홈 로직 및 전압 변환 플립플롭, 래치 및 레지스터 D형 래치
홈
로직 및 전압 변환
플립플롭, 래치 및 레지스터
D형 래치

SN74LVC1G373

활성

3상 출력을 지원하는 단일 D형 래치

지금 주문
데이터 시트

SN74LVC1G373

활성
데이터 시트 지금 주문

제품 상세 정보

Number of channels 1 Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Features Balanced outputs, Flow-through pinout, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 125 Rating Catalog
Number of channels 1 Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Features Balanced outputs, Flow-through pinout, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 125 Rating Catalog
DSBGA (YZP) 6 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 6 8.12 mm² 2.9 x 2.8 SOT-SC70 (DCK) 6 4.2 mm² 2 x 2.1
  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Provides Down Translation to VCC
  • Max tpd of 4 ns at 3.3 V
  • Low Power Consumption: 10-µA
    Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Partial-Power-Down Mode and Back Drive Protection
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Provides Down Translation to VCC
  • Max tpd of 4 ns at 3.3 V
  • Low Power Consumption: 10-µA
    Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Partial-Power-Down Mode and Back Drive Protection
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II

The SN74LVC1G373 device is a single D-type latch designed for 1.65-V to 5.5-V VCC operation.

This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

OE does not affect the internal operations of the latch. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN74LVC1G373 device is a single D-type latch designed for 1.65-V to 5.5-V VCC operation.

This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

OE does not affect the internal operations of the latch. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

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기술 자료

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28개 모두 보기
유형 직함 날짜
* Data sheet SN74LVC1G373 Single D-Type Latch With 3-State Output datasheet (Rev. F) PDF | HTML 2017/05/03
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022/12/15
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Little Logic Guide 2018 (Rev. G) 2018/07/06
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note How to Select Little Logic (Rev. A) 2016/07/26
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Product overview Design Summary for WCSP Little Logic (Rev. B) 2004/11/04
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
User guide Signal Switch Data Book (Rev. A) 2003/11/14
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 2003/11/06
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 2002/12/18
Application note Texas Instruments Little Logic Application Report 2002/11/01
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 2002/03/27
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note LVC Characterization Information 1996/12/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Design guide Low-Voltage Logic (LVC) Designer's Guide 1996/09/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

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평가 보드

5-8-LOGIC-EVM — 5핀~8핀 DCK, DCT, DCU, DRL 및 DBV 패키지용 일반 논리 평가 모듈

5~8핀 수의 DCK, DCT, DCU, DRL 또는 DBV 패키지가 있는 모든 디바이스를 지원하도록 설계된 유연한 EVM.
사용 설명서: PDF
TI.com에서 구매 불가
시뮬레이션 모델

SN74LVC1G373 IBIS Model (Rev. A)

SCEM393A.ZIP (52 KB) - IBIS Model
다운로드
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
DSBGA (YZP) 6 Ultra Librarian
SOT-23 (DBV) 6 Ultra Librarian
SOT-SC70 (DCK) 6 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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