Produktdetails

DSP type 3 C64x+ DSP (max) (MHz) 850, 1000, 1200 CPU 32-/64-bit Operating system DSP/BIOS Ethernet MAC 10/100/1000 Rating Catalog Operating temperature range (°C) -40 to 100
DSP type 3 C64x+ DSP (max) (MHz) 850, 1000, 1200 CPU 32-/64-bit Operating system DSP/BIOS Ethernet MAC 10/100/1000 Rating Catalog Operating temperature range (°C) -40 to 100
FCBGA (CUN) 561 529 mm² 23 x 23
  • Key Features
    • High-Performance Multicore DSP (C6474)
    • Instruction Cycle Time: 0.83 ns (1.2-GHz Device); 1 ns (1-GHz Device); 1.18 ns (850-MHz Device)
    • Clock Rate: 1 GHz to 1.2 GHz (1.2-GHz Device); 1 GHz (1-GHz Device); 850 MHz (850-MHz Device)
    • Commercial Temperature and Extended Tmperature
    • 3 TMS320C64x+™ DSP Cores; Six RSAs for CDMA Processing (2 per core)
    • Enhanced VCP2/TCP2
    • Frame Synchronization Interface
    • 16-/32-Bit DDR2-667 Memory Controller
    • EDMA3 Controller
    • Antenna Interface
    • Two 1x Serial RapidIO® Links, v1.2 Compliant
    • One 1.8-V Inter-Integrated Circuit (I2C) Bus
    • Two 1.8-V McBSPs
    • 1000 Mbps Ethernet MAC (EMAC)
    • Six 64-Bit General-Purpose Timers
    • 16 General-Purpose I/O (GPIO) Pins
    • Internal Semaphore Module non-UMTS Systems
    • System PLL and PLL Controller/DDR PLL and PLL Controller, Dedicated to DDR2 Memory Controller
  • High-Performance Multicore DSP (C6474)
    • Instruction Cycle Time:
      • 1.2-GHz Device: 1.0-ns to 0.83-ns
      • 1-GHz Device: 1-ns
      • 850-MHz Device: 1.18 ns
    • Clock Rate:
      • 1.2-GHz Device: 1-GHz to 1.2-GHz
      • 1-GHz Device: 1-GHz
      • 850-MHz Device: 850 MHz
    • Eight 32-Bit Instructions/Cycle
    • Commercial Temperature:
      • 1.2-GHz Device: 0°C to 95°C
      • 1-GHz Device: 0°C to 100°C
      • 850-MHZ and 1-GHz Device: 0°C to 100°C
    • Extended Temperature:
      • 1.2-GHz Device: -40°C to 95°C(1)
      • 1-GHz Device: -40°C to 100°C
  • 3 TMS320C64x+™ DSP Cores
    • Dedicated SPLOOP Instructions
    • Compact Instructions (16-Bit)
    • Exception Handling
  • TMS320C64x+ Megamodule L1/L2 Memory Architecture
    • 256 K-Bit (32 K-Byte) L1P Program Cache [Direct Mapped]
    • 256 K-Bit (32 K-Byte) L1D Data Cache [2-Way Set-Associative]
    • 512 K-Bit (64 K-Byte) L3 ROM
  • Enhanced VCP2
    • Supports Over 694 7.95-Kbps AMR
  • Enhanced Turbo Decoder Coprocessor (TCP2)
    • Supports up to Eight 2-Mbps 3 GPP (6 Iterations)
  • Endianness: Little Endian, Big Endian
  • Frame Synchronization Interface
    • Time Alignment Between Internal Subsystems, External Devices/System
    • OBSAI RP1 Compliant for Frame Burst Data
    • Alternate Interfaces for non-RP1 and non-UMTS Systems
  • 16-/32-Bit DDR2-667 Memory Controller
  • EDMA3 Controller (64 Independent Channels)
  • Antenna Interface
    • 6 Configurable Links (Full Duplex)
    • Supports OBSAI RP3 Protocol, v1.0: 768-Mbps, 1.536-, 3.072-Gbps Link Rates
    • Supports CPRI Protocol V2.0:614.4-Mbps, 1.2288-, 2.4576-Gbps Link Rates
    • Clock Input Independent or Shared with CPU (Selectable at Boot-Time)
  • Two 1x Serial RapidIO® Links, v1.2 Compliant
    • 1.25-, 2.5-, 3.125-Gbps Link Rates
    • Message Passing and DirectIO Support
    • Error Management Extensions and Congestion Control
  • One 1.8-V Inter-Integrated Circuit (I2C) Bus
  • Two 1.8-V McBSPs
  • 1000 Mbps Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant
    • Supports SGMII, v1.8 Compliant
    • 8 Independent Transmit (TX) and 8 Independent Receive (RX) Channels
  • Six 64-Bit General-Purpose Timers
    • Configurable up to Twelve 32-Bit Timers
    • Configurable in a Watchdog Timer mode
  • 16 General-Purpose I/O (GPIO) Pins
  • Internal Semaphore Module
    • Software Method to Control Access to Shared Resources
    • 32 General Purpose Semaphore Resources
  • System PLL and PLL Controller
  • DDR PLL and PLL Controller, Dedicated to DDR2 Memory Controller
  • IEEE-1149.1 and IEEE-1149.6 (JTAG™) Boundary-Scan-Compatible
  • 561-Pin Ball Grid Array (BGA) Packages (CUN, GUN, or ZUN Suffix), 0.8-mm Ball Pitch
  • 0.065-µm/7-Level Cu Metal Process (CMOS)
  • SmartReflex™ Class 0 Enabled - 0.9-V to 1.2-V Adaptive Core Voltage
  • 1.8-V, 1.1-V I/Os

