DAC5672-EP
- Controlled Baseline
- One Assembly
- One Test Site
- One Fabrication Site
- Extended Temperature Performance of -55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree(1)
- 14-Bit Dual Transmit Digital-to-Analog Converter (DAC)
- 200-MSPS Update Rate
- Single Supply: 3 V to 3.6 V
- High Spurious-Free Dynamic Range (SFDR): 84 dBc at 5 MHz
- High Third-Order Two-Tone Intermodulation (IMD3): 79 dBc at 15.1 MHz and 16.1 MHz
- WCDMA Adjacent Channel Leakage Ratio (ACLR): 78 dB at Baseband
- WCDMA ACLR: 73 dB at 30.72 MHz
- Independent or Single Resistor Gain Control
- Dual or Interleaved Data
- On-Chip 1.2-V Reference
- Low Power: 330 mW
- Power-Down Mode: 9 mW
- Package: 48-Pin Thin-Quad Flat Pack (TQFP)
- APPLICATIONS
- Cellular Base Transceiver Station Transmit Channel
- CDMA: W-CDMA, CDMA2000, IS-95
- TDMA: GSM, IS-136, EDGE/UWC-136
- Medical/Test Instrumentation
- Arbitrary Waveform Generators (ARB)
- Direct Digital Synthesis (DDS)
- Cable Modem Termination System (CMTS)
- Cellular Base Transceiver Station Transmit Channel
(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
The DAC5672 is a monolithic, dual-channel, 14-bit, high-speed digital-to-analog converter (DAC) with on-chip voltage reference.
Operating with update rates of up to 200 MSPS, the DAC5672 offers exceptional dynamic performance, tight gain, and offset matching characteristics that make it suitable in either I/Q baseband or direct IF communication applications.
Each DAC has a high-impedance, differential-current output, suitable for single-ended or differential analog-output configurations. External resistors allow scaling the full-scale output current for each DAC separately or together, typically between 2 mA and 20 mA. An accurate on-chip voltage reference is temperature compensated and delivers a stable 1.2-V reference voltage. Optionally, an external reference may be used.
The DAC5672 has two 14-bit parallel input ports with separate clocks and data latches. For flexibility, the DAC5672 also supports multiplexed data for each DAC on one port when operating in the interleaved mode.
The DAC5672 has been specifically designed for a differential transformer-coupled output with a 50-
doubly-terminated load. For a 20-mA full-scale output current, both a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (-2 dBm output power) are supported.
The DAC5672 is available in a 48-pin thin quad flat pack (TQFP) package. Pin compatibility between family members provides 12-bit (DAC5662) and 14-bit (DAC5672) resolution. Furthermore, the DAC5672 is pin compatible to the DAC2904 and AD9767 dual DACs. The device is characterized for operation over the military temperature range of -55°C to 125°C.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | DAC5672-EP datasheet (Rev. A) | 2006/10/10 | |
| * | VID | DAC5672-EP VID V6206639 | 2016/06/21 | |
| Application note | High Speed, Digital-to-Analog Converters Basics (Rev. A) | 2012/10/23 | ||
| Application note | CDCE72010 as a Clocking Solution for High-Speed Analog-to-Digital Converters | 2008/06/08 | ||
| Application note | Phase Noise Performance and Jitter Cleaning Ability of CDCE72010 | 2008/06/02 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| TQFP (PFB) | 48 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치