제품 상세 정보

DSP type 1 C64x DSP (max) (MHz) 400 CPU 32-/64-bit Rating Catalog Operating temperature range (°C) to
DSP type 1 C64x DSP (max) (MHz) 400 CPU 32-/64-bit Rating Catalog Operating temperature range (°C) to
OMFCBGA (GTS) 288 529 mm² 23 x 23 OMFCBGA (ZTS) 288 529 mm² 23 x 23
  • High-Performance Fixed-Point Digital Signal Processor (TMS320C6413/C6410)
    • TMS320C6413
      • 2-ns Instruction Cycle Time
      • 500-MHz Clock Rate
      • 4000 MIPS
    • TMS320C6410
      • 2.5-ns Instruction Cycle Time
      • 400-MHz Clock Rate
      • 3200 MIPS
    • Eight 32-Bit Instructions/Cycle
    • Fully Software-Compatible With C64x™
    • Extended Temperature Devices Available
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x™ DSP Core
    • Eight Highly Independent Functional Units With VelociTI.2™ Extensions:
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
  • Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • VelociTI.2™ Increased Orthogonality
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x™ DSP Core
  • L1/L2 Memory Architecture
    • 128K-Bit (16K-Byte) L1P Program Cache (Direct Mapped)
    • 128K-Bit (16K-Byte) L1D Data Cache (2-Way Set-Associative)
    • 2M-Bit (256K-Byte) L2 Unified Mapped RAM/Cache [C6413] (Flexible RAM/Cache Allocation)
    • 1M-Bit (128K-Byte) L2 Unified Mapped RAM/Cache [C6410] (Flexible RAM/Cache Allocation)
  • Endianess: Little Endian, Big Endian
  • 32-Bit External Memory Interface (EMIF)
    • Glueless Interface to Asynchronous Memories (SRAM and EPROM) and Synchronous Memories (SDRAM, SBSRAM, ZBT SRAM, and FIFO)
    • 512M-Byte Total Addressable External Memory Space
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
  • Host-Port Interface (HPI) [32-/16-Bit]
  • Two Multichannel Audio Serial Ports (McASPs) - with Six Serial Data Pins each
  • Two Inter-Integrated Circuit (I2C) Buses
    • Additional GPIO Capability
  • Two Multichannel Buffered Serial Ports
  • Three 32-Bit General-Purpose Timers
  • Sixteen General-Purpose I/O (GPIO) Pins
  • Flexible PLL Clock Generator
  • On-Chip Fundamental Oscillator
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 288-Pin Ball Grid Array (BGA) Package (GTS and ZTS Suffixes), 1.0-mm Ball Pitch
  • 0.13-µm/6-Level Cu Metal Process (CMOS)
  • 3.3-V I/Os, 1.2-V Internal

VelociTI.2, VelociTI, and TMS320C64x are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C6000, and C6000 are trademarks of Texas Instruments.

  • High-Performance Fixed-Point Digital Signal Processor (TMS320C6413/C6410)
    • TMS320C6413
      • 2-ns Instruction Cycle Time
      • 500-MHz Clock Rate
      • 4000 MIPS
    • TMS320C6410
      • 2.5-ns Instruction Cycle Time
      • 400-MHz Clock Rate
      • 3200 MIPS
    • Eight 32-Bit Instructions/Cycle
    • Fully Software-Compatible With C64x™
    • Extended Temperature Devices Available
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x™ DSP Core
    • Eight Highly Independent Functional Units With VelociTI.2™ Extensions:
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
  • Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • VelociTI.2™ Increased Orthogonality
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x™ DSP Core
  • L1/L2 Memory Architecture
    • 128K-Bit (16K-Byte) L1P Program Cache (Direct Mapped)
    • 128K-Bit (16K-Byte) L1D Data Cache (2-Way Set-Associative)
    • 2M-Bit (256K-Byte) L2 Unified Mapped RAM/Cache [C6413] (Flexible RAM/Cache Allocation)
    • 1M-Bit (128K-Byte) L2 Unified Mapped RAM/Cache [C6410] (Flexible RAM/Cache Allocation)
  • Endianess: Little Endian, Big Endian
  • 32-Bit External Memory Interface (EMIF)
    • Glueless Interface to Asynchronous Memories (SRAM and EPROM) and Synchronous Memories (SDRAM, SBSRAM, ZBT SRAM, and FIFO)
    • 512M-Byte Total Addressable External Memory Space
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
  • Host-Port Interface (HPI) [32-/16-Bit]
  • Two Multichannel Audio Serial Ports (McASPs) - with Six Serial Data Pins each
  • Two Inter-Integrated Circuit (I2C) Buses
    • Additional GPIO Capability
  • Two Multichannel Buffered Serial Ports
  • Three 32-Bit General-Purpose Timers
  • Sixteen General-Purpose I/O (GPIO) Pins
  • Flexible PLL Clock Generator
  • On-Chip Fundamental Oscillator
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 288-Pin Ball Grid Array (BGA) Package (GTS and ZTS Suffixes), 1.0-mm Ball Pitch
  • 0.13-µm/6-Level Cu Metal Process (CMOS)
  • 3.3-V I/Os, 1.2-V Internal

