Detalles del producto

Configuration 2:1 SPDT Number of channels 1 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 2.1 CON (typ) (pF) 150 ON-state leakage current (max) (µA) 0.029 Supply current (typ) (µA) 25 Bandwidth (MHz) 40 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 330 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -22
Configuration 2:1 SPDT Number of channels 1 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 2.1 CON (typ) (pF) 150 ON-state leakage current (max) (µA) 0.029 Supply current (typ) (µA) 25 Bandwidth (MHz) 40 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 330 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -22
VSSOP (DGK) 8 14.7 mm² 3 x 4.9 WSON (RQX) 8 6 mm² 2 x 3
  • Latch-up immune
  • Dual supply range: ±4.5 V to ±22 V
  • Single supply range: 4.5 V to 44 V
  • Low on-resistance: 2.1 Ω
  • Low charge injection: −10 pC
  • High current support: 330 mA (maximum) (VSSOP)
  • High current support: 440 mA (maximum) (WSON)
  • –40°C to +125°C operating temperature
  • 1.8 V logic compatible
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional signal path
  • Break-before-make switching
  • Latch-up immune
  • Dual supply range: ±4.5 V to ±22 V
  • Single supply range: 4.5 V to 44 V
  • Low on-resistance: 2.1 Ω
  • Low charge injection: −10 pC
  • High current support: 330 mA (maximum) (VSSOP)
  • High current support: 440 mA (maximum) (WSON)
  • –40°C to +125°C operating temperature
  • 1.8 V logic compatible
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional signal path
  • Break-before-make switching

The TMUX7219 is a complementary metal-oxide semiconductor (CMOS) switch with latch-up immunity in a single channel, 2:1 (SPDT) configuration. The device works with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX7219 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.

The TMUX7219 can be enabled or disabled by controlling the EN pin. When disabled, both signal path switches are off. When enabled, the SEL pin can be used to turn on signal path 1 (S1 to D) or signal path 2 (S2 to D). All logic control inputs support logic levels from 1.8 V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.

The TMUX7219 is a complementary metal-oxide semiconductor (CMOS) switch with latch-up immunity in a single channel, 2:1 (SPDT) configuration. The device works with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX7219 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.

The TMUX7219 can be enabled or disabled by controlling the EN pin. When disabled, both signal path switches are off. When enabled, the SEL pin can be used to turn on signal path 1 (S1 to D) or signal path 2 (S2 to D). All logic control inputs support logic levels from 1.8 V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TMUX7219 44-V, Latch-Up Immune, 2:1 (SPDT) Precision Switch with 1.8-V Logic datasheet (Rev. E) PDF | HTML 02 ago 2022
White paper Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) PDF | HTML 30 abr 2024
Application note How to Handle High Voltage Common Mode Applications using Multiplexers PDF | HTML 03 oct 2022
Application note Guarding in Multiplexer Applications PDF | HTML 13 may 2022
EVM User's guide TMUX-8RQX-EVM User's Guide 05 may 2022
Application note Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) 20 sep 2021
Application brief Dynamically Controlling Signal in a CWD Receive Path for Ultrasound PDF | HTML 18 ene 2021
Certificate TMUX72XXDGKEVM EU RoHS Declaration of Conformity (DoC) 18 dic 2020
EVM User's guide TMUX72XXDGKEVM Evaluation Module 10 dic 2020

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

DIP-ADAPTER-EVM — Módulo de evaluación de adaptador DIP

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Guía del usuario: PDF
Placa de evaluación

TMUX-8RQX-EVM — Módulo de evaluación TMUX para RQX de 8 pines

El TMUX‑8RQX‑EVM permite la creación rápida de prototipos de multiplexores de media tensión que se ofrecen en encapsulados RQX de 8 pines.

Guía del usuario: PDF
Placa de evaluación

TMUX72XXDGKEVM — Módulo de evaluación TMUX72xx de paquete DGK

El TMUX72XXDGKEVM admite la evaluación de los dispositivos TMUX72xx en el encapsulado VSSOP (DGK) de 8 pines, incluido TMUX7219DGK. Este módulo de evaluación puede utilizarse para la creación rápida de prototipos y pruebas de dispositivos TMUX72xx, específicamente para parámetros de CC.

Guía del usuario: PDF
Adaptador de interfaz

LEADED-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas rápidas de encapsulados con plomo

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Adaptador de interfaz

LEADLESS-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas de encapsulados sin plomo de 6, 8

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Guía del usuario: PDF
Modelo de simulación

TMUX7219 IBIS model (Rev. B) (Rev. B)

SCDM249B.ZIP (263 KB) - IBIS Model
Modelo de simulación

TMUX7219 PSpice Model

SCDM261.ZIP (113 KB) - PSpice Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VSSOP (DGK) 8 Ultra Librarian
WSON (RQX) 8 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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