TS3A5017
- Isolation in the Powered-Down Mode, V+ = 0
- Low ON-State Resistance
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion (THD)
- 2.3-V to 3.6-V Single-Supply Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 1500-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 1500-V Human-Body Model
The TS3A5017 device is a dual single-pole quadruple-throw (4:1) analog switch that is designed to operate from 2.3 V to 3.6 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction.
技術文件
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檢視所有 6 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TS3A5017 Dual SP4T Analog Switch / Multiplexer / Demultiplexer datasheet (Rev. G) | PDF | HTML | 2019年 1月 7日 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
| Application brief | Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) | PDF | HTML | 2021年 1月 6日 | |
| Application note | Preventing Excess Power Consumption on Analog Switches | 2008年 7月 3日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
介面轉接器
LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
使用指南: PDF
介面轉接器
LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
使用指南: PDF
參考設計
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Industrial vibration sensing is crucial part in condition monitoring necessary for predictive maintenance. Integrated Electronic Piezoelectric (IEPE) sensor is the most common vibration sensor used in industrial environment. This design is a full analog front-end for IEPE sensor interface (...)
參考設計
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This 16-button stainless steel keypad, which utilizes TI's inductive touch technology, demonstrates highly sensitive buttons on a single piece of 0.6mm thick stainless steel metal. The design utilizes a MUXed approach to implement many buttons with a single LDC1614. The design is (...)
參考設計
TIDA-00110 — 適用於使用 RTD 的智慧電網應用中的溫度感測的類比前端 (AFE)
This reference design enables up to 4 Resistor Temperature Detectors (RTD) to be connected through one ADC in manner such that the solution is both compact and modular. Communication from the ADC to the processor is though an SPI interface. If 8 RTDs are required for an application, simply connect (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 16 | Ultra Librarian |
| SSOP (DBQ) | 16 | Ultra Librarian |
| TSSOP (PW) | 16 | Ultra Librarian |
| TVSOP (DGV) | 16 | Ultra Librarian |
| UQFN (RSV) | 16 | Ultra Librarian |
| VQFN (RGY) | 16 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。