater than 90% Power Efficiency
- Adaptive Modulation Schemes based on Output Power
- Multiple Switching Frequencies
- AM Avoidance
- Master and Slave Synchronization
- 300-KHz to 1.2-MHz Switching Frequency
- Feedback Power-Stage Architecture With High PSRR Reduces PSU Requirements
- Programmable Power Limit
- Parallel BTL Mode and Mono-Channel Mode Support
- Supports Both Single and Dual Power Supply Modes
- Integrated Self-Protection Circuits Including Overvoltage, Undervoltage, Overtemperature, DC-Detect, and Short Circuit With Error Reporting
- Thermally Enhanced Packages
- DAD (32-Pin HTSSOP Pad Up)
- Pin to Pin Compatible with TPA3116D2 and TPA3126D2
The TPA3156D2 has low idle power loss and helps to extend the battery life of Bluetooth/Wireless speakers and other battery-powered audio systems. The high efficiency of the TPA3156D2 device allows it to do 2 × 70 W with external heat sink on a dual layer PCB. This device integrates an efficiency boost mode, which dynamically reduces the current ripple of the external LC filter and the idle current .
The TPA3156D2 advanced oscillator/PLL circuit employs a multiple switching frequency option to avoid AM interferences, which is achieved together with an option of either master or slave option, making it possible to synchronize multiple devices.
The TPA3156D2 devices are fully protected against faults with short-circuit protection and thermal protection as well as overvoltage, undervoltage, and DC protection. Faults are reported back to the processor to prevent devices from being damaged during overload conditions.
技術文件
設計與開發
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TPA3156D2EVM — TPA3156D2 無電感器 70W 立體聲道 (BTL) D 類音訊放大器評估模組
The TPA3156D2EVM allows for the evaluation of the TPA3156D2. This is an efficient class D audio power amplifier for driving 2 bridged-tied stereo speakers at 70W per channel.
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTSSOP (DAD) | 32 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。