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功能與所比較的裝置相似
最新 CC3301MOD 預覽 SimpleLink™ Wi-Fi 6 和 Bluetooth® 低功耗配套模組 Upgraded functionality with Wi-Fi 6 and Bluetooth Low Energy

產品詳細資料

Processor External MPU Type Module, Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput UDP (max) (Mbps) 100 Security Networking security (WPA3) Features 2x2 MIMO, 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, STA, Wi-Fi direct mode Certifications CE, FCC, ISED, MIC Operating temperature range (°C) -20 to 70 Rating Catalog
Processor External MPU Type Module, Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput UDP (max) (Mbps) 100 Security Networking security (WPA3) Features 2x2 MIMO, 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, STA, Wi-Fi direct mode Certifications CE, FCC, ISED, MIC Operating temperature range (°C) -20 to 70 Rating Catalog
QFM (MOC) 100 178.22 mm² 13.3 x 13.4
  • General
    • Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
    • Quick hardware design with TI module collateral and reference designs
    • Operating temperature: –20°C to +70°C
    • Small form factor: 13.3 × 13.4 × 2 mm
    • 100-pin MOC package
    • FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
  • Wi-Fi
    • WLAN baseband processor and RF transceiver support of IEEE Std 802.11b, 802.11g, and 802.11n
    • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
    • 2.4-GHz MRC support for extended range
    • Fully calibrated: production calibration not required
    • 4-bit SDIO host interface support
    • Wi-Fi direct concurrent operation (multichannel, multirole)
  • Bluetooth and Bluetooth low energy (WL183xMOD only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support of SBC encoding + A2DP
    • Dual-mode Bluetooth and Bluetooth low energy
    • TI’s Bluetooth and Bluetooth low energy certified stack
  • Key benefits
    • Reduces design overhead
    • Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
    • Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
    • Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
    • Lowest Wi-Fi power consumption in connected idle (< 800 µA)
    • Configurable wake on WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence
  • General
    • Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
    • Quick hardware design with TI module collateral and reference designs
    • Operating temperature: –20°C to +70°C
    • Small form factor: 13.3 × 13.4 × 2 mm
    • 100-pin MOC package
    • FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
  • Wi-Fi
    • WLAN baseband processor and RF transceiver support of IEEE Std 802.11b, 802.11g, and 802.11n
    • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
    • 2.4-GHz MRC support for extended range
    • Fully calibrated: production calibration not required
    • 4-bit SDIO host interface support
    • Wi-Fi direct concurrent operation (multichannel, multirole)
  • Bluetooth and Bluetooth low energy (WL183xMOD only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support of SBC encoding + A2DP
    • Dual-mode Bluetooth and Bluetooth low energy
    • TI’s Bluetooth and Bluetooth low energy certified stack
  • Key benefits
    • Reduces design overhead
    • Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
    • Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
    • Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
    • Lowest Wi-Fi power consumption in connected idle (< 800 µA)
    • Configurable wake on WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

