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다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
TLC5510A
- Analog Input Range
- TLC5510...2 V Full Scale
- TLC5510A...4 V Full Scale
- 8-Bit Resolution
- Integral Linearity Error
±0.75 LSB Max (25°C)
±1 LSB Max (–20°C to 75°C) - Differential Linearity Error
±0.5 LSB Max (25°C)
±0.75 LSB Max (–20°C to 75°C) - Maximum Conversion Rate
20 Mega-Samples per Second (MSPS) Max - 5-V Single-Supply Operation
- Low Power Consumption
TLC5510...127.5 mW Typ
TLC5510A...150 mW Typ
(includes reference resistor dissipation) - TLC5510 is Interchangeable With Sony CXD1175
- applications
- Digital TV
- Medical Imaging
- Video Conferencing
- High-Speed Data Conversion
- QAM Demodulators
The TLC5510 and TLC5510A are CMOS, 8-bit, 20 MSPS analog-to-digital converters (ADCs) that utilize a semiflash architecture. The TLC5510 and TLC5510A operate with a single 5-V supply and typically consume only 130 mW of power. Included is an internal sample-and-hold circuit, parallel outputs with high-impedance mode, and internal reference resistors.
The semiflash architecture reduces power consumption and die size compared to flash converters. By implementing the conversion in a 2-step process, the number of comparators is significantly reduced. The latency of the data output valid is 2.5 clocks.
The TLC5510 uses the three internal reference resistors to create a standard, 2-V, full-scale conversion range using VDDA. Only external jumpers are required to implement this option and eliminates the need for external reference resistors. The TLC5510A uses only the center internal resistor section with an externally applied 4-V reference such that a 4-V input signal can be used. Differential linearity is 0.5 LSB at 25°C and a maximum of 0.75 LSB over the full operating temperature range. Typical dynamic specifications include a differential gain of 1% and differential phase of 0.7 degrees.
The TLC5510 and TLC5510A are characterized for operation from -20°C to 75°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | 8-Bit High-Speed Analog-to-Digital Converters datasheet (Rev. L) | 2003/06/11 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치