(1)Note: Advance Information is presented in this document for the C6474 1.2-GHz extended temperature device.

All trademarks are the property of their respective owners.

  • Key Features
    • High-Performance Multicore DSP (C6474)
    • Instruction Cycle Time: 0.83 ns (1.2-GHz Device); 1 ns (1-GHz Device); 1.18 ns (850-MHz Device)
    • Clock Rate: 1 GHz to 1.2 GHz (1.2-GHz Device); 1 GHz (1-GHz Device); 850 MHz (850-MHz Device)
    • Commercial Temperature and Extended Tmperature
    • 3 TMS320C64x+™ DSP Cores; Six RSAs for CDMA Processing (2 per core)
    • Enhanced VCP2/TCP2
    • Frame Synchronization Interface
    • 16-/32-Bit DDR2-667 Memory Controller
    • EDMA3 Controller
    • Antenna Interface
    • Two 1x Serial RapidIO® Links, v1.2 Compliant
    • One 1.8-V Inter-Integrated Circuit (I2C) Bus
    • Two 1.8-V McBSPs
    • 1000 Mbps Ethernet MAC (EMAC)
    • Six 64-Bit General-Purpose Timers
    • 16 General-Purpose I/O (GPIO) Pins
    • Internal Semaphore Module non-UMTS Systems
    • System PLL and PLL Controller/DDR PLL and PLL Controller, Dedicated to DDR2 Memory Controller
  • High-Performance Multicore DSP (C6474)
    • Instruction Cycle Time:
      • 1.2-GHz Device: 1.0-ns to 0.83-ns
      • 1-GHz Device: 1-ns
      • 850-MHz Device: 1.18 ns
    • Clock Rate:
      • 1.2-GHz Device: 1-GHz to 1.2-GHz
      • 1-GHz Device: 1-GHz
      • 850-MHz Device: 850 MHz
    • Eight 32-Bit Instructions/Cycle
    • Commercial Temperature:
      • 1.2-GHz Device: 0°C to 95°C
      • 1-GHz Device: 0°C to 100°C
      • 850-MHZ and 1-GHz Device: 0°C to 100°C
    • Extended Temperature:
      • 1.2-GHz Device: -40°C to 95°C(1)
      • 1-GHz Device: -40°C to 100°C
  • 3 TMS320C64x+™ DSP Cores
    • Dedicated SPLOOP Instructions
    • Compact Instructions (16-Bit)
    • Exception Handling
  • TMS320C64x+ Megamodule L1/L2 Memory Architecture
    • 256 K-Bit (32 K-Byte) L1P Program Cache [Direct Mapped]
    • 256 K-Bit (32 K-Byte) L1D Data Cache [2-Way Set-Associative]
    • 512 K-Bit (64 K-Byte) L3 ROM
  • Enhanced VCP2
    • Supports Over 694 7.95-Kbps AMR
  • Enhanced Turbo Decoder Coprocessor (TCP2)
    • Supports up to Eight 2-Mbps 3 GPP (6 Iterations)
  • Endianness: Little Endian, Big Endian
  • Frame Synchronization Interface
    • Time Alignment Between Internal Subsystems, External Devices/System