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技術文件

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類型 標題 日期
* Data sheet WL18x1MOD, WL18x5MOD WiLink™ 8 Single-Band Combo Module – Wi-Fi®, Bluetooth®, and Bluetooth Low Energy (LE) datasheet (Rev. N) PDF | HTML 2021年 4月 26日
* Radiation & reliability report WL1835MOD Reliability Data - Reliability Estimate 2017年 7月 27日
Cybersecurity advisory Buffer Overflow in WL18xx MCP Driver (Rev. A) PDF | HTML 2023年 8月 22日
Cybersecurity advisory WiLink WL18xx PN Reuse Issue PDF | HTML 2023年 8月 2日
Application note Antenna Impedance Measurement and Matching PDF | HTML 2022年 3月 22日
Selection guide 無線連線技術選擇指南 (Rev. B) 2022年 3月 7日
User guide WiLink8 Getting Started Guide (Rev. B) PDF | HTML 2021年 12月 20日
User guide WL1835MODCOM8 WLAN MIMO/BT Module Board (Rev. F) PDF | HTML 2021年 12月 17日
Cybersecurity advisory Bluetooth® Low Energy, Basic/Enhanced Data Rate–PIN-Code Pairing Key Derivation 2021年 5月 27日
Cybersecurity advisory FragAttacks - FRagmentation and AGgregation Attacks (Rev. A) 2021年 5月 19日
Certificate WL18MODGB (Test Grade 35: WL1835MODGBMOC) EC DoC (Rev. A) 2021年 3月 3日
White paper WiLink8 Use Case Guide PDF | HTML 2020年 12月 30日
User guide WiLink8 Driver Debug PDF | HTML 2020年 12月 7日
User guide WiLink8 Linux Advanced Demos PDF | HTML 2020年 12月 7日
User guide WiLink8 R8.8 Linux Wi-Fi Driver Release Build User's Guide (Rev. A) PDF | HTML 2020年 10月 27日
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020年 5月 18日
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020年 5月 18日
Product overview Sitara™ processors + WiLink™ 8 Wi-Fi® + Bluetooth® combo connectivity (Rev. A) 2019年 7月 30日
User guide WL18xx Module Hardware Integration Guide (Rev. B) PDF | HTML 2019年 7月 9日
Design guide WL18xx Design Checklist 2019年 6月 27日
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 2019年 1月 7日
User guide WiLink™ 8.0 Bluetooth® Vendor-Specific HCI Commands (Rev. B) 2017年 10月 17日
Application note Secure Connection Capability for WiLink Bluetooth 4.2 2017年 5月 19日
More literature Streamline the challenges of RF design with certified wireless modules 2017年 1月 25日
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans MCP 2016年 12月 28日
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans NLCP 2016年 12月 28日
Application note WiLink 8.0TM WLAN IP Mesh Application Report 2016年 6月 1日
User guide WiLinkT™ 8 WLAN Features User's Guide (Rev. A) PDF | HTML 2016年 5月 26日
White paper Wi-Fi® mesh networks: Discover new wireless paths 2016年 5月 24日
White paper Streaming Audio: Follow the signal chain white paper 2016年 4月 14日
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans 2016年 2月 15日
More literature WiLink 8 Wi-Fi + Bluetooth/BLE Modules (Rev. B) 2016年 2月 3日
Application note Precise Time Synchronization Over WLAN (Rev. A) 2015年 12月 18日
Application note WL18xx .INI File (Rev. A) 2015年 12月 3日
White paper Wi-Fi® audio: capabilities and challenges 2015年 12月 2日
Application note Enhanced HCILL: Four-Wire Power Management Protocol (Rev. B) 2015年 9月 24日
Application note WL18xx Level-shifting I/O (Rev. A) 2015年 8月 19日
Application note WiLink 8 Solutions WiLink8 - wlconf Manual 2015年 7月 1日
White paper Complete solutions for next-generation wireless connected audio 2014年 1月 2日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TMDSEVM437X — AM437x 評估模組

AM437x 評估模組 (EVM) TMDXEVM437X 可讓開發人員立即開始評估 AM437x 處理器系列 (AM4372AM4376AM4377AM4378),並著手建置應用程式,以及加速開發 HMI、工業和網路應用。TMDSEVM437X 開發平台是以 Arm Cortex-A9 處理器為基礎,其與多個選項整合,如 Gigabit 乙太網路、DDR3、2 個攝影機模組,以及 7" 電容式觸控螢幕 LCD 等。

使用指南: PDF
TI.com 無法提供
開發板

TMDSEVM572X — AM572x 評估模組

The AM572x evaluation module provides an affordable platform to quickly start evaluation of Sitara™ Arm® Cortex®-A15 AM57x processors (AM5728AM5726AM5718AM5716) and accelerate development for HMI, machine vision, networking, medical imaging and many other industrial applications. It is a (...)

使用指南: PDF
TI.com 無法提供
開發板

TMDXEVM3358 — AM335x 評估模組

The AM335x Evaluation Module (EVM) enables developers to immediately start evaluating the AM335x processor family (AM3351, AM3352, AM3354, AM3356, AM3358) and begin building applications for factory automation, building automation, grid infrastructure, and more.

使用指南: PDF
TI.com 無法提供
開發板

WL18XXCOM82SDMMC — WL18XXCOM82SDMMC

The WiLink SDIO board is a SDMMC adapter board and is an easy to use connector between a WiLink COM8 Evaluation module [WL1837MODCOM8i and WL1835MODCOM8B] and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO. It also provides (...)

使用指南: PDF
TI.com 無法提供
子卡

WL1835MODCOM8B — WiLink™ 8 模組 2.4 GHz WiFi® + Bluetooth® COM8 評估模組

TI WiLink™ 8 module family

The WL1835MODCOM8 is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5 GHz band and extended temperature range, see the WL1837MODCOM8I.

The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add (...)

使用指南: PDF | HTML
TI.com 無法提供
軟體開發套件 (SDK)

PROCESSOR-SDK-AM335X — 適用於 AM335x Sitara 處理器的處理器 SDK - 支援 Linux 和 TI-RTOS

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)
軟體開發套件 (SDK)

TIBLUETOOTHSTACK-SDK — TI 雙模式 Bluetooth® 堆疊

TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, (...)

