SN54AS374
- D-Type Flip-Flops in a Single Package With 3-State Bus Driving True Outputs
- Full Parallel Access for Loading
- Buffered Control Inputs
- Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) DIPs
These octal D-type edge-triggered flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.
A buffered output-enable (OE\) input places the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without interface or pullup components.
OE\ does not affect internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
The SN54ALS374A and SN54AS374 are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALS374A and SN74AS374 are characterized for operation from 0°C to 70°C.
관심 가지실만한 유사 제품
비교 대상 장치와 유사한 기능
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | Octal D-Type Edge-Triggered Flip-Flops With 3-State Outputs datasheet (Rev. C) | 1999/11/03 | |
| * | SMD | SN54AS374 SMD 5962-97562 | 2016/06/21 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022/12/15 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Advanced Schottky Load Management | 1997/02/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
| Application note | Live Insertion | 1996/10/01 | ||
| Application note | Advanced Schottky (ALS and AS) Logic Families | 1995/08/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| CDIP (J) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치