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TPA711

現行

具 BTL 至模式控制的 700-mW、單聲道、類比輸入、AB 類音訊放大器

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產品規格表

TPA711

現行
產品規格表 立即訂購

產品詳細資料

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.7 THD + N at 1 kHz (%) 0.5 Iq (typ) (mA) 1.25 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.7 THD + N at 1 kHz (%) 0.5 Iq (typ) (mA) 1.25 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Output Power
    • 700 mW at VDD = 5 V, BTL, RL = 8
    • 85 mW at VDD = 5 V, SE, RL = 32
    • 250 mW at VDD = 3.3 V, BTL, RL = 8
    • 37 mW at VDD = 3.3 V, SE, RL = 32
  • Shutdown Control
    • IDD = 7 uA at 3.3 V
    • IDD = 50 uA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments.
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Output Power
    • 700 mW at VDD = 5 V, BTL, RL = 8
    • 85 mW at VDD = 5 V, SE, RL = 32
    • 250 mW at VDD = 3.3 V, BTL, RL = 8
    • 37 mW at VDD = 3.3 V, SE, RL = 32
  • Shutdown Control
    • IDD = 7 uA at 3.3 V
    • IDD = 50 uA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments.

The TPA711 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA711 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA711 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to eliminate speaker noise when exiting shutdown mode. The TPA711 is available in an 8-pin SOIC and the surface-mount PowerPAD MSOP package, which reduces board space by 50% and height by 40%.

The TPA711 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA711 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA711 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to eliminate speaker noise when exiting shutdown mode. The TPA711 is available in an 8-pin SOIC and the surface-mount PowerPAD MSOP package, which reduces board space by 50% and height by 40%.
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類型 標題 日期
* Data sheet 700-mW Mono Low-Voltage Audio Power Amplifier datasheet (Rev. D) 2002年 10月 18日
Application note Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 2019年 8月 26日
Application note PowerPAD™ Thermally Enhanced Package (Rev. H) 2018年 7月 6日
EVM User's guide TPA711MSOPEVM - User Guide (Rev. B) 2001年 4月 17日

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開發板

TPA711MSOPEVM — TPA711MSOP 評估模組 (EVM)

A 700-mW mono amplifier that will operate in both bridge-tied load (BTL) and single-ended (SE) modes. This makes the TPA711 ideal for applications that require a mono earphone and speaker. In addition, integrated DEPOP circuitry eliminates speaker noise when the amplifier turns on, off, or exits (...)

使用指南: PDF
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模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
HVSSOP (DGN) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian
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