제품 상세 정보

Number of ADC channels 2 Number of DAC channels 2 Digital audio interface DSP, I2S, L&R, PCM, TDM Analog inputs 8 Analog outputs 7 Sampling rate (max) (kHz) 192 Rating Catalog Features Stereo Class-D amplifier, Stereo headphone amplifier ADC SNR (typ) (dB) 93 DAC SNR (typ) (dB) 100 Operating temperature range (°C) -40 to 85
Number of ADC channels 2 Number of DAC channels 2 Digital audio interface DSP, I2S, L&R, PCM, TDM Analog inputs 8 Analog outputs 7 Sampling rate (max) (kHz) 192 Rating Catalog Features Stereo Class-D amplifier, Stereo headphone amplifier ADC SNR (typ) (dB) 93 DAC SNR (typ) (dB) 100 Operating temperature range (°C) -40 to 85
DSBGA (YZF) 81 25 mm² 5 x 5
  • Stereo Audio DAC With 101=dB SNR
  • 2.7-mW Stereo 48-kHz DAC Playback
  • Stereo Audio ADC With 93-dB SNR
  • 5.6-mW Stereo 48-kHz ADC Record
  • 8 kHz to 192 kHz Playback and Record
  • 30-mW DirectPath™ Headphone Driver
    Eliminates Large Output DC-Blocking Capacitors
  • 128-mW Differential Receiver Output Driver
  • Stereo Class-D Speaker Drivers
    • 1.7 W (8 Ω, 5.5 V, 10% THDN)
    • 1.4 W (8 Ω, 5.5 V, 1% THDN)
  • Stereo Line Outputs
  • PowerTune™ - Adjusts Power vs SNR
  • Extensive Signal Processing Options
  • Eight Single-Ended or 4 Fully-Differential Analog
    Inputs
  • Stereo Digital and Analog Microphone Inputs
  • Low Power Analog Bypass Mode
  • Programmable PLL, Plus Low-Frequency Clocking
  • Programmable 12-Bit SAR ADC
  • SPI and I2C Control Interfaces
  • Three Independent Digital Audio Serial Interfaces
  • 4.81 mm × 4.81 mm × 0.625 mm 81-Ball WCSP
    (YZF) Package
  • Stereo Audio DAC With 101=dB SNR
  • 2.7-mW Stereo 48-kHz DAC Playback
  • Stereo Audio ADC With 93-dB SNR
  • 5.6-mW Stereo 48-kHz ADC Record
  • 8 kHz to 192 kHz Playback and Record
  • 30-mW DirectPath™ Headphone Driver
    Eliminates Large Output DC-Blocking Capacitors
  • 128-mW Differential Receiver Output Driver
  • Stereo Class-D Speaker Drivers
    • 1.7 W (8 Ω, 5.5 V, 10% THDN)
    • 1.4 W (8 Ω, 5.5 V, 1% THDN)
  • Stereo Line Outputs
  • PowerTune™ - Adjusts Power vs SNR
  • Extensive Signal Processing Options
  • Eight Single-Ended or 4 Fully-Differential Analog
    Inputs
  • Stereo Digital and Analog Microphone Inputs
  • Low Power Analog Bypass Mode
  • Programmable PLL, Plus Low-Frequency Clocking
  • Programmable 12-Bit SAR ADC
  • SPI and I2C Control Interfaces
  • Three Independent Digital Audio Serial Interfaces
  • 4.81 mm × 4.81 mm × 0.625 mm 81-Ball WCSP
    (YZF) Package

The TLV320AIC3212 (also referred to as the AIC3212) device is a flexible, highly-integrated, low-power, low-voltage stereo audio codec. The AIC3212 features digital microphone inputs and programmable outputs, PowerTune capabilities, selectable audio-processing blocks, predefined and parameterizable signal processing blocks, integrated PLL, and flexible audio interfaces. Extensive register-based control of power, input and output channel configuration, gains, effects, pin-multiplexing and clocks are included, allowing the device to be precisely targeted to its application.

Combined with the advanced PowerTune technology, the device can execute operations from 8-kHz mono voice playback to stereo 192-kHz DAC playback, making it ideal for portable battery-powered audio and telephony applications.