    • OBSAI RP1 Compliant for Frame Burst Data
    • Alternate Interfaces for non-RP1 and non-UMTS Systems
  • 16-/32-Bit DDR2-667 Memory Controller
  • EDMA3 Controller (64 Independent Channels)
  • Antenna Interface
    • 6 Configurable Links (Full Duplex)
    • Supports OBSAI RP3 Protocol, v1.0: 768-Mbps, 1.536-, 3.072-Gbps Link Rates
    • Supports CPRI Protocol V2.0:614.4-Mbps, 1.2288-, 2.4576-Gbps Link Rates
    • Clock Input Independent or Shared with CPU (Selectable at Boot-Time)
  • Two 1x Serial RapidIO® Links, v1.2 Compliant
    • 1.25-, 2.5-, 3.125-Gbps Link Rates
    • Message Passing and DirectIO Support
    • Error Management Extensions and Congestion Control
  • One 1.8-V Inter-Integrated Circuit (I2C) Bus
  • Two 1.8-V McBSPs
  • 1000 Mbps Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant
    • Supports SGMII, v1.8 Compliant
    • 8 Independent Transmit (TX) and 8 Independent Receive (RX) Channels
  • Six 64-Bit General-Purpose Timers
    • Configurable up to Twelve 32-Bit Timers
    • Configurable in a Watchdog Timer mode
  • 16 General-Purpose I/O (GPIO) Pins
  • Internal Semaphore Module
    • Software Method to Control Access to Shared Resources
    • 32 General Purpose Semaphore Resources
  • System PLL and PLL Controller
  • DDR PLL and PLL Controller, Dedicated to DDR2 Memory Controller
  • IEEE-1149.1 and IEEE-1149.6 (JTAG™) Boundary-Scan-Compatible
  • 561-Pin Ball Grid Array (BGA) Packages (CUN, GUN, or ZUN Suffix), 0.8-mm Ball Pitch
  • 0.065-µm/7-Level Cu Metal Process (CMOS)
  • SmartReflex™ Class 0 Enabled - 0.9-V to 1.2-V Adaptive Core Voltage
  • 1.8-V, 1.1-V I/Os

(1)Note: Advance Information is presented in this document for the C6474 1.2-GHz extended temperature device.

All trademarks are the property of their respective owners.

The TMS320C64x+ DSPs (including the TMS320C6474 device) are the highest-performance multicore DSP generation in the TMS320C6000™ DSP platform.

The C6474 device is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI).

The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform.

The TMS320C64x+ DSPs (including the TMS320C6474 device) are the highest-performance multicore DSP generation in the TMS320C6000™ DSP platform.

The C6474 device is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI).

The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform.

