74AC16374

활성

3상 출력을 지원하는 16비트 에지 트리거 D형 플립플롭

제품 상세 정보

Number of channels 16 Technology family AC Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 100 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 80 Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 16 Technology family AC Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 100 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 80 Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -40 to 85 Rating Catalog
SSOP (DL) 48 164.358 mm² 15.88 x 10.35
  • Members of the Texas Instruments WidebusTM Family
  • 3-State True Outputs
  • Full Parallel Access for Loading
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

  • Members of the Texas Instruments WidebusTM Family
  • 3-State True Outputs
  • Full Parallel Access for Loading
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'AC16374 are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The 'AC16374 can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs.

A buffered output-enable input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.

does not affect the internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The 74AC16374 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16374 is characterized for operation from -40°C to 85°C.

 

 

The 'AC16374 are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The 'AC16374 can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs.

A buffered output-enable input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.

does not affect the internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The 74AC16374 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16374 is characterized for operation from -40°C to 85°C.

 

 

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관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 유사한 기능
SN74AC374 활성 3상 출력을 지원하는 8진 D형 에지 트리거 플립플롭 Larger voltage range (2V to 6V)

기술 자료

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유형 직함 날짜
* Data sheet 16-Bit Edge-Triggered D-Type Flip-Flops With 3-State Outputs datasheet (Rev. B) 1996/04/01
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022/12/15
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
More literature HiRel Unitrode Power Management Brochure 2009/07/07
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996/04/01

설계 및 개발

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패키지 CAD 기호, 풋프린트 및 3D 모델
SSOP (DL) 48 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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