SN74CB3Q3257
- High-Bandwidth Data Path
(up to 500 MHz) - 5-V Tolerant I/Os With Device Powered Up or Powered Down
- Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range
(ron= 4 Ω Typical) - Rail-to-Rail Switching on Data I/O Ports
- 0- to 5-V Switching With 3.3-V VCC
- 0- to 3.3-V Switching With 2.5-V VCC
- Bidirectional Data Flow With Near-Zero Propagation Delay
- Low Input and Output Capacitance Minimizes Loading and Signal Distortion
(Cio(OFF) = 3.5 pF Typical) - Fast Switching Frequency (f OE = 20 MHz Maximum)
- Data and Control Inputs Provide Undershoot Clamp Diodes
- Low Power Consumption
(ICC = 0.7 mA Typical) - VCC Operating Range From 2.3 V to 3.6 V
- Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) - Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs - Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human Body Model
- Supports Both Digital and Analog Applications: USB Interface, Differential Signal Interface,
Bus Isolation, Low-Distortion Signal Gating (1)
(1)For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, SCDA008.
The SN74CB3Q3257 device is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron).
관심 가지실만한 유사 제품
비교 대상 장치보다 업그레이드된 기능을 지원하는 드롭인 대체품
기술 자료
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11개 모두 보기 | 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | SN74CB3Q3257 4-Bit 1-of-2 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch datasheet (Rev. D) | PDF | HTML | 2018/07/09 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022/06/02 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021/12/01 | |
| Application note | CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C) | PDF | HTML | 2021/11/19 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| More literature | Digital Bus Switch Selection Guide (Rev. A) | 2004/11/10 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| User guide | Signal Switch Data Book (Rev. A) | 2003/11/14 | ||
| Application note | Bus FET Switch Solutions for Live Insertion Applications | 2003/02/07 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
평가 보드
TAS2770EVM — QFN 패키지용 TAS2770EVM 모노, 디지털 입력, 클래스 D, IV 감지 오디오 증폭기 평가 모듈
The TAS2770EVM provides developers with a simple to use mono evaluation module that can be configured as a stereo solution and as a multi-channel solution. It is powerful tool kit for assessing stereo and mono implementations of the TAS2770 with or without IV sense. Everything needed for evaluating (...)
사용 설명서: PDF
평가 보드
TAS2770EVM-STEREO — TAS2770 디지털 입력, 클래스 D, IV 감지 오디오 증폭기의 스테레오 평가 모듈
The TAS2770EVM-Stereo evaluation module provides developers with a simple to use module pre-configured in as a stereo solution. It is powerful tool kit for assessing stereo or mono implementations of the TAS2770 with or without IV sense. Everything needed for evaluating TAS2770 as a conventional (...)
사용 설명서: PDF
인터페이스 어댑터
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
사용 설명서: PDF
인터페이스 어댑터
LEADLESS-ADAPTER1 — TI의 6, 8, 10, 12, 14, 16 및 20핀 리드 없는 패키지의 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
사용 설명서: PDF
레퍼런스 디자인
TIDA-01572 — 디지털 입력, 클래스 D, IV 감지 오디오 증폭기의 스테레오 평가 모듈 레퍼런스 디자인
This reference design provides a high-performance stereo audio subsystem for use in PC applications. It operates off a single supply, ranging from 4.5 V to 16 V, and features the TAS2770, a digital-input Class-D audio amplifier that provides excellent noise and distortion performance and is (...)
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SSOP (DBQ) | 16 | Ultra Librarian |
| TSSOP (PW) | 16 | Ultra Librarian |
| TVSOP (DGV) | 16 | Ultra Librarian |
| VQFN (RGY) | 16 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.