TPA4411
- Space Saving Packages
- 20-Pin, 4 mm × 4 mm Thin QFN
- PA4411 — Thermally Optimized PowerPAD™ Package
- TTPA4411M — Thermally Enhanced PowerPAD™ Package
- 16-Ball, 2.18 mm × 2.18 mm WCSP
- 20-Pin, 4 mm × 4 mm Thin QFN
- Ground-Referenced Outputs Eliminate
DC-Bias Voltages on Headphone Ground Pin- No Output DC-Blocking Capacitors
- Reduced Board Area
- Reduced Component Cost
- Improved THD+N Performance
- No Degradation of Low-Frequency Response Due to Output Capacitors
- Wide Power Supply Range: 1.8 V to 4.5 V
- 80-mW/Ch Output Power into 16-
at 4.5 V - Independent Right and Left Channel
Shutdown Control - Short-Circuit and Thermal Protection
- Pop Reduction Circuitry
- No Output DC-Blocking Capacitors
- APPLICATIONS
- Notebook Computers
- CD / MP3 Players
- Smart Phones
- Cellular Phones
- PDAs
The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.
The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load
at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have
±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the
right and left audio channels.
The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD™ package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | 80-mW DirectPath(TM) Stereo Headphone Driver datasheet (Rev. E) | 2008年 3月 4日 | |
| Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||
| Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 | ||
| Analog Design Journal | 2Q 2010 Issue Analog Applications Journal | 2010年 5月 6日 | ||
| Analog Design Journal | Precautions for connecting APA outputs to other devices | 2010年 5月 6日 | ||
| EVM User's guide | TPA4411EVM - User Guide (Rev. A) | 2008年 1月 9日 | ||
| More literature | TPA4411_NanoEVM_ Schematic | 2007年 2月 13日 | ||
| More literature | TPA4411_NanoEVM_OV | 2007年 1月 29日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
TPA4411EVM — TPA4411 評估模組 (EVM)
The TPA4411 is a stereo headphone driver evaluation module. The TPA4411 device is designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The evaluation module consists of a TI TPA4411 80-mW audio power amplifier in a small QFN package. It is ideal (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YZH) | 16 | Ultra Librarian |
| WQFN (RTJ) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。