SN54BCT244

AKTIV

8-Kanal-Puffer, 4,5 bis 5,5 V mit Tri-State-Ausgängen für die Rüstungsindustrie

Produktdetails

Technology family BCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 64 Supply current (max) (µA) 80000 IOH (max) (mA) -15 Input type Bipolar Output type 3-State Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Military Operating temperature range (°C) -55 to 125
Technology family BCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 64 Supply current (max) (µA) 80000 IOH (max) (mA) -15 Input type Bipolar Output type 3-State Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
  • P-N-P Inputs Reduce DC Loading
  • ESD Protection Exceeds 2000 V
    Per MIL-STD-883C, Method 3015
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (J, N)
  • State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
  • P-N-P Inputs Reduce DC Loading
  • ESD Protection Exceeds 2000 V
    Per MIL-STD-883C, Method 3015
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (J, N)

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ´BCT240 and ´BCT241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical (active-low output-enable) inputs, and complementary OE and inputs.

The ´BCT244 is organized as two 4-bit buffers/line drivers with separate output-enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The SN54BCT244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT244 is characterized for operation from 0°C to 70°C.

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ´BCT240 and ´BCT241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical (active-low output-enable) inputs, and complementary OE and inputs.

The ´BCT244 is organized as two 4-bit buffers/line drivers with separate output-enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The SN54BCT244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT244 is characterized for operation from 0°C to 70°C.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet Octal Buffers/Drivers With 3-State Outputs datasheet (Rev. E) 01 Apr 1994
* SMD SN54BCT244 SMD 5962-90625 21 Jun 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Okt 1996
Application note Live Insertion 01 Okt 1996

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
CDIP (J) 20 Ultra Librarian
CFP (W) 20 Ultra Librarian
LCCC (FK) 20 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
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  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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