SN74LS73A
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The '73, and 'H73, contain two independent J-K flip-flops with individual J-K, clock, and direct clear inputs. The '73, and 'H73, are positive pulse-triggered flip-flops. J-K input is loaded into the master while the clock is high and transferred to the slave on the high-to-low transition. For these devices the J and K inputs must be stable while the clock is high.
The 'LS73A contains two independent negative-edge-triggered flip-flops. The J and K inputs must be stable one setup time prior to the high-to-low clock transition for predictable operation. When the clear is low, it overrides the clock and data inputs forcing the Q output low and the Q\ output high.
The SN5473, SN54H73, and the SN54LS73A are characterized for operation over the full military temperature range of -55°C to 125°C. The SN7473, and the SN74LS73A are characterized for operation from 0°C to 70°C.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | Dual J-K Flip-Flops With Clear datasheet | 1988/03/01 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022/12/15 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Designing with the SN54/74LS123 (Rev. A) | 1997/03/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
| Application note | Live Insertion | 1996/10/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈
14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| PDIP (N) | 14 | Ultra Librarian |
| SOIC (D) | 14 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치