The record path of the TLV320AIC3212 covers operations from 8-kHz mono to 192-kHz stereo recording, and contains programmable input channel configurations which cover single-ended and differential setups, as well as floating or mixing input signals. It also provides a digitally-controlled stereo microphone preamplifier and integrated microphone bias. One application of the digital signal processing blocks is removable of audible noise that may be introduced by mechanical coupling, for example, optical zooming in a digital camera. The record path can also be configured as a stereo digital microphone Pulse Density Modulation (PDM) interface typically used at 64 Fs or 128 Fs.

The playback path offers signal processing blocks for filtering and effects; headphone, line, receiver, and Class-D speaker outputs; flexible mixing of DAC; and analog input signals as well as programmable volume controls. The playback path contains two high-power DirectPath headphone output drivers which eliminate the need for ac coupling capacitors. A built in charge pump generates the negative supply for the ground centered headphone drivers. These headphone output drivers can be configured in multiple ways, including stereo, and mono BTL. In addition, playback audio can be routed to integrated stereo Class-D speaker drivers or a differential receiver amplifier.

The integrated PowerTune technology allows the device to be tuned to just the right power-performance trade-off. Mobile applications frequently have multiple use cases requiring very low-power operation while being used in a mobile environment. When used in a docked environment power consumption typically is less of a concern while lowest possible noise is important. With PowerTune the TLV320AIC3212 can address both cases.

The required internal clock of the TLV320AIC3212 can be derived from multiple sources, including the MCLK1 pin, the MCLK2 pin, the BCLK1 pin, the BCLK2 pin, several general purpose I/O pins or the output of the internal PLL, where the input to the PLL again can be derived from similar pins. Although using the internal fractional PLL ensures the availability of a suitable clock signal, TI does not recommend this for the lowest power settings. The PLL is highly programmable and can accept available input clocks in the range of 512 kHz to 50 MHz. To enable even lower clock frequencies, an integrated low-frequency clock multiplier can also be used as an input to the PLL.

The TLV320AIC3212 has a 12-bit SAR ADC converter that supports system voltage measurements. These system voltage measurements can be sourced from three dedicated analog inputs (IN1L/AUX1, IN1R/AUX2, or VBAT pins), or, alternatively, an on-chip temperature sensor that can be read by the SAR ADC.

The TLV320AIC3212 also features three full Digital Audio Serial Interfaces, each supporting I2S, DSP/TDM, RJF, LJF, and mono PCM formats. This enables the digital playback (DAC) and record (ADC) paths to select from three independent digital audio buses or chips.

The device is available in the 4.81 mm × 4.81 mm × 0.625 mm 81-Ball WCSP (YZF) package.

The TLV320AIC3212 (also referred to as the AIC3212) device is a flexible, highly-integrated, low-power, low-voltage stereo audio codec. The AIC3212 features digital microphone inputs and programmable outputs, PowerTune capabilities, selectable audio-processing blocks, predefined and parameterizable signal processing blocks, integrated PLL, and flexible audio interfaces. Extensive register-based control of power, input and output channel configuration, gains, effects, pin-multiplexing and clocks are included, allowing the device to be precisely targeted to its application.

Combined with the advanced PowerTune technology, the device can execute operations from 8-kHz mono voice playback to stereo 192-kHz DAC playback, making it ideal for portable battery-powered audio and telephony applications.

The record path of the TLV320AIC3212 covers operations from 8-kHz mono to 192-kHz stereo recording, and contains programmable input channel configurations which cover single-ended and differential setups, as well as floating or mixing input signals. It also provides a digitally-controlled stereo microphone preamplifier and integrated microphone bias. One application of the digital signal processing blocks is removable of audible noise that may be introduced by mechanical coupling, for example, optical zooming in a digital camera. The record path can also be configured as a stereo digital microphone Pulse Density Modulation (PDM) interface typically used at 64 Fs or 128 Fs.

The playback path offers signal processing blocks for filtering and effects; headphone, line, receiver, and Class-D speaker outputs; flexible mixing of DAC; and analog input signals as well as programmable volume controls. The playback path contains two high-power DirectPath headphone output drivers which eliminate the need for ac coupling capacitors. A built in charge pump generates the negative supply for the ground centered headphone drivers. These headphone output drivers can be configured in multiple ways, including stereo, and mono BTL. In addition, playback audio can be routed to integrated stereo Class-D speaker drivers or a differential receiver amplifier.

