제품 상세 정보

DSP type 1 C64x DSP (max) (MHz) 594, 729 CPU 32-/64-bit Operating system DSP/BIOS, Linux, VLX Ethernet MAC 10/100/1000 Rating Catalog Operating temperature range (°C) -40 to 105
DSP type 1 C64x DSP (max) (MHz) 594, 729 CPU 32-/64-bit Operating system DSP/BIOS, Linux, VLX Ethernet MAC 10/100/1000 Rating Catalog Operating temperature range (°C) -40 to 105
FCBGA (CUT) 529 361 mm² 19 x 19
  • Get started today with production-ready, easy-to-use audio and video codecs for digital media processors based on DaVinci™ technology. Also available are various O/S Board Support Packages and software updates. All codecs are available for FREE evaluation. REQUEST FREE SOFTWARE!
  • High-Performance Digital Media SoC
    • 594-, 729-MHz C64x+™ Clock Rate
    • 297-, 364.5-MHz ARM926EJ-Strade; Clock Rate
    • Eight 32-Bit C64x+ Instructions/Cycle
    • 4752, 5832 C64x+ MIPS
    • Fully Software-Compatible With C64x/ARM9™
    • Supports SmartReflex™ [-594 only]
      • Class 0
      • 1.05-V and 1.2-V Adaptive Core Voltage
    • Extended Temp Available [-594 only]
    • Industrial Temp Available [-729 only]
  • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
    • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 ×: 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+™ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
      • Hardware Support for Modulo Loop Operation
  • C64x+ Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
    • Additional Instructions to Support Complex Multiplies
  • C64x+ L1/L2 Memory Architecture
    • 32K-Byte L1P Program RAM/Cache (Direct Mapped)
    • 32K-Byte L1D Data RAM/Cache (2-Way Set-Associative)
    • 128K-Byte L2 Unified Mapped RAM/Cache (Flexible RAM/Cache Allocation)
  • ARM926EJ-S Core
    • Support for 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
    • DSP Instruction Extensions and Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT™ Logic for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • 32K-Byte RAM
    • 8K-Byte ROM
  • Embedded Trace Buffer™ (ETB11™) With 4KB Memory for ARM9 Debug
  • Endianness: Little Endian for ARM and DSP
  • Dual Programmable High-Definition Video Image Co-Processor (HDVICP) Engines
    • Supports a Range of Encode, Decode, and Transcode Operations
      • H.264, MPEG2, VC1, MPEG4 SP/ASP
  • Video Port Interface (VPIF)
    • Two 8-Bit SD (BT.656), Single 16-Bit HD (BT.1120), or Single Raw (8-/10-/12-Bit) Video Capture Channels
    • Two 8-Bit SD (BT.656) or Single 16-Bit HD (BT.1120) Video Display Channels
  • Video Data Conversion Engine (VDCE)
    • Horizontal and Vertical Downscaling
    • Chroma Conversion (4:2:2↔4:2:0)
  • Two Transport Stream Interface (TSIF) Modules
    (One Parallel/Serial and One Serial Only)
    • TSIF for MPEG Transport Stream
    • Simultaneous Synchronous or Asynchronous Input/Output Streams
    • Absolute Time Stamp Detection
    • PID Filter With 7 PID Filter Tables
    • Corresponding Clock Reference Generator (CRGEN) Modules for System Time-Clock Recovery
  • External Memory Interfaces (EMIFs)
    • 297-.310.5-MHz 32-Bit DDR2 SDRAM Memory Controller With 256M-Byte Address Space (1.8-V I/O)
    • Asynchronous 16-Bit-Wide EMIF (EMIFA) With 128M-Byte Address Reach
      • Flash Memory Interfaces
        • NOR (8-/16-Bit-Wide Data)
        • NAND (8-/16-Bit-Wide Data)
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
    • Programmable Default Burst Size
  • 10/100/1000 Mb/s Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • Supports MII and GMII Media Independent Interfaces
    • Management Data I/O (MDIO) Module
  • USB Port With Integrated 2.0 PHY
    • USB 2.0 High-/Full-Speed Client
    • USB 2.0 High-/Full-/Low-Speed Host (Mini-Host, Supporting One External Device)
  • 32-Bit, 33-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface
    • Conforms to PCI Specification 2.3
  • Two 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit Watchdog Timer
  • Three Configurable UART/IrDA/CIR Modules (One With Modem Control Signals)
    • Supports up to 1.8432 Mbps UART
    • SIR and MIR (0.576 MBAUD)
    • CIR With Programmable Data Encoding
  • One Serial Peripheral Interface (SPI) With Two Chip-Selects
  • Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • Two Multichannel Audio Serial Ports (McASPs)
    • One Four-Serializer Transmit/Receive Port
    • One Single DIT Transmit Port for S/PDIF
  • 32-Bit Host Port Interface (HPI)
  • VLYNQ™ Interface (FPGA Interface)
  • Two Pulse Width Modulator (PWM) Outputs
  • ATA/ATAPI I/F (ATA/ATAPI-6 Specification)
  • Up to 33 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
  • On-Chip ARM ROM Bootloader (RBL)
  • Individual Power-Saving Modes for ARM/DSP
  • Flexible PLL Clock Generators
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 529-Pin Pb-Free BGA Package (CUT Suffix), 0.8-mm Ball Pitch
  • 0.09-µm/7-Level Cu Metal Process (CMOS)
  • 3.3-V and 1.8-V I/O, 1.2/1.05-V Internal

