CY54FCT374T
- Function, Pinout, and Drive Compatible With FCT and F Logic
- Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- Matched Rise and Fall Times
- Fully Compatible With TTL Input and Output Logic Levels
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Edge-Triggered D-Type Inputs
- 250-MHz Typical Switching Rate
- CY54FCT374T
- 32-mA Output Sink Current
- 12-mA Output Source Current
- CY74FCT374T
- 64-mA Output Sink Current
- 32-mA Output Source Current
- 3-State Outputs
The \x92FCT374T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The eight flip-flops in the \x92FCT374T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the eight flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | 8-Bit Registers With 3-State Outputs datasheet (Rev. A) | 2001/10/01 | |
* | SMD | CY54FCT374T SMD 5962-92218 | 2016/06/21 | |
Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022/12/15 | |
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004/06/22 | ||
User guide | CYFCT Parameter Measurement Information | 2001/04/02 | ||
Selection guide | Advanced Bus Interface Logic Selection Guide | 2001/01/09 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (J) | 20 | Ultra Librarian |
LCCC (FK) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치