VelociTI.2, VelociTI, and TMS320C64x are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C6000, and C6000 are trademarks of Texas Instruments.

The TMS320C64x™ DSPs (including the TMS320C6413, TMS320C6410 devices) are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The TMS320C6413 and TMS320C6410 (C6413 and C6410) devices are based on the second-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture (VelociTI.2™) developed by Texas Instruments (TI)™ The high-performance, lower-cost C6413/C6410 DSPs enable customers to reduce system costs for telecom, medical, industrial, office, and photo lab equipment. The C64x™ is a code-compatible member of the C6000™ DSP platform.

With performance of up to 4000 million instructions per second (MIPS) at a clock rate of 500 MHz, the C6413 device offers cost-effective solutions to high-performance DSP programming challenges.

With performance of up to 3200 million instructions per second (MIPS) at a clock rate of 400 MHz, the C6410 device offers cost-effective solutions to high-performance DSP programming challenges. The C6410 device also provides excellent value for packet telephony and for other cost-sensitive applications demanding high performance. The C6410 device also provides excellent value for packet telephony and to other cost-sensitive applications demanding high performance

The C6413/C6410 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x™ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs)— with VelociTI.2™ extensions. The VelociTI.2™ extensions in the eight functional units include new instructions to accelerate the performance in video and imaging applications and extend the parallelism of the VelociTI™ architecture. The C6413 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2000 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4000 MMACS. The C6410 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 1600 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 3200 MMACS. The C6413/C6410 DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000™ DSP platform devices.

The C6413/C6410 uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The Level 1 program cache (L1P) is a 128-Kbit direct mapped cache and the Level 1 data cache (L1D) is a 128-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 2-Mbit memory space that is shared between program and data space [for C6413 device] and the Level 2 memory/cache (L2) consists of an 1-Mbit memory space that is shared between program and data space [for C6410 device]. L2 memory can be configured as mapped memory, cache, or combinations of the two. The peripheral set includes: two multichannel buffered audio serial ports (McASPs); two inter-integrated circuit bus modules (I2Cs) ; two multichannel buffered serial ports (McBSPs); three 32-bit general-purpose timers; a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a 16-pin general-purpose input/output port (GP0) with programmable interrupt/event generation modes; and a 32-bit glueless external memory interface (EMIFA), which is capable of interfacing to synchronous and asynchronous memories and peripherals.

The McASP port supports one transmit and one receive clock zone, with eight serial data pins which can be individually allocated to any of the two zones. The serial port supports time-division multiplexing on each pin from 2 to 32 time slots. The C6413/C6410 has sufficient bandwidth to support all 8 serial data pins transmitting a 192-kHz stereo signal. Serial data in each zone may be transmitted and received on multiple serial data pins simultaneously and formatted in a multitude of variations on the Philips Inter-IC Sound (I2S) format.

In addition, the McASP transmitter may be programmed to output multiple S/PDIF, IEC60958, AES-3, CP-430 encoded data channels simultaneously, with a single RAM containing the full implementation of user data and channel status fields.

McASP also provides extensive error-checking and recovery features, such as the bad clock detection circuit for each high-frequency master clock which verifies that the master clock is within a programmed frequency range.