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Technische Dokumentation

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Alle anzeigen 48
Typ Titel Datum
* Data sheet TMS320C6474 Multicore Digital Signal Processor Data Manual datasheet (Rev. H) 11 Apr 2011
* Errata TMS320C6474 DSP Silicon Errata (Silicon Revisions 2.1, 1.3, 1.2) (Rev. C) 11 Mär 2011
Application note How to Migrate CCS 3.x Projects to the Latest CCS (Rev. A) PDF | HTML 19 Mai 2021
User guide SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 01 Jun 2020
Application note Error Detection and Correction Mechanism of TMS320C64x+/C674x (Rev. A) 19 Jul 2013
More literature Picture it: DSPs in medical imaging (Rev. C) 12 Jul 2013
Application note Multicore Programming Guide (Rev. B) 29 Aug 2012
User guide TMS320C6474 DSP EMAC/MDIO Module Reference Guide (Rev. B) 02 Mär 2012
Application note Introduction to TMS320C6000 DSP Optimization 06 Okt 2011
User guide TMS320C6474 DSP Enhanced DMA (EDMA3) Controller User's Guide (Rev. B) 01 Jul 2011
User guide Bootloader User's Guide for the TMS320C645x/C647x DSP (Rev. G) 03 Jun 2011
User guide TMS320C6474 DSP DDR2 Memory Controller User's Guide (Rev. D) 02 Jun 2011
Application note Tuning VCP2 and TCP2 Bit Error Rate Performance 11 Feb 2011
User guide TMS320C6474 Serial RapidIO (SRIO) User's Guide (Rev. D) 03 Feb 2011
Application note TMS320C6474 Hardware Design Guide (Rev. B) 03 Aug 2010
User guide TMS320C64x+ DSP Megamodule Reference Guide (Rev. K) 03 Aug 2010
User guide TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (Rev. J) 30 Jul 2010
User guide TMS320C6474 DSP Multichannel Buffered Serial Port (McBSP) User's Guide (Rev. A) 18 Mai 2010
User guide TMS320C6474 DSP Viterbi-Decoder Coprocessor 2 Reference Guide (Rev. B) 08 Dez 2009
User guide TMS320C6474 DSP Inter-Integrated Circuit (I2C) Module User's Guide (Rev. A) 28 Okt 2009
Application note Connecting Antenna Interface (AIF) With TDM Bridge Chip (IDT 80HFC001) 28 Aug 2009
Application note Direct I/O Library 28 Aug 2009
Application note Using the TMS320C6474 Antenna Interface (AIF) for Inter-DSP Communication 28 Aug 2009
Application note TMS320C6474 DDR2 Implementation Guidelines (Rev. A) 04 Aug 2009
Application note How to Approach Inter-Core Communication on TMS320C6474 27 Jan 2009
Application note Inter-Core Communication on TMS320C6474 12 Jan 2009
Application note TPS40197 Reference Design 17 Dez 2008
White paper See the difference:DSPs in medical imaging 31 Okt 2008
Application note Migrating from TMS320C6455 to TMS320C6474 14 Okt 2008
Application note TMS320C6474 Power Consumption Summary 14 Okt 2008
User guide TMS320C6474 Antenna Interface User's Guide 14 Okt 2008
Application note TMS320C6474 Common Bus Architecture (CBA) Throughput 14 Okt 2008
User guide TMS320C6474 DSP 64-Bit Timer User's Guide 14 Okt 2008
User guide TMS320C6474 DSP Chip Interrupt Controller (CIC) User's Guide 14 Okt 2008
User guide TMS320C6474 DSP General-Purpose Input/Output (GPIO) User's Guide 14 Okt 2008
User guide TMS320C6474 DSP Power/Sleep Controller (PSC) User’s Guide 14 Okt 2008
User guide TMS320C6474 DSP Software-Programmable Phase-Locked Loop (PLL) Controller UG 14 Okt 2008
User guide TMS320C6474 DSP Turbo-Decoder Coprocessor 2 (TCP2) Reference Guide 14 Okt 2008
User guide TMS320C6474 Frame Synchronization User's Guide 14 Okt 2008
Application note TMS320C6474 Module Throughput Application Report 14 Okt 2008
Application note TMS320C6474 Multicore Digital Signal Processor Technical Brief 14 Okt 2008
Application note TMS320C6474 SERDES Implementation Guidelines 14 Okt 2008
User guide TMS320C6474 Semaphore User's Guide 14 Okt 2008
Application note C6474 (x4) Power Using Modules 01 Okt 2008
Application note C6474 (x2) Power Using Modules 30 Sep 2008
Application note Migrating from EDMA v2.0 to EDMA v3.0 TMS320C64X DSP (Rev. A) 21 Aug 2008
Application note Migrating from TMS320C64x to TMS320C64x+ (Rev. A) 20 Okt 2005
User guide High-Speed DSP Systems Design Reference Guide 20 Mai 2005

