DRV8351-SEP

활성

Radiation-tolerant, 100-V max simple 3-phase gate driver with bootstrap diodes

제품 상세 정보

Rating Space Architecture Gate driver Vs ABS (max) (V) 100 Operating temperature range (°C) -55 to 125
Rating Space Architecture Gate driver Vs ABS (max) (V) 100 Operating temperature range (°C) -55 to 125
TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • 40V Three Phase Half-Bridge Gate driver
    • Drives N-Channel MOSFETs (NMOS)
    • Gate Driver Supply (GVDD): 5-15V
    • MOSFET supply (SHx) supports up to 40V
  • Target Radiation Performance
    • SEL, SEB, and SET immune up to LET = 43 MeV-cm2 /mg
    • SET and SEFI characterized up to LET = 43 MeV-cm2 /mg
    • TID assured for every wafer lot up to 30 krad(Si)
    • TID characterized up to 30 krad(Si)
  • Space-enhanced plastic (space EP):
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication site
    • Extended Product Life Cycle
    • Product Traceability
  • Integrated Bootstrap Diodes
  • Supports Inverting and Non-Inverting INLx inputs
  • Bootstrap gate drive architecture
    • 750mA source current
    • 1.5- sink current
  • Low leakage current on SHx pins (<55µA)
  • Absolute maximum BSTx voltage up to 57.5V
  • Supports negative transients up to -22V on SHx
  • Built-in cross conduction prevention
  • Fixed deadtime insertion of 200nS
  • Supports 3.3V and 5V logic inputs with 20V Abs max
  • 4nS typical propagation delay matching
  • Compact TSSOP package
  • Efficient system design with Power Blocks
  • Integrated protection features
    • BST undervoltage lockout (BSTUV)
    • GVDD undervoltage (GVDDUV)
  • 40V Three Phase Half-Bridge Gate driver
    • Drives N-Channel MOSFETs (NMOS)
    • Gate Driver Supply (GVDD): 5-15V
    • MOSFET supply (SHx) supports up to 40V
  • Target Radiation Performance
    • SEL, SEB, and SET immune up to LET = 43 MeV-cm2 /mg
    • SET and SEFI characterized up to LET = 43 MeV-cm2 /mg
    • TID assured for every wafer lot up to 30 krad(Si)
    • TID characterized up to 30 krad(Si)
  • Space-enhanced plastic (space EP):
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication site
    • Extended Product Life Cycle
    • Product Traceability
  • Integrated Bootstrap Diodes
  • Supports Inverting and Non-Inverting INLx inputs
  • Bootstrap gate drive architecture
    • 750mA source current
    • 1.5- sink current
  • Low leakage current on SHx pins (<55µA)
  • Absolute maximum BSTx voltage up to 57.5V
  • Supports negative transients up to -22V on SHx
  • Built-in cross conduction prevention
  • Fixed deadtime insertion of 200nS
  • Supports 3.3V and 5V logic inputs with 20V Abs max
  • 4nS typical propagation delay matching
  • Compact TSSOP package
  • Efficient system design with Power Blocks
  • Integrated protection features
    • BST undervoltage lockout (BSTUV)
    • GVDD undervoltage (GVDDUV)

DRV8351-SEP is a three phase half-bridge gate driver, capable of driving high-side and low-side N-channel power MOSFETs. The DRV8351-SEPD generates the correct gate drive voltages using an integrated bootstrap diode and external capacitor for the high-side MOSFETs. GVDD is used to generate gate drive voltage for the low-side MOSFETs. The Gate Drive architecture supports peak up to 750mA source and 1.5A sink currents.

The phase pins SHx are able to tolerate significant negative voltage transients; while high side gate driver supply BSTx and GHx can support higher positive voltage transients (57.5V) abs max voltage which improve the robustness of the system. Small propagation delay and delay matching specifications minimize the dead-time requirement which further improves efficiency. Undervoltage protection is provided for both low and high sides through GVDD and BST undervoltage lockout.

DRV8351-SEP is a three phase half-bridge gate driver, capable of driving high-side and low-side N-channel power MOSFETs. The DRV8351-SEPD generates the correct gate drive voltages using an integrated bootstrap diode and external capacitor for the high-side MOSFETs. GVDD is used to generate gate drive voltage for the low-side MOSFETs. The Gate Drive architecture supports peak up to 750mA source and 1.5A sink currents.

The phase pins SHx are able to tolerate significant negative voltage transients; while high side gate driver supply BSTx and GHx can support higher positive voltage transients (57.5V) abs max voltage which improve the robustness of the system. Small propagation delay and delay matching specifications minimize the dead-time requirement which further improves efficiency. Undervoltage protection is provided for both low and high sides through GVDD and BST undervoltage lockout.

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기술 자료

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유형 직함 날짜
* Data sheet DRV8351-SEP: 40-V Three-Phase BLDC Gate Driver datasheet PDF | HTML 2024/12/09
* Radiation & reliability report DRV8351-SEP Total Ionizing Dose (TID) Report PDF | HTML 2024/12/12

설계 및 개발

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평가 보드

DRV8351EVM — DRV8351 평가 모듈

DRV8351은 3상 모터 드라이브 애플리케이션을 위한 게이트 드라이버 IC로, 각각 고압측 및 저압측 N형 MOSFET을 구동할 수 있는 3개의 고정밀 트리밍되고 온도 보상된 하프 브리지 드라이버를 제공합니다. DRV8351 하드웨어와 함께 TMS320F280049C 마이크로컨트롤러 기반 보드는 DRV8351에 필요한 신호를 전송하여 3상 브러시리스-DC 모터를 구동하는 레퍼런스 소프트웨어를 갖추고 있습니다. GUI Composer 소프트웨어를 사용하면 사용자는 설정을 프로그래밍하고, 모터가 고장 상태로부터 시스템을 회전 및 (...)
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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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