홈 로직 및 전압 변환 플립플롭, 래치 및 레지스터 D형 플립플롭
홈
로직 및 전압 변환
플립플롭, 래치 및 레지스터
D형 플립플롭

SN74ALVCH16721

활성

3상 출력을 지원하는 3.3V 20비트 플립플롭

지금 주문
데이터 시트

SN74ALVCH16721

활성
데이터 시트 지금 주문

제품 상세 정보

Number of channels 20 Technology family ALVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 40 Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 20 Technology family ALVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 40 Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
SSOP (DL) 56 190.647 mm² 18.42 x 10.35 TSSOP (DGG) 56 113.4 mm² 14 x 8.1
  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages

Widebus, EPIC are trademarks of Texas Instruments.
  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages

Widebus, EPIC are trademarks of Texas Instruments.

This 20-bit flip-flop is designed specifically for 1.65-V to 3.6-V VCC operation.

The 20 flip-flops of the SN74ALVCH16721 are edge-triggered D-type flip-flops with qualified clock storage. On the positive transition of the clock (CLK) input, the device provides true data at the Q outputs if the clock-enable (CLKEN)\ input is low. If CLKEN\ is high, no data is stored.

A buffered output-enable (OE)\ input places the 20 outputs in either a normal logic state (high or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. OE\ does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVCH16721 is characterized for operation from –40°C to 85°C.

This 20-bit flip-flop is designed specifically for 1.65-V to 3.6-V VCC operation.

The 20 flip-flops of the SN74ALVCH16721 are edge-triggered D-type flip-flops with qualified clock storage. On the positive transition of the clock (CLK) input, the device provides true data at the Q outputs if the clock-enable (CLKEN)\ input is low. If CLKEN\ is high, no data is stored.

A buffered output-enable (OE)\ input places the 20 outputs in either a normal logic state (high or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. OE\ does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVCH16721 is characterized for operation from –40°C to 85°C.
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기술 자료

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21개 모두 보기
유형 직함 날짜
* Data sheet SN74ALVCH16721 datasheet (Rev. E) 2004/08/03
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022/12/15
Application note An Overview of Bus-Hold Circuit and the Applications (Rev. B) 2018/09/17
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
User guide ALVC Advanced Low-Voltage CMOS Including SSTL, HSTL, And ALB (Rev. B) 2002/08/01
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 1999/09/08
Application note TI SN74ALVC16835 Component Specification Analysis for PC100 1998/08/03
Application note Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A) 1998/05/13
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Timing Differences of 10-pF Versus 50pF Loading 1996/11/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

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시뮬레이션 모델

HSPICE Model of SN74ALVCH16721

SCEJ177.ZIP (234 KB) - HSpice Model
다운로드
시뮬레이션 모델

SN74ALVCH16721 IBIS Model (Rev. B)

SCEM037B.ZIP (92 KB) - IBIS Model
다운로드
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
SSOP (DL) 56 Ultra Librarian
TSSOP (DGG) 56 Ultra Librarian
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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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포럼 주제 모두 보기(영문)

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