使用指南: PDF | HTML
應用軟體及架構

WILINK-BT_WIFI-WIRELESS_TOOLS — 適用於 WL18XX 模組的 WiLink™ 無線工具

此套件包括以下應用程式:
  • WLAN 即時調整工具 (RTTT)
  • Bluetooth® 記錄器
  • WLAN gLogger
  • 連結品質監測器 (LQM)
  • HCITester 工具
    • BTSout
    • BTSTransform
    • ScriptPad

應用程式提供使用主機偵錯及監控 WiLink™ WLAN/Bluetooth/Bluetooth 低耗能韌體、執行 RF 驗證測試、執行法規認證測試的預先測試,以及偵錯硬體與軟體平台整合問題時所需的所有功能。

WLAN 和 Bluetooth 的無線偵錯和校準工具需要四個 UART 連接埠。將這些連接埠驅動至 PC 的最有效方式是使用 UART 至 USB 轉換器。TI 建議使用 (...)

使用指南: PDF | HTML
應用軟體及架構

WILINK-WIFI_MESH_VISUALIZATION_TOOL — 適用於 WL18XX 模組的 WiLink™ Mesh 視覺化工具

Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
使用指南: PDF
驅動程式或資料庫

TI-BT-4-2-STACK-LINUX-ADDON — 支援 WL183x 和 CC2564C 且適用於 Linux 平台的 TI 藍牙 4.2 架構附加元件

This package contains the install package, pre-compiled object of the TI Bluetooth Stack and Platform Manager, and pre-compiled object with source of sample applications to easily upgrade the default LINUX EZSDK Binary on an AM335x EVM. The software was built with Linaro GCC 4.7 and can be added to (...)
驅動程式或資料庫

TI-BT-STACK-LINUX-ADDON — 適用於 AM335x EVM、AM437x EVM 以及具有 WL18xx 和 CC256x 之 BeagleBone 的 TI Bluetooth Linux 外掛程式

This package contains the install package, pre-compiled object and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM or BeagleBone. The software was built with Linaro GCC 4.7 and can be added to Linux SDKs that use (...)
驅動程式或資料庫

WILINK8-WIFI-MCP8 — WiLink™ 8 專有 Wi-Fi 驅動程式 – QNX、WinCE、Nucleus RTOS 基準

The MCP package contains the install package, pre-compiled object and source of the proprietary Wi-Fi Driver - QNX, Nucleus, WinCE as well as ThreadX, FreeRTOS, µC, MQX ,RTX and uITRON RTOS baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported through (...)

使用指南: PDF | HTML
驅動程式或資料庫

WILINK8-WIFI-NLCP WiLink8 NLCP Wi-Fi driver package for Linux OS

WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide

Software block overview:

WL18xx Linux driver uses the open source components along with the interface (...)

支援產品和硬體

支援產品和硬體

產品
Wi-Fi 產品
WL1801 WiLink™8 單頻帶工業 Wi-Fi® 收發器 WL1801MOD WiLink™ 8 單一頻帶 Wi-Fi® 模組 WL1805MOD WiLink™ 8 單一頻帶、2x2 MIMO Wi-Fi® 模組 WL1807MOD WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組 WL1831 WiLink™8 單頻帶工業 Wi-Fi®、藍牙® 和低功耗藍牙收發器 WL1831MOD WiLink™ 8 工業雙頻 Wi-Fi、Bluetooth 和 Bluetooth Smart (低功耗) 模組 WL1835MOD WiLink ™ 8 單一頻帶組合 2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth Smart 模組 WL1837MOD WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組
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驅動程式或資料庫

WL18XX-BT-SP — 適用於 WL18xx 的 Bluetooth Service Pack

The Bluetooth Service Pack is composed of the following four files:

  • BTS file (TIInit_11.8.32.bts)
  • ILI file (TIInit_11.8.32.ili)
  • XML (TIInit_11.8.32.xml)
  • Release Notes Document
  • License Agreement

Note the version in the file name is unique for combination of hardware and firmware, but is not (...)

使用指南: PDF
支援軟體

CLRNX-3P-CLARIFI — Clarinox ClariFi 嵌入式無線偵錯器

ClariFi™ 提供內建通訊協定分析器支援,可加快複雜無線裝置的偵錯速度,並可搭配我們方便使用的 SoftFrame 抽象層中介軟體使用。其提供執行緒、記憶體使用和記憶體洩漏分析。這些工具共同支援應用程式的調整,並有助於溝通問題。使用者可以根據需要新增自訂外掛程式,並透過單一實體媒體使用控制台介面。

 

提供兩種不同的模式。首先,作為進階記錄器,其次,作為使用 ClariFi™ 測試架構在目標裝置上執行測試的互動式工具。測試架構平台為嵌入式開發人員提供自動化測試環境,無需重新編譯即可在目標裝置上快速執行測試。這是透過一個簡單的 Lua 指令碼介面進行,目標裝置會配置為伺服器裝置,回應來自 (...)