Design und Entwicklung

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TMDSEMU560V2STM-UE — XDS560v2 System-Trace-USB-und Ethernet-Debug-Tastkopf

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

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C6474SWPKG — TMS320C6474-Software

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Chip Support Library (CSL) - Provides an application programming interface (API) used for configuring and controlling the DSP on-chip peripherals for ease of use and hardware abstraction.

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LINUXMCSDK Linux MCSDK for C66x, C647x and C645x

NOTE: K2x, C665x and C667x devices are now actively maintained on the Processor-SDK release stream. See links above.

Our Multicore Software Development Kits (MCSDK) provide highly-optimized bundles of foundational, platform-specific drivers to enable development on selected TI ARM and DSP devices. (...)

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NDKTCPIP — TI-RTOS-Netzwerktechnik

TI-RTOS Networking (formerly known as the NDK or Network Developers Kit) combines dual mode IPv4/IPv6 stack with some network applications. TI-RTOS Networking support is available for both Ethernet-enabled MCUs as a part of TI-RTOS and also for high-performance TMS320C6000™ DSP-based devices.
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SPRC122 C62x/C64x Fast Run-Time Support Library

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SPRC975 TMS320C6474 Chip Support Library

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ADT-3P-DSPVOIPCODECS — Adaptive Digital Technologies DSP VOIP-, Sprach- und Audio-Codecs

Adaptive Digital is a developer of voice quality enhancement algorithms, and best-in-class acoustic echo cancellation software that work with TI DSPs. Adaptive Digital has extensive experience in the algorithm development, implementation, optimization and configuration tuning. They provide (...)
Software-Codec

C64XPLUSCODECS — CODECS – Video und Sprache – C64x+-basierte Geräte (OMAP35x, C645x, C647x, DM646, DM644x, DM643x)

Die TI-Codecs sind kostenlos, werden mit Produktionslizenzen geliefert und stehen ab sofort zum Download bereit. Alle Codecs wurden eingehend geprüft und lassen sich problemlos in Video- und Sprachanwendungen integrieren. Klicken Sie auf die Schaltfläche „GET SOFTWARE“ (oben), um auf die neuesten, (...)
Software-Codec

VOCAL-3P-DSPVOIPCODECS — Vocal-Technologien DSP VoIP-Codecs

With over 25 years of assembly and C code development, VOCAL modular software suite is available for a wide variety of TI DSPs. Products include ATAs, VoIP servers and gateways, HPNA-based IPBXs, video surveillance, voice and video conferencing, voice and data RF devices, RoIP gateways, secure (...)
Simulationsmodell

C6474 ZUN BSDL Model

SPRM335.ZIP (7 KB) - BSDL Model
Simulationsmodell

C6474 ZUN IBIS Model (Rev. A)

SPRM336A.ZIP (516 KB) - IBIS Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
FCBGA (CUN) 561 Ultra Librarian

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