SN74LVTH125

Name: SN74LVTH125
Brand: TI
SKU: SN74LVTH125
Price: 0.36 USD

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4-Kanal-Puffer, 2,7 bis 3,6 V mit Bus-Hold, TTL-kompatiblen CMOS-Eingängen und Tri-State-Ausgängen

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Datenblatt

document-pdfAcrobat SN54LVTH125, SN74LVTH125 datasheet (Rev. I) (Englisch)

SN74LVTH125

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Datenblatt

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Produktdetails

Technology family

LVT

Supply voltage (min) (V)

2.7

Supply voltage (max) (V)

3.6

Number of channels

4

IOL (max) (mA)

64

Supply current (max) (µA)

7000

IOH (max) (mA)

-32

Input type

TTL-Compatible CMOS

Output type

3-State

Features

Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns)

Rating

Catalog

Operating temperature range (°C)

-40 to 85

Technology family

LVT

Supply voltage (min) (V)

2.7

Supply voltage (max) (V)

3.6

Number of channels

4

IOL (max) (mA)

64

Supply current (max) (µA)

7000

IOH (max) (mA)

-32

Input type

TTL-Compatible CMOS

Output type

3-State

Features

Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns)

Rating

Catalog

Operating temperature range (°C)

-40 to 85

SOIC (D)

14

51.9 mm² 8.65 x 6

SOP (NS)

14

79.56 mm² 10.2 x 7.8

SSOP (DB)

14

48.36 mm² 6.2 x 7.8

TSSOP (PW)

14

32 mm² 5 x 6.4

TVSOP (DGV)

14

23.04 mm² 3.6 x 6.4

VQFN (RGY)

14

12.25 mm² 3.5 x 3.5

Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V V_CC)
Support Unregulated Battery Operation Down to 2.7 V
Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
I_off and Power-Up 3-State Support Hot Insertion
Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
Latch-Up Performance Exceeds 500 mA Per JESD 17
ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)

Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V V_CC)
Support Unregulated Battery Operation Down to 2.7 V
Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
I_off and Power-Up 3-State Support Hot Insertion
Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
Latch-Up Performance Exceeds 500 mA Per JESD 17
ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)

These bus buffers are designed specifically for low-voltage (3.3-V) V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The ’LVTH125 devices feature independent line drivers with 3-state outputs. Each output is in the high-impedance state when the associated output-enable (OE)\ input is high.

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When V_CC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

These bus buffers are designed specifically for low-voltage (3.3-V) V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The ’LVTH125 devices feature independent line drivers with 3-state outputs. Each output is in the high-impedance state when the associated output-enable (OE)\ input is high.

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When V_CC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

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Alle anzeigen 18

	Typ	Titel	Datum
*	Data sheet	SN54LVTH125, SN74LVTH125 datasheet (Rev. I)	13 Okt 2003
	Application note	Implications of Slow or Floating CMOS Inputs (Rev. E)	26 Jul 2021
	Application note	An Overview of Bus-Hold Circuit and the Applications (Rev. B)	17 Sep 2018
	Selection guide	Logic Guide (Rev. AB)	12 Jun 2017
	Application note	Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)	02 Dez 2015
	User guide	LOGIC Pocket Data Book (Rev. B)	16 Jan 2007
	Application note	Simultaneous-Switching Performance of TI Logic Devices (Rev. B)	23 Feb 2005
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection	08 Jul 2004
	Application note	TI IBIS File Creation, Validation, and Distribution Processes	29 Aug 2002
	Application note	16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)	22 Mai 2002
	Application note	Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices	10 Mai 2002
	Selection guide	Advanced Bus Interface Logic Selection Guide	09 Jan 2001
	Application note	LVT-to-LVTH Conversion	08 Dez 1998
	Application note	LVT Family Characteristics (Rev. A)	01 Mär 1998
	Application note	Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)	01 Aug 1997
	Application note	Input and Output Characteristics of Digital Integrated Circuits	01 Okt 1996
	Application note	Live Insertion	01 Okt 1996
	Application note	Understanding Advanced Bus-Interface Products Design Guide	01 Mai 1996

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

14-24-LOGIC-EVM — Generisches Logikprodukt-Evaluierungsmodul für 14-polige bis 24-polige D-, DB-, DGV-, DW-, DYY-, NS-

Das 14-24-LOGIC-EVM-Evaluierungsmodul (EVM) ist für die Unterstützung aller Logikgeräte konzipiert, die sich in einem 14-Pin- bis 24-Pin-D-, DW-, DB-, NS-, PW-, DYY- oder DGV-Gehäuse befinden.

Benutzerhandbuch: PDF | HTML

Nicht verfügbar auf TI.com

Evaluierungsplatine

14-24-NL-LOGIC-EVM — Generisches Logikprodukt-Evaluierungsmodul für 14- bis 24-polige bleifreie Gehäuse

14-24-NL-LOGIC-EVM ist ein flexibles Evaluierungsmodul (EVM), das alle Logik- oder Übersetzungsbausteine mit einem 14- bis 24-poligen BQA-, BQB-, RGY-, RSV-, RJW- oder RHL-Gehäuse unterstützt.

Benutzerhandbuch: PDF | HTML

Nicht verfügbar auf TI.com

Simulationsmodell

SN74LVTH125 Behavioral SPICE Model

SCBM115.ZIP (7 KB) - PSpice Model

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Simulationsmodell

SN74LVTH125 IBIS Model

SCEM176.ZIP (16 KB) - IBIS Model

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Gehäuse	Pins	CAD-Symbole, Footprints und 3D-Modelle
SOIC (D)	14	Ultra Librarian
SOP (NS)	14	Ultra Librarian
SSOP (DB)	14	Ultra Librarian
TSSOP (PW)	14	Ultra Librarian
TVSOP (DGV)	14	Ultra Librarian
VQFN (RGY)	14	Ultra Librarian

Es gelten die allgemeinen Geschäftsbedingungen von TI für Evaluierungsartikel.

SN74LVTH125

4-Kanal-Puffer, 2,7 bis 3,6 V mit Bus-Hold, TTL-kompatiblen CMOS-Eingängen und Tri-State-Ausgängen

SN74LVTH125

Produktdetails

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Technische Dokumentation

Design und Entwicklung

14-24-LOGIC-EVM — Generisches Logikprodukt-Evaluierungsmodul für 14-polige bis 24-polige D-, DB-, DGV-, DW-, DYY-, NS-

14-24-NL-LOGIC-EVM — Generisches Logikprodukt-Evaluierungsmodul für 14- bis 24-polige bleifreie Gehäuse

SN74LVTH125 Behavioral SPICE Model

SN74LVTH125 IBIS Model

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