The integrated PowerTune technology allows the device to be tuned to just the right power-performance trade-off. Mobile applications frequently have multiple use cases requiring very low-power operation while being used in a mobile environment. When used in a docked environment power consumption typically is less of a concern while lowest possible noise is important. With PowerTune the TLV320AIC3212 can address both cases.

The required internal clock of the TLV320AIC3212 can be derived from multiple sources, including the MCLK1 pin, the MCLK2 pin, the BCLK1 pin, the BCLK2 pin, several general purpose I/O pins or the output of the internal PLL, where the input to the PLL again can be derived from similar pins. Although using the internal fractional PLL ensures the availability of a suitable clock signal, TI does not recommend this for the lowest power settings. The PLL is highly programmable and can accept available input clocks in the range of 512 kHz to 50 MHz. To enable even lower clock frequencies, an integrated low-frequency clock multiplier can also be used as an input to the PLL.

The TLV320AIC3212 has a 12-bit SAR ADC converter that supports system voltage measurements. These system voltage measurements can be sourced from three dedicated analog inputs (IN1L/AUX1, IN1R/AUX2, or VBAT pins), or, alternatively, an on-chip temperature sensor that can be read by the SAR ADC.

The TLV320AIC3212 also features three full Digital Audio Serial Interfaces, each supporting I2S, DSP/TDM, RJF, LJF, and mono PCM formats. This enables the digital playback (DAC) and record (ADC) paths to select from three independent digital audio buses or chips.

The device is available in the 4.81 mm × 4.81 mm × 0.625 mm 81-Ball WCSP (YZF) package.

다운로드 스크립트와 함께 비디오 보기 동영상

관심 가지실만한 유사 제품

open-in-new 대안 비교
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
TLV320AIC3262 활성 miniDSP, 스테레오 클래스 D 스피커, DirectPath 헤드폰 포함 저전력 스테레오 코덱 With DSP higher channel count

기술 자료

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TLV320AIC3212EVM-U — TLV320AIC3212 평가 모듈

The TLV320AIC3212EVM-U is a complete evaluation module for the TLV320AIC3212 Audio Codec, which is a Low Power Stereo Codec, Integrated Class-D Speakers, Earpiece Driver and DirectPath™ Stereo Headphone Outputs. With three audio serial interfaces, the AIC3212 also allows for multiple connections (...)

사용 설명서: PDF
TI.com에서 구매 불가
드라이버 또는 라이브러리

TLV320AIC32XX-DRIVERS — TLV320AIC32XX 코덱 제품군 Linux 드라이버 지원

These Linux drivers support our low-power audio CODECs in the TLV320AIC32xx device family, and include both .c and .h files. The "Go to third party" buttons below will allow you to downlod the appropriate drivers from git.kernal.org.

Linux main line status

Available in Linux main line: Yes
Available (...)

지원 소프트웨어

SLAC523 TLV320AIC3212 Control Software

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
오디오 코덱
TLV320AIC3212 통합 클래스-D 스피커, 이어피스 드라이버, DirectPath™를 지원하는 저전력 스테레오 코덱
지원 소프트웨어

SLAC597 ARG Script Examples

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
오디오 코덱
TLV320AIC3212 통합 클래스-D 스피커, 이어피스 드라이버, DirectPath™를 지원하는 저전력 스테레오 코덱 TLV320AIC3262 miniDSP, 스테레오 클래스 D 스피커, DirectPath 헤드폰 포함 저전력 스테레오 코덱
시뮬레이션 모델

TLV320AIC3212 IBIS Model

SLAM151.ZIP (190 KB) - IBIS Model
시뮬레이션 툴

PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®

TI용 PSpice®는 아날로그 회로의 기능을 평가하는 데 사용되는 설계 및 시뮬레이션 환경입니다. 완전한 기능을 갖춘 이 설계 및 시뮬레이션 제품군은 Cadence®의 아날로그 분석 엔진을 사용합니다. 무료로 제공되는 TI용 PSpice에는 아날로그 및 전력 포트폴리오뿐 아니라 아날로그 행동 모델에 이르기까지 업계에서 가장 방대한 모델 라이브러리 중 하나가 포함되어 있습니다.

TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
패키지 CAD 기호, 풋프린트 및 3D 모델
DSBGA (YZF) 81 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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