홈 로직 및 전압 변환 구성 가능 및 프로그래머블 로직 IC 프로그래머블 로직 어레이(PLA)
홈
로직 및 전압 변환
구성 가능 및 프로그래머블 로직 IC
프로그래머블 로직 어레이(PLA)

TIBPAL16R6-20M

새 설계에 권장하지 않음

고성능 Impact PAL 회로

지금 주문
데이터 시트

TIBPAL16R6-20M

새 설계에 권장하지 않음
데이터 시트 지금 주문

제품 상세 정보

Rating Military Operating temperature range (°C) -55 to 125
Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • High-Performance Operation:
  • Propagation Delay
  • C Suffix...15 ns Max
  • M Suffix...20 ns Max
  • Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A
  • Power-Up Clear on Registered Devices (All Register Outputs Are Set High, but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability
    DEVICE
    		I
    INPUTS
    		3-STATE
    O
    OUTPUTS
    		REGISTERED
    Q
    OUTPUTS
    		I/O
    PORTS
    PAL16L8
    		10
    		2
    		0
    		6
    PAL16R4
    		8
    		0
    		4 (3-state buffers)
    		4
    PAL16R6
    		8
    		0
    		6 (3-state buffers)
    		2
    PAL16R8
    		8
    		0
    		8 (3-state buffers)
    		0

    These devices are covered by U.S. Patent 4,410,987.
    IMPACT is a trademark of Texas Instruments.
    PAL is a registered trademark of Advanced Micro Devices Inc.
  • High-Performance Operation:
  • Propagation Delay
  • C Suffix...15 ns Max
  • M Suffix...20 ns Max
  • Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A
  • Power-Up Clear on Registered Devices (All Register Outputs Are Set High, but Voltage Levels at the Output Pins Go Low)
  • Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability
    DEVICE
    		I
    INPUTS
    		3-STATE
    O
    OUTPUTS
    		REGISTERED
    Q
    OUTPUTS
    		I/O
    PORTS
    PAL16L8
    		10
    		2
    		0
    		6
    PAL16R4
    		8
    		0
    		4 (3-state buffers)
    		4
    PAL16R6
    		8
    		0
    		6 (3-state buffers)
    		2
    PAL16R8
    		8
    		0
    		8 (3-state buffers)
    		0

    These devices are covered by U.S. Patent 4,410,987.
    IMPACT is a trademark of Texas Instruments.
    PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACTTM circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16' C series is characterized from 0°C to 75°C. The TIBPAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACTTM circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16' C series is characterized from 0°C to 75°C. The TIBPAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.
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* Data sheet High-Performance Impact Programmable Array Logic Circuits datasheet (Rev. A) 2000/04/04

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치