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Configuration 2:1 SPDT Number of channels 3 Power supply voltage - single (V) 5, 12, 16, 20 Power supply voltage - dual (V) +/-10, +/-2.5, +/-5 Protocols Analog Ron (typ) (Ω) 125 CON (typ) (pF) 9 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 0.04 Bandwidth (MHz) 30 Operating temperature range (°C) -40 to 125 Features Break-before-make Input/output continuous current (max) (mA) 10 Rating Automotive Drain supply voltage (max) (V) 20 Supply voltage (max) (V) 20 Negative rail supply voltage (max) (V) 0
Configuration 2:1 SPDT Number of channels 3 Power supply voltage - single (V) 5, 12, 16, 20 Power supply voltage - dual (V) +/-10, +/-2.5, +/-5 Protocols Analog Ron (typ) (Ω) 125 CON (typ) (pF) 9 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 0.04 Bandwidth (MHz) 30 Operating temperature range (°C) -40 to 125 Features Break-before-make Input/output continuous current (max) (mA) 10 Rating Automotive Drain supply voltage (max) (V) 20 Supply voltage (max) (V) 20 Negative rail supply voltage (max) (V) 0
SOIC (D) 16 59.4 mm² 9.9 x 6
  • AEC-Q100 qualified for automotive applications:
    • Temperature grade 1: –45°C to +125°C, T A
  • Wide range of digital and analog signal levels:
    • Digital: 3 V to 20 V
    • Analog: ≤ 20 V P-P
  • Low ON resistance, 125 Ω (typical) over 15 V P-P signal input range for V DD – V EE = 18 V
  • High OFF resistance, channel leakage of ±100 pA (typical) at V DD – V EE = 18 V
  • Logic-level conversion for digital addressing signals of 3 V to 20 V (V DD – V SS = 3 V to 20 V) to switch analog signals to 20 V P-P (V DD – V EE = 20 V) matched switch characteristics, r ON = 5 Ω (typical) for V DD – V EE = 15 V very low quiescent power dissipation under all digital-control input and supply conditions, 0.2 µW (typical) at V DD – V SS = V DD – V EE = 10 V
  • Binary address decoding on chip
  • 5 V, 10 V, and 15 V parametric ratings
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package temperature range, 100 nA at 18 V and 25°C
  • Break-before-make switching eliminates channel overlap
  • AEC-Q100 qualified for automotive applications:
    • Temperature grade 1: –45°C to +125°C, T A
  • Wide range of digital and analog signal levels:
    • Digital: 3 V to 20 V
    • Analog: ≤ 20 V P-P
  • Low ON resistance, 125 Ω (typical) over 15 V P-P signal input range for V DD – V EE = 18 V
  • High OFF resistance, channel leakage of ±100 pA (typical) at V DD – V EE = 18 V
  • Logic-level conversion for digital addressing signals of 3 V to 20 V (V DD – V SS = 3 V to 20 V) to switch analog signals to 20 V P-P (V DD – V EE = 20 V) matched switch characteristics, r ON = 5 Ω (typical) for V DD – V EE = 15 V very low quiescent power dissipation under all digital-control input and supply conditions, 0.2 µW (typical) at V DD – V SS = V DD – V EE = 10 V
  • Binary address decoding on chip
  • 5 V, 10 V, and 15 V parametric ratings
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package temperature range, 100 nA at 18 V and 25°C
  • Break-before-make switching eliminates channel overlap

The CD405xB-Q1 analog multiplexers and demultiplexers are digitally-controlled analog switches having low ON impedance and very low OFF leakage current. These multiplexer circuits dissipate extremely low quiescent power over the full V DD – V SS and V DD – V EE supply-voltage ranges, independent of the logic state of the control signals.

The CD405xB-Q1 analog multiplexers and demultiplexers are digitally-controlled analog switches having low ON impedance and very low OFF leakage current. These multiplexer circuits dissipate extremely low quiescent power over the full V DD – V SS and V DD – V EE supply-voltage ranges, independent of the logic state of the control signals.

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* Data sheet CD405xB-Q1 Automotive CMOS Single 8-Channel Analog Multiplexer or Demultiplexer with Logic-Level Conversion datasheet (Rev. C) PDF | HTML 2023/03/22

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치