All trademarks are the property of their respective owners.

  • Get started today with production-ready, easy-to-use audio and video codecs for digital media processors based on DaVinci™ technology. Also available are various O/S Board Support Packages and software updates. All codecs are available for FREE evaluation. REQUEST FREE SOFTWARE!
  • High-Performance Digital Media SoC
    • 594-, 729-MHz C64x+™ Clock Rate
    • 297-, 364.5-MHz ARM926EJ-Strade; Clock Rate
    • Eight 32-Bit C64x+ Instructions/Cycle
    • 4752, 5832 C64x+ MIPS
    • Fully Software-Compatible With C64x/ARM9™
    • Supports SmartReflex™ [-594 only]
      • Class 0
      • 1.05-V and 1.2-V Adaptive Core Voltage
    • Extended Temp Available [-594 only]
    • Industrial Temp Available [-729 only]
  • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
    • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 ×: 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+™ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
      • Hardware Support for Modulo Loop Operation
  • C64x+ Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
    • Additional Instructions to Support Complex Multiplies
  • C64x+ L1/L2 Memory Architecture
    • 32K-Byte L1P Program RAM/Cache (Direct Mapped)
    • 32K-Byte L1D Data RAM/Cache (2-Way Set-Associative)
    • 128K-Byte L2 Unified Mapped RAM/Cache (Flexible RAM/Cache Allocation)
  • ARM926EJ-S Core
    • Support for 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
    • DSP Instruction Extensions and Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT™ Logic for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • 32K-Byte RAM
    • 8K-Byte ROM
  • Embedded Trace Buffer™ (ETB11™) With 4KB Memory for ARM9 Debug
  • Endianness: Little Endian for ARM and DSP
  • Dual Programmable High-Definition Video Image Co-Processor (HDVICP) Engines
    • Supports a Range of Encode, Decode, and Transcode Operations
      • H.264, MPEG2, VC1, MPEG4 SP/ASP
  • Video Port Interface (VPIF)
    • Two 8-Bit SD (BT.656), Single 16-Bit HD (BT.1120), or Single Raw (8-/10-/12-Bit) Video Capture Channels
    • Two 8-Bit SD (BT.656) or Single 16-Bit HD (BT.1120) Video Display Channels
  • Video Data Conversion Engine (VDCE)
    • Horizontal and Vertical Downscaling
    • Chroma Conversion (4:2:2↔4:2:0)
  • Two Transport Stream Interface (TSIF) Modules
    (One Parallel/Serial and One Serial Only)
    • TSIF for MPEG Transport Stream
    • Simultaneous Synchronous or Asynchronous Input/Output Streams
    • Absolute Time Stamp Detection
    • PID Filter With 7 PID Filter Tables
    • Corresponding Clock Reference Generator (CRGEN) Modules for System Time-Clock Recovery
  • External Memory Interfaces (EMIFs)
    • 297-.310.5-MHz 32-Bit DDR2 SDRAM Memory Controller With 256M-Byte Address Space (1.8-V I/O)
    • Asynchronous 16-Bit-Wide EMIF (EMIFA) With 128M-Byte Address Reach
      • Flash Memory Interfaces
        • NOR (8-/16-Bit-Wide Data)
        • NAND (8-/16-Bit-Wide Data)
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
    • Programmable Default Burst Size
  • 10/100/1000 Mb/s Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • Supports MII and GMII Media Independent Interfaces
    • Management Data I/O (MDIO) Module
  • USB Port With Integrated 2.0 PHY
    • USB 2.0 High-/Full-Speed Client
    • USB 2.0 High-/Full-/Low-Speed Host (Mini-Host, Supporting One External Device)
  • 32-Bit, 33-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface
    • Conforms to PCI Specification 2.3
  • Two 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit Watchdog Timer
  • Three Configurable UART/IrDA/CIR Modules (One With Modem Control Signals)
    • Supports up to 1.8432 Mbps UART
    • SIR and MIR (0.576 MBAUD)
    • CIR With Programmable Data Encoding
  • One Serial Peripheral Interface (SPI) With Two Chip-Selects
  • Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • Two Multichannel Audio Serial Ports (McASPs)
    • One Four-Serializer Transmit/Receive Port
    • One Single DIT Transmit Port for S/PDIF
  • 32-Bit Host Port Interface (HPI)
  • VLYNQ™ Interface (FPGA Interface)
  • Two Pulse Width Modulator (PWM) Outputs
  • ATA/ATAPI I/F (ATA/ATAPI-6 Specification)
  • Up to 33 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
  • On-Chip ARM ROM Bootloader (RBL)
  • Individual Power-Saving Modes for ARM/DSP
  • Flexible PLL Clock Generators
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 529-Pin Pb-Free BGA Package (CUT Suffix), 0.8-mm Ball Pitch
  • 0.09-µm/7-Level Cu Metal Process (CMOS)
  • 3.3-V and 1.8-V I/O, 1.2/1.05-V Internal