The I2C ports on the TMS320C6413/C6410 allows the DSP to easily control peripheral devices and communicate with a host processor. In addition, the standard multichannel buffered serial port (McBSP) may be used to communicate with serial peripheral interface (SPI) mode peripheral devices.

TheC6413/C6410 has a complete set of development tools which includes: a new C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

The TMS320C64x™ DSPs (including the TMS320C6413, TMS320C6410 devices) are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The TMS320C6413 and TMS320C6410 (C6413 and C6410) devices are based on the second-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture (VelociTI.2™) developed by Texas Instruments (TI)™ The high-performance, lower-cost C6413/C6410 DSPs enable customers to reduce system costs for telecom, medical, industrial, office, and photo lab equipment. The C64x™ is a code-compatible member of the C6000™ DSP platform.

With performance of up to 4000 million instructions per second (MIPS) at a clock rate of 500 MHz, the C6413 device offers cost-effective solutions to high-performance DSP programming challenges.

With performance of up to 3200 million instructions per second (MIPS) at a clock rate of 400 MHz, the C6410 device offers cost-effective solutions to high-performance DSP programming challenges. The C6410 device also provides excellent value for packet telephony and for other cost-sensitive applications demanding high performance. The C6410 device also provides excellent value for packet telephony and to other cost-sensitive applications demanding high performance

The C6413/C6410 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x™ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs)— with VelociTI.2™ extensions. The VelociTI.2™ extensions in the eight functional units include new instructions to accelerate the performance in video and imaging applications and extend the parallelism of the VelociTI™ architecture. The C6413 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2000 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4000 MMACS. The C6410 can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 1600 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 3200 MMACS. The C6413/C6410 DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000™ DSP platform devices.

The C6413/C6410 uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The Level 1 program cache (L1P) is a 128-Kbit direct mapped cache and the Level 1 data cache (L1D) is a 128-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 2-Mbit memory space that is shared between program and data space [for C6413 device] and the Level 2 memory/cache (L2) consists of an 1-Mbit memory space that is shared between program and data space [for C6410 device]. L2 memory can be configured as mapped memory, cache, or combinations of the two. The peripheral set includes: two multichannel buffered audio serial ports (McASPs); two inter-integrated circuit bus modules (I2Cs) ; two multichannel buffered serial ports (McBSPs); three 32-bit general-purpose timers; a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a 16-pin general-purpose input/output port (GP0) with programmable interrupt/event generation modes; and a 32-bit glueless external memory interface (EMIFA), which is capable of interfacing to synchronous and asynchronous memories and peripherals.

The McASP port supports one transmit and one receive clock zone, with eight serial data pins which can be individually allocated to any of the two zones. The serial port supports time-division multiplexing on each pin from 2 to 32 time slots. The C6413/C6410 has sufficient bandwidth to support all 8 serial data pins transmitting a 192-kHz stereo signal. Serial data in each zone may be transmitted and received on multiple serial data pins simultaneously and formatted in a multitude of variations on the Philips Inter-IC Sound (I2S) format.

In addition, the McASP transmitter may be programmed to output multiple S/PDIF, IEC60958, AES-3, CP-430 encoded data channels simultaneously, with a single RAM containing the full implementation of user data and channel status fields.

McASP also provides extensive error-checking and recovery features, such as the bad clock detection circuit for each high-frequency master clock which verifies that the master clock is within a programmed frequency range.

The I2C ports on the TMS320C6413/C6410 allows the DSP to easily control peripheral devices and communicate with a host processor. In addition, the standard multichannel buffered serial port (McBSP) may be used to communicate with serial peripheral interface (SPI) mode peripheral devices.

