SN74AUC1G06

AKTIV

Einzelner 0,8-V- bis 2,7-V-Hochgeschwindigkeitswechselrichter mit Open-Drain-Ausgängen

Produktdetails

Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Number of channels 1 IOL (max) (mA) 9 IOH (max) (mA) 0 Supply current (max) (µA) 10 Input type Standard CMOS Output type Open-drain Features Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Number of channels 1 IOL (max) (mA) 9 IOH (max) (mA) 0 Supply current (max) (µA) 10 Input type Standard CMOS Output type Open-drain Features Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YZP) 5 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1
  • Available in the Texas Instruments NanoStar™ and NanoFree™ Packages
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 2.5 ns at 1.8 V
  • Low Power Consumption, 10-µA Max ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoStar, NanoFree are trademarks of Texas Instruments.

  • Available in the Texas Instruments NanoStar™ and NanoFree™ Packages
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 2.5 ns at 1.8 V
  • Low Power Consumption, 10-µA Max ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoStar, NanoFree are trademarks of Texas Instruments.

This single inverter buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The output of the SN74AUC1G06 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.

This single inverter buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The output of the SN74AUC1G06 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.

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Technische Dokumentation

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Alle anzeigen 17
Typ Titel Datum
* Data sheet Single Inverter Buffer/Driver With Open-Drain Output datasheet (Rev. M) 02 Feb 2007
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Designing With TI Ultra-Low-Voltage CMOS (AUC) Octals and Widebus Devices 21 Mär 2003
User guide AUC Data Book, January 2003 (Rev. A) 01 Jan 2003
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mär 2002
More literature AUC Product Brochure (Rev. A) 18 Mär 2002

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

5-8-LOGIC-EVM — Generisches Logik-Evaluierungsmodul für 5- bis 8-polige DCK-, DCT-, DCU-, DRL- und DBV-Gehäuse

Flexibles EVM zur Unterstützung aller Geräte mit 5- bis 8-poligem DCK-, DCT-, DCU-, DRL- oder DBV-Gehäuse.
Benutzerhandbuch: PDF
Simulationsmodell

HSPICE Model of SN74AUC1G06

SCEJ129.ZIP (40 KB) - HSpice Model
Simulationsmodell

SN74AUC1G06 Behavioral SPICE Model

SCEM728.ZIP (7 KB) - PSpice Model
Simulationsmodell

SN74AUC1G06 IBIS Model (Rev. A)

SCEM221A.ZIP (41 KB) - IBIS Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
DSBGA (YZP) 5 Ultra Librarian
SOT-23 (DBV) 5 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian

Bestellen & Qualität

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  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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