SN54F74
- Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs
These devices contain two independent positive-edge-triggered
D-type flip-flops. A low level at the preset (
) or clear (
) inputs sets or resets the outputs
regardless of the levels of the other inputs. When and are inactive (high), data at the
data (D) input meeting the setup time requirements is transferred to
the outputs on the positive-going edge of the clock pulse. Clock
triggering occurs at a voltage level and is not directly related to
the rise time of the clock pulse. Following the hold-time interval,
data at the D input may be changed without affecting the levels at
the outputs.
The SN54F74 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F74 is characterized for operation from 0°C to 70°C.
The output levels are not guaranteed to meet the minimum
levels for VOH. Furthermore, this configuration is
nonstable; that is, it will not persist when or returns to its inactive (high) level.
관심 가지실만한 유사 제품
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | Dual Positive-Edge-Triggered D-Type Flip-Flops With Clear And Preset datasheet (Rev. A) | 1993/10/01 | |
| * | SMD | SN54F74 SMD 5962-97592 | 2016/06/21 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022/12/15 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997/08/01 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| CDIP (J) | 14 | Ultra Librarian |
| CFP (W) | 14 | Ultra Librarian |
| LCCC (FK) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치