All trademarks are the property of their respective owners.

The TMS320DM6467 (also referenced as DM6467) leverages TI's DaVinci™ technology to meet the networked media encode and decode digital media processing needs of next-generation embedded devices.

The DM6467 enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the DM6467 provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C64x+ DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core incorporates:

  • A coprocessor 15 (CP15) and protection module
  • Data and program Memory Management Units (MMUs) with table look-aside buffers.
  • Separate 16K-byte instruction and 8K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT).

The TMS320C64x+™ DSPs are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. It is based on an enhanced version of the second-generation high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSP cores an excellent choice for digital media applications. The C64x is a code-compatible member of the C6000™ DSP platform. The TMS320C64x+ DSP is an enhancement of the C64x+ DSP with added functionality and an expanded instruction set.

Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and C64x+ CPU, respectively.

With performance of up to 5832 million instructions per second (MIPS) at a clock rate of 729 MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units-two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in video and imaging applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2376 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4752 MMACS. For more details on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide(literature number SPRU732).

The DM6467 also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The DM6467 core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 256K-bit direct mapped cache and the Level 1 data cache (L1D) is a 640K-bit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 512K-bit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.

The peripheral set includes: a configurable video port; a 10/100/1000 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; a 4-bit transfer/4-bit receive VLYNQ interface; an inter-integrated circuit (I2C) Bus interface; a multichannel audio serial port (McASP0) with 4 serializers; a secondary multichannel audio serial port (McASP1) with a single transmit serializer; 2 64-bit general-purpose timers each configurable as 2 independent 32-bit timers; 1 64-bit watchdog timer; a configurable 32-bit host port interface (HPI); up to 33-pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART/IrDA/CIR interfaces with modem interface signals on UART0; 2 pulse width modulator (PWM) peripherals; an ATA/ATAPI-6 interface; a 33-MHz peripheral component interface (PCI); and 2 external memory interfaces: an asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher speed synchronous memory interface for DDR2.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the DM6467 and the network. The DM6467 EMAC support both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode; and 1000Base-TX (1 Gbps) in full-duplex mode with hardware flow control and quality of service (QOS) support.

The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system. Once a PHY candidate has been selected by the ARM, the MDIO module transparently monitors its link state by reading the PHY status register. Link change events are stored in the MDIO module and can optionally interrupt the ARM, allowing the ARM to poll the link status of the device without continuously performing costly MDIO accesses.

The PCI, HPI, I2C, SPI, USB2.0, and VLYNQ ports allow the DM6467 to easily control peripheral devices and/or communicate with host processors.

The DM6467 also includes a High-Definition Video/Imaging Co-processor (HDVICP) and Video Data Conversion Engine (VDCE) to offload many video and imaging processing tasks from the DSP core, making more DSP MIPS available for common video and imaging algorithms. For more information on the HDVICP enhanced codecs, such as H.264 and MPEG4, please contact your nearest TI sales representative.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The DM6467 has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code

The TMS320DM6467 (also referenced as DM6467) leverages TI's DaVinci™ technology to meet the networked media encode and decode digital media processing needs of next-generation embedded devices.

