產品詳細資料

Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 50 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 1 IEC 61000-4-2 contact (±V) 30000 IEC 61000-4-5 (kA) 0.0063 Clamping voltage (V) 6.3 Dynamic resistance (typ) 0.15 Interface type Audio, Ethernet, General purpose, LVDS, USB 2.0 Breakdown voltage (min) (V) 6.4 IO leakage current (max) (nA) 100 Rating Catalog Operating temperature range (°C) -40 to 125
Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 50 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 1 IEC 61000-4-2 contact (±V) 30000 IEC 61000-4-5 (kA) 0.0063 Clamping voltage (V) 6.3 Dynamic resistance (typ) 0.15 Interface type Audio, Ethernet, General purpose, LVDS, USB 2.0 Breakdown voltage (min) (V) 6.4 IO leakage current (max) (nA) 100 Rating Catalog Operating temperature range (°C) -40 to 125
X1SON (DPY) 2 0.6 mm² 1 x 0.6
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±30-kV Contact Discharge
    • ±30-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 6.3 A (8/20 µs)
  • IO Capacitance: 1 pF (Typical)
  • DC Breakdown Voltage: 6.4 V (Typical)
  • Low Leakage Current: 100 nA (Maximum)
  • Extremely Low ESD Clamping Voltage
    • 8.5 V at ±16-A TLP
    • RDYN: 0.15 Ω
  • Industrial Temperature Range: –40°C to +125°C
  • Industry Standard 0402 Package

All trademarks are the property of their respective owners.

  • IEC 61000-4-2 Level 4 ESD Protection
    • ±30-kV Contact Discharge
    • ±30-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 6.3 A (8/20 µs)
  • IO Capacitance: 1 pF (Typical)
  • DC Breakdown Voltage: 6.4 V (Typical)
  • Low Leakage Current: 100 nA (Maximum)
  • Extremely Low ESD Clamping Voltage
    • 8.5 V at ±16-A TLP
    • RDYN: 0.15 Ω
  • Industrial Temperature Range: –40°C to +125°C
  • Industry Standard 0402 Package

All trademarks are the property of their respective owners.

The TPD1E1B04 is a bidirectional TVS ESD protection diode featuring low RDYN and low clamping voltage. The TPD1E1B04 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

The ultra-low dynamic resistance (0.15 Ω) and extremely low clamping voltage (8.5 V at 16-A TLP) ensure system level protection against transient events. This device features a 1-pF IO capacitance making it ideal for protecting interfaces such as USB 2.0.

The TPD1E1B04 is offered in the industry standard 0402 (DPY) package.

The TPD1E1B04 is a bidirectional TVS ESD protection diode featuring low RDYN and low clamping voltage. The TPD1E1B04 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

The ultra-low dynamic resistance (0.15 Ω) and extremely low clamping voltage (8.5 V at 16-A TLP) ensure system level protection against transient events. This device features a 1-pF IO capacitance making it ideal for protecting interfaces such as USB 2.0.

The TPD1E1B04 is offered in the industry standard 0402 (DPY) package.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 6
類型 標題 日期
* Data sheet TPD1E1B04 1-Channel ESD Protection Diode with Low RDYN and Low Clamping Voltage datasheet (Rev. A) PDF | HTML 2016年 6月 10日
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 2024年 1月 11日
Selection guide System-Level ESD Protection Guide (Rev. D) 2022年 9月 7日
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 2022年 8月 18日
Technical article ESD Fundamentals Part 2: IEC 61000-4-2 Rating PDF | HTML 2017年 11月 28日
Technical article The dangers of deep snap-back ESD circuit-protection diodes PDF | HTML 2016年 9月 12日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

ESDEVM — ESD 評估模組

靜電敏感裝置 (ESD) 評估模組 (EVM) 是我們大多數 ESD 產品組合的開發平台。此電路板配備所有傳統 ESD 元件封裝,可測試任意數量的裝置。裝置可以焊接到其相應的元件封裝上,然後進行測試。對於一般高速 ESD 二極體,會實作阻抗控制的配置以取得 S 參數並取消內嵌電路板軌跡。對於非高速 ESD 二極體,其元件封裝會包含連接至測試點的軌跡,讓您輕鬆執行 DC 測試,例如崩潰電壓、保持電壓、洩漏等。電路板配置也可以透過將訊號針腳短路到訊號所在的任何地方,讓任何裝置針腳都能輕鬆地連接到電源 (VCC) 或接地。
使用指南: PDF | HTML
TI.com 無法提供
模擬型號

TPD1E1B04 IBIS Model

SLVMBP5.ZIP (3 KB) - IBIS Model
模擬型號

TPD1E1B04 S-Parameter Model

SLVMBP6.ZIP (29 KB) - IBIS Model
參考設計

TIDA-03026 — 具有 LED 和音效回饋的狀態指示參考設計

The TIDA-03026 reference design functionality emulates status indication subsystems in various end equipments. By putting multiple LED drivers in parallel, an array of RGB LEDs can be synchronized to blink, pulse, and breathe - enhancing customer experience. Audio feedback is also integrated (...)
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
X1SON (DPY) 2 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片