SN74LXC8T245-Q1
- AEC-Q100 qualified for automotive applications
- Fully configurable dual-rail design allows each port to operate from 1.1 V to 5.5 V
- Robust, glitch-free power supply sequencing
- Up to 420-Mbps support for 3.3 V to 5.0 V
- Schmitt-trigger inputs allow for slow or noisy inputs
- I/Os with integrated dynamic pull-down resistors help reduce external component count
- Control inputs with integrated static pull-down resistors allow for floating control inputs
- High drive strength (up to 32 mA at 5 V)
- Low power consumption:
- 4-µA maximum (25°C)
- 12-µA maximum (–40°C to 125°C)
- VCC isolation and VCC disconnect (Ioff-float) feature:
- If either VCC supply is < 100 mV or disconnected, all I/Os get pulled-down and then become high-impedance
- Ioff supports partial-power-down mode operation
- Compatible with LVC family level shifters
- Control logic (DIR and OE) are referenced to VCCA
- Operating temperature from –40°C to +125°C
- Latch-up performance exceeds 100 mA per JESD 78, Class II
- ESD protection exceeds JESD 22
- 4000-V Human-Body Model
- 1000-V Charged-Device Model
The SN74LXC8T245-Q1 is an 8-bit, dual-supply noninverting bidirectional voltage level translation device. Ax pins and control pins (DIR and OE) are referenced to VCCA logic levels, and Bx pins are referenced to VCCB logic levels. The A port is able to accept I/O voltages ranging from 1.1 V to 5.5 V, while the B port can accept I/O voltages from 1.1 V to 5.5 V. A high on DIR allows data transmission from A to B and a low on DIR allows data transmission from B to A when OE is set to low. When OE is set to high, both Ax and Bx pins are in the high-impedance state. See Device Functional Modes for a summary of the operation of the control logic.
관심 가지실만한 유사 제품
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
기술 자료
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
TSSOP (PW) | 24 | Ultra Librarian |
VQFN (RHL) | 24 | Ultra Librarian |
VSSOP (DGS) | 24 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치