The DM6467 enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the DM6467 provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C64x+ DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core incorporates:

  • A coprocessor 15 (CP15) and protection module
  • Data and program Memory Management Units (MMUs) with table look-aside buffers.
  • Separate 16K-byte instruction and 8K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT).

The TMS320C64x+™ DSPs are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. It is based on an enhanced version of the second-generation high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSP cores an excellent choice for digital media applications. The C64x is a code-compatible member of the C6000™ DSP platform. The TMS320C64x+ DSP is an enhancement of the C64x+ DSP with added functionality and an expanded instruction set.

Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and C64x+ CPU, respectively.

With performance of up to 5832 million instructions per second (MIPS) at a clock rate of 729 MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units-two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in video and imaging applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2376 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4752 MMACS. For more details on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide(literature number SPRU732).

The DM6467 also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The DM6467 core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 256K-bit direct mapped cache and the Level 1 data cache (L1D) is a 640K-bit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 512K-bit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.

The peripheral set includes: a configurable video port; a 10/100/1000 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; a 4-bit transfer/4-bit receive VLYNQ interface; an inter-integrated circuit (I2C) Bus interface; a multichannel audio serial port (McASP0) with 4 serializers; a secondary multichannel audio serial port (McASP1) with a single transmit serializer; 2 64-bit general-purpose timers each configurable as 2 independent 32-bit timers; 1 64-bit watchdog timer; a configurable 32-bit host port interface (HPI); up to 33-pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART/IrDA/CIR interfaces with modem interface signals on UART0; 2 pulse width modulator (PWM) peripherals; an ATA/ATAPI-6 interface; a 33-MHz peripheral component interface (PCI); and 2 external memory interfaces: an asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher speed synchronous memory interface for DDR2.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the DM6467 and the network. The DM6467 EMAC support both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode; and 1000Base-TX (1 Gbps) in full-duplex mode with hardware flow control and quality of service (QOS) support.

The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system. Once a PHY candidate has been selected by the ARM, the MDIO module transparently monitors its link state by reading the PHY status register. Link change events are stored in the MDIO module and can optionally interrupt the ARM, allowing the ARM to poll the link status of the device without continuously performing costly MDIO accesses.

The PCI, HPI, I2C, SPI, USB2.0, and VLYNQ ports allow the DM6467 to easily control peripheral devices and/or communicate with host processors.

The DM6467 also includes a High-Definition Video/Imaging Co-processor (HDVICP) and Video Data Conversion Engine (VDCE) to offload many video and imaging processing tasks from the DSP core, making more DSP MIPS available for common video and imaging algorithms. For more information on the HDVICP enhanced codecs, such as H.264 and MPEG4, please contact your nearest TI sales representative.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The DM6467 has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code

다운로드 스크립트와 함께 비디오 보기 동영상
Support through a third party

This product does not have ongoing direct design support from TI. For support while working through your design, you may contact one of the following third parties: D3 Engineering, elnfochips, Ittiam Systems, Path Partner Technology, or Z3 Technologies.

