SN74LVT16240

Name: SN74LVT16240
Brand: TI
SKU: SN74LVT16240
Price: 0.683 USD

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16-Kanal-Wechselrichter, 2,7 bis 3,6 V, mit TTL-kompatiblen CMOS-Eingängen und Tri-State-Ausgängen

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Datenblatt

document-pdfAcrobat SN54LVT16240, SN74LVT16240 datasheet (Rev. A) (Englisch)

SN74LVT16240

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Datenblatt

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Produktdetails

Technology family

LVT

Supply voltage (min) (V)

2.7

Supply voltage (max) (V)

3.6

Number of channels

16

IOL (max) (mA)

64

IOH (max) (mA)

-32

Supply current (max) (µA)

5000

Input type

TTL-Compatible CMOS

Output type

3-State

Features

Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns)

Rating

Catalog

Operating temperature range (°C)

-40 to 85

Technology family

LVT

Supply voltage (min) (V)

2.7

Supply voltage (max) (V)

3.6

Number of channels

16

IOL (max) (mA)

64

IOH (max) (mA)

-32

Supply current (max) (µA)

5000

Input type

TTL-Compatible CMOS

Output type

3-State

Features

Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns)

Rating

Catalog

Operating temperature range (°C)

-40 to 85

SSOP (DL)

48

164.358 mm² 15.88 x 10.35

TSSOP (DGG)

48

101.25 mm² 12.5 x 8.1

Members of the Texas Instruments Widebus™ Family
State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V V_CC)
Support Unregulated Battery Operation Down to 2.7 V
Typical V_OLP (Output Ground Bounce) <0.8 V at V_CC = 3.3 V, T_A = 25°C
I_off and Power-Up 3-State Support Hot Insertion
Distributed V_CC and GND Pins Minimize High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB Layout
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus is a trademark of Texas Instruments.

Members of the Texas Instruments Widebus™ Family
State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V V_CC)
Support Unregulated Battery Operation Down to 2.7 V
Typical V_OLP (Output Ground Bounce) <0.8 V at V_CC = 3.3 V, T_A = 25°C
I_off and Power-Up 3-State Support Hot Insertion
Distributed V_CC and GND Pins Minimize High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB Layout
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus is a trademark of Texas Instruments.

The 'LVT16240 devices are 16-bit buffers and line drivers designed specifically for low-voltage (3.3-V) V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The devices provide inverting outputs and symmetrical active-low output-enable (OE) inputs.

When V_CC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The SN54LVT16240 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT16240 is characterized for operation from -40°C to 85°C.

The 'LVT16240 devices are 16-bit buffers and line drivers designed specifically for low-voltage (3.3-V) V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The devices provide inverting outputs and symmetrical active-low output-enable (OE) inputs.

When V_CC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The SN54LVT16240 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT16240 is characterized for operation from -40°C to 85°C.

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Alle anzeigen 16

	Typ	Titel	Datum
*	Data sheet	SN54LVT16240, SN74LVT16240 datasheet (Rev. A)	01 Nov 2006
	Application note	Implications of Slow or Floating CMOS Inputs (Rev. E)	26 Jul 2021
	Selection guide	Logic Guide (Rev. AB)	12 Jun 2017
	Application note	Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)	02 Dez 2015
	User guide	LOGIC Pocket Data Book (Rev. B)	16 Jan 2007
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection	08 Jul 2004
	Application note	TI IBIS File Creation, Validation, and Distribution Processes	29 Aug 2002
	Application note	16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)	22 Mai 2002
	Application note	Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices	10 Mai 2002
	Selection guide	Advanced Bus Interface Logic Selection Guide	09 Jan 2001
	Application note	LVT-to-LVTH Conversion	08 Dez 1998
	Application note	LVT Family Characteristics (Rev. A)	01 Mär 1998
	Application note	Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)	01 Aug 1997
	Application note	Input and Output Characteristics of Digital Integrated Circuits	01 Okt 1996
	Application note	Live Insertion	01 Okt 1996
	Application note	Understanding Advanced Bus-Interface Products Design Guide	01 Mai 1996

Design und Entwicklung

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