TheC6413/C6410 has a complete set of development tools which includes: a new C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

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유형 직함 날짜
* Data sheet TMS320C6413, TMS320C6410 Fixed-Point Digital Signal Processors datasheet (Rev. F) 2006/01/16
* Errata TMS320C6413, TMS320C6410 DSPs Silicon Errata (Rev. C) 2004/11/24
Application note How to Migrate CCS 3.x Projects to the Latest CCS (Rev. A) PDF | HTML 2021/05/19
User guide TMS320 DSP/BIOS v5.42 User's Guide (Rev. I) 2012/10/09
User guide TMS320C6000 Assembly Language Tools v 7.4 User's Guide (Rev. W) 2012/08/21
User guide TMS320C6000 Optimizing Compiler v 7.4 User's Guide (Rev. U) 2012/08/21
User guide Emulation and Trace Headers Technical Reference Manual (Rev. I) 2012/08/09
Application note Introduction to TMS320C6000 DSP Optimization 2011/10/06
User guide TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (Rev. J) 2010/07/30
User guide TMS320C6000 Assembly Language Tools v 7.0 User's Guide (Rev. S) 2010/03/18
User guide TMS320C6000 Optimizing Compiler v 7.0 User's Guide (Rev. Q) 2010/03/18
User guide TMS320C6000 DSP Peripherals Overview Reference Guide (Rev. Q) 2009/07/02
Application note Common Object File Format (COFF) 2009/04/15
User guide TMS320C6000 DSP Multi-channel Audio Serial Port (McASP) Reference Guide (Rev. J) 2008/11/20
User guide TMS320C6000 Assembly Language Tools v 6.1 User's Guide (Rev. Q) 2008/05/15
User guide TMS320C6000 Optimizing Compiler v 6.1 User's Guide (Rev. O) 2008/05/15
Application note TMS320C6000 EMIF-to-External SDRAM Interface (Rev. E) 2007/09/04
Application note Thermal Considerations for the DM64xx, DM64x, and C6000 Devices 2007/05/20
User guide TMS320C6000 DSP External Memory Interface (EMIF) Reference Guide (Rev. E) 2007/04/11
Product overview TMS320C6000 DSP TCP/IP Stack Software (Rev. C) 2007/04/04
User guide TMS320C6000 DSP Inter-Integrated Circuit (I2C) Module Reference Guide (Rev. D) 2007/03/26
User guide TMS320C6000 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (Rev. G) 2006/12/14
User guide TMS320C6000 DSP Enhanced Direct Memory Access (EDMA) Controller Reference Guide (Rev. C) 2006/11/15
User guide TMS320C64x DSP Two-Level Internal Memory Reference Guide (Rev. C) 2006/02/28
User guide TMS320C6000 DSP Host-Post Interface (HPI) Reference Guide (Rev. C) 2006/01/01
Application note TMS320C6410 Hardware Designer's Resource Guide (Rev. B) 2005/10/24
Application note Migrating from TMS320C64x to TMS320C64x+ (Rev. A) 2005/10/20
User guide TMS320C6000 DSP Power-Down Logic and Modes Reference Guide (Rev. C) 2005/03/01
User guide TMS320C6000 DSP 32-bit Timer Reference Guide (Rev. B) 2005/01/25
Application note TMS320C6410/13 Power Consumption Summary 2004/09/20
Application note Use and Handling of Semiconductor Packages With ENIG Pad Finishes 2004/08/31
User guide TMS320C6000 Chip Support Library API Reference Guide (Rev. J) 2004/08/13
User guide TMS320C6410/13/18 DSP Inter-Integrated Circuit (I2C) Module Addendum to SPRU175 (Rev. A) 2004/08/13
Application note TMS320C64x Reference Design 2004/05/12
Application note TMS320C6000 Tools: Vector Table and Boot ROM Creation (Rev. D) 2004/04/26
Application note TMS320C6000 Board Design: Considerations for Debug (Rev. C) 2004/04/21
User guide TMS320C6000 DSP General-Purpose Input/Output (GPIO) Reference Guide (Rev. A) 2004/03/25
Application note TMS320C6000 McBSP Initialization (Rev. C) 2004/03/08
Application note TMS320C6000 EDMA IO Scheduling and Performance 2004/03/05
Application note TMS320C64x DSP Host Port Interface (HPI) Performance 2003/10/24
Application note TMS320C6000 EMIF to TMS320C6000 Host Port Interface (Rev. B) 2003/09/12
User guide TMS320C6000 DSP Designing for JTAG Emulation Reference Guide 2003/07/31
User guide TMS320C6000 DSP Cache User's Guide (Rev. A) 2003/05/05
Application note Using IBIS Models for Timing Analysis (Rev. A) 2003/04/15
Application note TMS320C6000 McBSP Interface to an ST-BUS Device (Rev. B) 2002/06/04
Application note TMS320C6000 Board Design for JTAG (Rev. C) 2002/04/02
Application note TMS320C6000 EMIF to External Flash Memory (Rev. A) 2002/02/13
Application note Cache Usage in High-Performance DSP Applications with the TMS320C64x 2001/12/13
Application note Using a TMS320C6000 McBSP for Data Packing (Rev. A) 2001/10/31
Application note TMS320C6000 Enhanced DMA: Example Applications (Rev. A) 2001/10/24
Application note TMS320C6000 Host Port to MC68360 Interface (Rev. A) 2001/09/30
Application note TMS320C6000 EMIF to External Asynchronous SRAM Interface (Rev. A) 2001/08/31
Application note TMS320C6000 Host Port to the i80960 Microprocessors Interface (Rev. A) 2001/08/31
Application note Using the TMS320C6000 McBSP as a High Speed Communication Port (Rev. A) 2001/08/31
Application note TMS320C6000 McBSP to Voice Band Audio Processor (VBAP) Interface (Rev. A) 2001/07/23
Application note TMS320C6000 McBSP: AC'97 Codec Interface (TLV320AIC27) (Rev. A) 2001/07/10
Application note TMS320C6000 McBSP: Interface to SPI ROM (Rev. C) 2001/06/30
Application note TMS320C6000 Host Port to MPC860 Interface (Rev. A) 2001/06/21
Application note TMS320C6000 McBSP: IOM-2 Interface (Rev. A) 2001/05/21
Application note Circular Buffering on TMS320C6000 (Rev. A) 2000/09/12
Application note TMS320C6000 McBSP as a TDM Highway (Rev. A) 2000/09/11
Application note TMS320C6000 Multichannel Communications System Interface 2000/02/03
Application note TMS320C6000 u-Law and a-Law Companding with Software or the McBSP 2000/02/02
Application note General Guide to Implement Logarithmic and Exponential Operations on Fixed-Point 2000/01/31
Application note TMS320C6000 C Compiler: C Implementation of Intrinsics 1999/12/07
Application note TMS320C6000 HPI Boot Operation 1999/01/06

