開發模組 (EVM) 的 GUI
TRF372017
- Fully Integrated PLL/VCO and IQ Modulator
- LO Frequency from 300 MHz to 4.8 GHz
- 76-dBc Single-Carrier WCDMA ACPR at –8-dBm
Channel Power - OIP3 of 26 dBm
- P1dB of 11.5 dBm
- Integer/Fractional PLL
- Phase Noise –132 dBc/Hz
(at 1 MHz, fVCO of 2.3 GHz) - Low Noise Floor: –160 dBm/Hz
- Input Reference Frequency Range: Up to
160 MHz - VCO Frequency Divided by 1-2-4-8 Output
- APPLICATIONS
- Wireless Infrastructure
- CDMA: IS95, UMTS, CDMA2000,
TD-SCDMA - TDMA: GSM, IS-136, EDGE/UWC-136
- LTE
- CDMA: IS95, UMTS, CDMA2000,
- Wireless Local Loop
- Point-to-Point Wireless Access
- Wireless MAN Wideband Transceivers
- Wireless Infrastructure
All other trademarks are the property of their respective owners
TRF372017 is a high-performance, direct up-conversion device, integrating a high-linearity, low-noise IQ modulator and an integer-fractional PLL/VCO. The VCO uses integrated frequency dividers to achieve a wide, continuous tuning range of 300 MHz to 4800 MHz. The LO is available as an output with independent frequency dividers. The device also accepts input from an external LO or VCO. The modulator baseband inputs can be biased either internally or externally. Internal DC offset adjustment enables carrier cancellation. The device is controlled through a 3-wire serial programming interface (SPI). A control pin invokes power-save mode to reduce power consumption while keeping the VCO locked for fast start-up.
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使用指南: PDF
開發板
TRF372017EVM — TRF372017 評估模組
The TRF372017EVM is the evaluation module (EVM) designed for testing the performance of the TRF372017 high-performance, integrated quadrature modulator device. The TRF372017 is a direct up-conversion RF device which integrates a highly-linear, low-noise IQ modulator and a wideband (...)
使用指南: PDF
外掛程式
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設計工具
SLWC095 — TRF372017EVM Design Files
支援產品和硬體
產品
IQ 調變器
硬體開發
開發板
參考設計
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電路圖: PDF
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| VQFN (RGZ) | 48 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。