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
55개 모두 보기
유형 직함 날짜
* Data sheet TMS320DM6467 Digital Media System-on-Chip datasheet (Rev. H) 2012/07/11
* Errata TMS320DM6467 DMSoC Silicon Errata Silicon Revisions 3.0, 1.1, and 1.0 (Rev. G) 2010/11/02
Application note High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 2023/02/24
Application note Introduction to TMS320C6000 DSP Optimization 2011/10/06
User guide TMS320DM646x DMSoC Inter-Integrated Circuit (I2C) Module User's Guide (Rev. D) 2011/03/25
User guide TMS320DM646x DMSoC DDR2 Memory Controller User's Guide (Rev. E) 2011/03/21
User guide TMS320DM646x DMSoC Serial Peripheral Interface (SPI) User's Guide (Rev. B) 2011/03/17
Application note Using the TMS320DM646x DMSoC Bootloader (Rev. D) 2011/03/04
User guide TMS320DM646x DMSoC Enhanced Direct Memory Access Controller (EDMA) User's Guide (Rev. B) 2011/01/14
User guide TMS320DM646x DMSoC 64-Bit Timer User's Guide (Rev. B) 2011/01/07
User guide TMS320DM646x DMSoC EMAC/MDIO Module User's Guide (Rev. A) 2010/12/23
User guide TMS320DM646x DMSoC Pulse-Width Modulator (PWM) User's Guide (Rev. A) 2010/08/06
User guide TMS320DM646x DMSoC ARM Subsystem Reference Guide (Rev. E) 2010/08/04
User guide TMS320C64x+ DSP Megamodule Reference Guide (Rev. K) 2010/08/03
User guide TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (Rev. J) 2010/07/30
Application note Migrating from TMS320DM6467 to TMS320DM6467T (Rev. B) 2010/06/08
Application note Using the Video Port of TMS320DM646x (Rev. A) 2010/04/06
Application note USB Compliance Checklist (Rev. A) 2010/03/10
User guide TMS320DM646x DMSoC Universal Serial Bus (USB) Controller User's Guide (Rev. E) 2009/11/20
User guide TMS320DM646x DMSoC Peripheral Component Interconnect (PCI) User's Guide (Rev. B) 2009/11/16
User guide TMS320DM646x DMSoC Peripherals Overview Reference Guide (Rev. B) 2009/11/16
User guide TMS320DM646x DMSoC Video Port Interface (VPIF) User's Guide (Rev. D) 2009/11/16
Application note TMS320DM6467 Power Consumption Summary (Rev. B) 2009/10/24
Application note Running a TMS320C64x+ Codec Across TMS320C64x+ Based DSP Platforms 2009/09/24
User guide TMS320DM646x DMSoC Video Data Conversion Engine (VDCE) User's Guide (Rev. A) 2009/08/26
User guide TMS320DM646x DMSoC Asynchronous External Memory Interface (EMIF) User's Guide (Rev. C) 2009/07/14
Application note LSP 2.10 DaVinci Linux Drivers (Rev. A) 2009/07/08
User guide TMS320DM646x DMSoC Universal Asynchronous Receiver/Transmitter (UART) User's Gde (Rev. D) 2009/06/21
Application note TMS320DM6467 SoC Architecture and Throughput Overview (Rev. B) 2009/06/10
User guide TMS320DM646x DMSoC General-Purpose Input/Output (GPIO) User's Guide (Rev. A) 2009/03/13
User guide TMS320C64x+ DSP Cache User's Guide (Rev. B) 2009/02/11
Application note Multiple TMS320DM6467 PCI Interface 2009/02/10
Application note PCI Express to TMS320DM646x PCI Interface Through XIO2000A Bridge 2009/02/03
User guide TMS320DM646x DMSoC ATA Controller User's Guide (Rev. A) 2009/01/27
User guide TMS320DM6467 DVEVM v2.0 Getting Started Guide (Rev. D) 2008/12/31
Application note Migrating from TMS320DM642 to TMS320DM6467 2008/11/17
Application note Migrating from TMS320DM6446 to TMS320DM6467 2008/11/17
User guide TMS320DM646x DMSoC Host Port Interface (HPI) User's Guide (Rev. A) 2008/11/07
More literature DaVinci Technology Overview Brochure (Rev. B) 2008/09/27
Application note Enabling SmartReflex on the TMS320DM6467 2008/09/10
More literature End-to-end video infrastructure solutions 2008/08/29
Application note Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A) 2008/07/17
User guide TMS320DM646x DMSoC Transport Stream Interface (TSIF) Module User's Guide (Rev. E) 2008/07/02
Application note TMS320DM6467 Universal Serial Bus Downstream Host Compliance Testing 2008/05/30
Application note Building a Small Embedded Linux Kernel Example (Rev. A) 2008/05/27
Application note HDMI Transmitter/Receiver Support on TMS320DM6467 2008/05/05
User guide TMS320DM646x DMSoC Multichannel Audio Serial Port (McASP) User's Guide (Rev. B) 2008/03/13
Application note TMS320DM6467 Universal Serial Bus Upstream Device Compliance Testing 2008/01/30
More literature DaVinci Newsletter 4Q 2007 - DM6467 Issue 2007/12/03
More literature TMS320DM6467 DaVinci FAQ 2007/12/03
User guide TMS320DM646x DMSoC Clock Reference Generator (CRGEN) User's Guide 2007/12/03
User guide TMS320DM646x DMSoC DSP Subsystem Reference Guide 2007/12/03
User guide TMS320DM646x DMSoC VLYNQ Port User's Guide 2007/12/03
Application note Thermal Considerations for the DM64xx, DM64x, and C6000 Devices 2007/05/20
Application note Migrating from TMS320C64x to TMS320C64x+ (Rev. A) 2005/10/20

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

디버그 프로브

TMDSEMU200-U — XDS200 USB 디버그 프로브

XDS200은 TI 임베디드 디바이스 디버깅에 사용되는 디버그 프로브(에뮬레이터)입니다. XDS200은 저렴한 XDS110 및 고성능 XDS560v2에 비해 저렴한 비용으로 우수한 성능을 균형 있게 제공합니다. 단일 포드에서 광범위한 표준(IEEE1149.1, IEEE1149.7, SWD)을 지원합니다. 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 Arm® 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 (...)

