CY74FCT2574T
- Function and Pinout Compatible With FCT and F Logic
- 25-
Output Series Resistors to Reduce Transmission-Line Reflection Noise - Reduced VOH (Typically = 3.3 V) Version of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- Matched Rise and Fall Times
- Fully Compatible With TTL Input and Output Logic Levels
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- 3-State Outputs
- 12-mA Output Sink Current
15-mA Output Source Current - Edge-Triggered D-Type Inputs
- 250-MHz Typical Switching Rate
The CY74FCT2574T is a high-speed, low-power, octal D-type flip-flop featuring separate D-type inputs for each flip-flop. On-chip termination resistors at the outputs reduce system noise caused by reflections. The CY74FCT2574T can replace the CY74FCT574T to reduce noise in an existing design. This device has 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The CY74FCT2574T is identical to the CY74FCT2374T, except that on the CY74FCT2574T all outputs are on one side of the package and all inputs are on the other side. The flip-flops in the CY74FCT2574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
관심 가지실만한 유사 제품
비교 대상 장치보다 업그레이드된 기능을 지원하는 즉각적 대체품
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 8-Bit Register datasheet | 2001/10/11 | |
| White paper | Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) | PDF | HTML | 2024/04/30 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022/12/15 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004/06/22 | ||
| User guide | CYFCT Parameter Measurement Information | 2001/04/02 | ||
| Selection guide | Advanced Bus Interface Logic Selection Guide | 2001/01/09 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈
14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SOIC (DW) | 20 | Ultra Librarian |
| SSOP (DBQ) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치