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디버그 프로브

TMDSEMU560V2STM-U — XDS560v2 시스템 추적 USB 디버그 프로브

XDS560v2는 디버그 프로브의 XDS560™ 제품군 중 최고의 성능을 가진 제품으로, 기존의 JTAG 표준(IEEE1149.1)과 cJTAG(IEEE1149.7)를 모두 지원합니다. SWD(직렬 와이어 디버그)는 지원하지 않습니다.

모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 ARM 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, (...)

TI.com에서 구매 불가
디버그 프로브

TMDSEMU560V2STM-UE — XDS560v2 시스템 추적 USB 및 이더넷 디버그 프로브

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

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드라이버 또는 라이브러리

SPRC264 — TMS320C5000/6000 이미지 라이브러리(IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
사용 설명서: PDF
드라이버 또는 라이브러리

SPRC265 — TMS320C6000 DSP 라이브러리(DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
사용 설명서: PDF
드라이버 또는 라이브러리

TELECOMLIB — 텔레콤 및 미디어 라이브러리 - TMS320C64x+ 및 TMS320C55x 프로세서를 위한 FAXLIB, VoLIB 및 AEC/AER

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

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제품 세부 정보 페이지에서 지원을 확인하십시오.

시작 다운로드 옵션
시뮬레이션 모델

C6410 GTS BSDL Model (Rev. B)

SPRM148B.ZIP (7 KB) - BSDL Model
시뮬레이션 모델

C6410 GTS IBIS Model (Rev. A)

SPRM149A.ZIP (96 KB) - IBIS Model
회로도

TMS320C6410 ORCAD Symbol

SPRC172.ZIP (5 KB)
패키지 CAD 기호, 풋프린트 및 3D 모델
OMFCBGA (GTS) 288 Ultra Librarian
OMFCBGA (ZTS) 288 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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