TPA6120A2
- SNR of 128dB A-Weighted.
- THD of 112.5dB
- Current-Feedback Architecture
- Output Voltage Noise of 0.9µVrms at
Gain = 1V/V (16Ω Load) - Power Supply Range: ±5V to ±15V
- 1300V/µs Slew Rate
- Can be configured for Single Ended or Differential
Inputs - Independent Power Supplies for Low Crosstalk
In applications requiring a high-power output, very high fidelity headphone amplifier, the TPA6120A2 replaces a costly discrete design and allows music, not the amplifier, to be heard. The TPA6120A2’s current-feedback AB amplifier architecture delivers high bandwidth, extremely low noise, and up to 128dB of dynamic range.
Three key features make current-feedback amplifiers outstanding for audio. The first feature is the high slew rate that prevents odd order distortion anomalies. The second feature is current-on-demand at the output that enables the amplifier to respond quickly and linearly when necessary without risk of output distortion. When large amounts of output power are suddenly needed, the amplifier can respond extremely quickly without raising the noise floor of the system and degrading the signal-to-noise ratio. The third feature is the gain-independent frequency response that allows the full bandwidth of the amplifier to be used over a wide range of gain settings.
技術文件
設計與開發
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TPA6120A2EVM — TPA6120A2 評估模組 (EVM)
The TPA6120A2 is a Hi-Fi stereo headphone amplifier capable of delivering 1.5 W of continuous RMS power per channel into 32-Ohm speakers with less than 0.0003% THD+N.
TPA6120A2RGYEVM — 採用 QFN 封裝的 TPA6120A2RGYEVM 立體聲道耳機放大器評估模組
The TPA6120A2 is an exceptionally high-performance Hi-Fi stereo headphone amplifier capable of delivering 1.5 W of continuous RMS power per channel into 32-Ohm speakers in a tiny QFP package.
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TIDA-00385 — 適用於可攜式和智慧型手機應用的高保真音訊耳機播放參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HSOIC (DWP) | 20 | Ultra Librarian |
VQFN (RGY) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。