從:Clarinox
支援軟體

CLRNX-3P-CLARINOX-BLUE — ClarinoxBlue 嵌入式 Bluetooth® 通訊協定堆疊

ClarinoxBlue™ 通訊協定堆疊是由嵌入式開發人員為嵌入式開發人員所設計。ClarinoxBlue 通訊協定堆疊透過簡單且靈活的方式,讓您能將更多時間花在應用程式上,而不是花在 Bluetooth 技術的內部運作。我們的解決方案專為傳統 Bluetooth (BR/EDR) 和 Bluetooth 低耗能設計,可解決工程師在 Bluetooth 專案中面臨的主要問題:缺乏彈性、增加偵錯複雜性和難度。ClarinoxBlue 通訊協定堆疊擁有優異的彈性與可攜性,可成功管理複雜性並簡化偵錯工作,讓您的下一個 Bluetooth 專案變得更加容易!
從:Clarinox
支援軟體

CLRNX-3P-CLARINOX-WIFI — ClarinoxWiFi 嵌入式 Wi-Fi 通訊協定堆疊

ClarinoxWiFi 是經過驗證的 Wi-Fi 通訊協定堆疊,具有 AP、STA、P2P 和 Mesh 角色,同時也支援多種不同的 RTOS/MCU。ClarinoxWiFi 讓開發人員能夠為各種無線嵌入式應用建立可靠且高性能的 Wi-Fi 連線。

 

十多年來,Clarinox 一直與國內和國際客戶合作開發突破性的無線嵌入式產品。我們運用我們的經驗,為一系列嵌入式平台實作了 IEEE802.11a/b/g/n、AP、STA、P2P 和 GO。您已經歷了艱難的過程,Clarinox 能讓您下一個嵌入式 WiFi 專案變得更容易。

從:Clarinox
認證

WL18XX-CERTIFICATION — WiLink™ 8 的無線電認證

您是否正在尋找 WiLink™ 8 模組認證支援?WL18XX-CERTIFCATION 可為您的產品成功認證提供相關資訊和支援。在此頁面中,您會找到我們模組及評估電路板的最新認證報告。
認證

WL18XX-REPORTS Reports: WL18XX Regulatory Certification Reports

Are you looking for WiLink™ 8 module certification support? WL18XX-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
支援產品和硬體

支援產品和硬體

產品
Wi-Fi 產品
WL1801MOD WiLink™ 8 單一頻帶 Wi-Fi® 模組 WL1805MOD WiLink™ 8 單一頻帶、2x2 MIMO Wi-Fi® 模組 WL1807MOD WiLink™ 8 工業雙頻組合、2x2 MIMO Wi-Fi 模組 WL1831MOD WiLink™ 8 工業雙頻 Wi-Fi、Bluetooth 和 Bluetooth Smart (低功耗) 模組 WL1835MOD WiLink ™ 8 單一頻帶組合 2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth Smart 模組 WL1837MOD WiLink ™ 8 工業雙頻、2x2 MIMO Wi-Fi®、Bluetooth® 和 Bluetooth 智慧模組
硬體開發
子卡
WL1835MODCOM8B WiLink™ 8 模組 2.4 GHz WiFi® + Bluetooth® COM8 評估模組 WL1837MODCOM8I WiLink™ 8 雙頻 2.4 和 5 GHz Wi-Fi® + 藍牙® COM8 評估模組
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設計工具

WILINK-DESIGN-REVIEWS — 適用於 WL18xx 裝置的硬體設計審查

To get started with the WiLink™ hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see WL18xx product page links below).
  • Step 2: Download and (...)
使用指南: PDF | HTML
參考設計

TIDC-WL1837MOD-AUDIO-MULTIROOM-CAPE — TI WiLink™8 Wi-Fi®/Bluetooth®/低功耗藍牙音效多空間 Cape 參考設計

The TI WiLink™ 8 WL1837MOD audio cape is a wireless multi-room audio reference design used with BeagleBone Black (featuring TI Sitara™ AM335x). The WiLink 8 device's WLAN capability to capture and register precise arrival time of the connected AP's beacon is used to achieve ultra-precise (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDC-WL1835MODCOM8B — WiLink™ 1835 模組上的 2.4 GHz WiFi® + Bluetooth® 認證天線設計

The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way it's been certified. Through this, customers are able to evaluate the performance of the module through (...)
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
QFM (MOC) 100 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

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