SN54LS76A
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The '76 contains two independent J-K flip-flops with individual J-K, clock, preset, and clear inputs. The '76 is a positive-edge-triggered flip-flop. J-K input is loaded into the master while the clock is high and transferred to the slave on the high-to-low transition. For these devices the J and K inputs must be stable while the clock is high.
The 'LS76A contain two independent negative-edge-triggered flip-flops. The J and K inputs must be stable one setup time prior to the high-to-low clock transition for predictable operation. The preset and clear are asynchronous active low inputs. When low they override the clock and data inputs forcing the outputs to the steady state levels as shown in the function table.
The SN5476 and the SN54LS76A are characterized for operation over the full military temperature range of -55°C to 125°C. The SN7476 and the SN74LS76A are characterized for operation from 0°C to 70°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | Dual J-K Flip-Flops With Preset And Clear datasheet | 1988/03/01 | |
* | SMD | SN54LS76A SMD 7601301EA | 2016/06/21 | |
Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022/12/15 | |
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
Application note | Designing with the SN54/74LS123 (Rev. A) | 1997/03/01 | ||
Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
Application note | Live Insertion | 1996/10/01 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (J) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치