제품 상세 정보

Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 33 BW at Acl (MHz) 150 Acl, min spec gain (V/V) 1 Slew rate (typ) (V/µs) 650 Architecture Bipolar, Fully Differential ADC Driver Vn at flatband (typ) (nV√Hz) 7.6 Iq per channel (typ) (mA) 17.5 Rail-to-rail No Vos (offset voltage at 25°C) (max) (mV) 7 Operating temperature range (°C) -40 to 85 Iout (typ) (mA) 85 2nd harmonic (dBc) 85 3rd harmonic (dBc) 88 Frequency of harmonic distortion measurement (MHz) 1 GBW (typ) (MHz) 150 Input bias current (max) (pA) 15000000 Features Shutdown CMRR (typ) (dB) 83 Rating Catalog
Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 33 BW at Acl (MHz) 150 Acl, min spec gain (V/V) 1 Slew rate (typ) (V/µs) 650 Architecture Bipolar, Fully Differential ADC Driver Vn at flatband (typ) (nV√Hz) 7.6 Iq per channel (typ) (mA) 17.5 Rail-to-rail No Vos (offset voltage at 25°C) (max) (mV) 7 Operating temperature range (°C) -40 to 85 Iout (typ) (mA) 85 2nd harmonic (dBc) 85 3rd harmonic (dBc) 88 Frequency of harmonic distortion measurement (MHz) 1 GBW (typ) (MHz) 150 Input bias current (max) (pA) 15000000 Features Shutdown CMRR (typ) (dB) 83 Rating Catalog
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • High Performance
    • 150 MHz -3 dB Bandwidth (VCC = ±5 V)
    • 650 V/μs Slew Rate (VCC = ±15 V)
    • -89 dB Third Harmonic Distortion at 1 MHz
    • -83 dB Total Harmonic Distortion at 1 MHz
    • 7.6 nV/Hz Input-Referred Noise
  • Differential Input/Differential Output
    • Balanced Outputs Reject Common-Mode Noise
    • Differential Reduced Second Harmonic Distortion
  • Wide Power-Supply Range
    • VCC = 5 V Single-Supply to ±15 V Dual Supply
  • ICC(SD) = 1 mA (VCC = ±5) in Shutdown Mode (THS4150)
  • APPLICATIONS
    • Single-Ended to Differential Conversion
    • Differential ADC Driver
    • Differential Antialiasing
    • Differential Transmitter and Receiver
    • Output Level Shifter

PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.

  • High Performance
    • 150 MHz -3 dB Bandwidth (VCC = ±5 V)
    • 650 V/μs Slew Rate (VCC = ±15 V)
    • -89 dB Third Harmonic Distortion at 1 MHz
    • -83 dB Total Harmonic Distortion at 1 MHz
    • 7.6 nV/Hz Input-Referred Noise
  • Differential Input/Differential Output
    • Balanced Outputs Reject Common-Mode Noise
    • Differential Reduced Second Harmonic Distortion
  • Wide Power-Supply Range
    • VCC = 5 V Single-Supply to ±15 V Dual Supply
  • ICC(SD) = 1 mA (VCC = ±5) in Shutdown Mode (THS4150)
  • APPLICATIONS
    • Single-Ended to Differential Conversion
    • Differential ADC Driver
    • Differential Antialiasing
    • Differential Transmitter and Receiver
    • Output Level Shifter

PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.

The THS415x is one in a family of fully differential input/differential output devices fabricated using Texas Instruments' state-of-the-art BiComI complementary bipolar process.

The THS415x is made of a true fully-differential signal path from input to output. This design leads to an excellent common-mode noise rejection and improved total harmonic distortion.

The THS415x is one in a family of fully differential input/differential output devices fabricated using Texas Instruments' state-of-the-art BiComI complementary bipolar process.

The THS415x is made of a true fully-differential signal path from input to output. This design leads to an excellent common-mode noise rejection and improved total harmonic distortion.

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관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치보다 업그레이드된 기능을 지원하는 드롭인 대체품
THS2630 활성 35V, 180MHz 고속 저잡음 완전 차동 증폭기 Lower noise (1.1 nV/rtHz), lower offset (1.3 mV), lower power (8.9 mA), and wider supply (35 V)

기술 자료

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유형 직함 날짜
* Data sheet High-Speed Differential I/O Amplifiers datasheet (Rev. G) 2009/03/04

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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