TI.com에서 구매 불가
디버그 프로브

TMDSEMU560V2STM-U — XDS560v2 시스템 추적 USB 디버그 프로브

XDS560v2는 디버그 프로브의 XDS560™ 제품군 중 최고의 성능을 가진 제품으로, 기존의 JTAG 표준(IEEE1149.1)과 cJTAG(IEEE1149.7)를 모두 지원합니다. SWD(직렬 와이어 디버그)는 지원하지 않습니다.

모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 ARM 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, (...)

TI.com에서 구매 불가
디버그 프로브

TMDSEMU560V2STM-UE — XDS560v2 시스템 추적 USB 및 이더넷 디버그 프로브

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

TI.com에서 구매 불가
소프트웨어 개발 키트(SDK)

LINUXDVSDK-DV — Linux DVSDK(디지털 비디오 소프트웨어 개발 키트) v2x/v3x - DaVinci 디지털 미디어 프로세서

Effective Oct 2010 - Linux DVSDK v4 has been released. For DaVinci™ devices not listed above, search TI.com for your device part number; This product page will have a link to your current DVSDK.

The Linux™ Digital Video Software Development Kits (DVSDKs) enable DaVinci system integrators to (...)

애플리케이션 소프트웨어 및 프레임워크

TMDMFP — 멀티미디어 프레임워크 제품(MFP) - 코덱 엔진, 프레임워크 구성 요소 및 XDAIS

Multimedia Framework Products (MFP)

A major advantage of programmable signal processors over fixed-function devices is their ability to accelerate multiple multimedia functions and provide flexible environments to enable user customization. However, sharing scarce embedded hardware resources between (...)

사용 설명서: PDF
코드 예제 또는 데모

DEMOAPP-DM6467 — 데모 - DM6467 애플리케이션 예제 및 데모 코드

Free Example Code - TI provides proof-of-concept application code to demonstrate some of the hardware and software capabilities of its devices.

  • Click GET SOFTWARE to access Application Demo and Documentation, based on the DM6467 EVM (evaluation module).
소프트웨어 코덱

C64XPLUSCODECS — 코덱 - 비디오 및 음성 - C64x+ 기반 디바이스(OMAP35x, C645x, C647x, DM646, DM644x, DM643x)

TI 코덱은 무료이고 프로덕션 라이선스와 함께 제공되며 지금 다운로드할 수 있습니다. 모두 프로덕션급 테스트를 통해 비디오 및 음성 애플리케이션에 원활하게 통합되는 것으로 확인되었습니다. 소프트웨어 다운로드 버튼(위)을 클릭하면 테스트를 거친 최신 버전의 코덱에 액세스할 수 있습니다. 데이터시트와 릴리스 노트는 해당 페이지와 각 설치 프로그램에 있습니다.

 

 

추가 정보:

소프트웨어 코덱

DM6467CODECS Codecs for DM6467 - Software and Documentation

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into audio, video and voice applications. Click GET SOFTWARE button (above) to access the most recent, tested codec versions available. Datasheets and Release Notes (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
DSP(디지털 신호 프로세서)
TMS320DM6467 디지털 미디어 시스템 온 칩 TMS320DM6467T 디지털 미디어 시스템 온 칩
다운로드 옵션
시뮬레이션 모델

DM646x ZUT BSDL Model (Rev. A)

SPRM276A.ZIP (12 KB) - BSDL Model
시뮬레이션 모델

DM646x ZUT IBIS Model (Rev. E)

SPRM277E.ZIP (753 KB) - IBIS Model
계산 툴

SPRC815 Download: TMS320DM6467 Pin Mux Utility

The DM6467 uses a great deal of internal pin multiplexing to allow the most functionality in the smallest and lowest cost package. This utility allows the pin multiplexing registers of the device to be calculated with ease, as well as showing what peripherals can be used together. This software (...)
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
DSP(디지털 신호 프로세서)
TMS320DM6467 디지털 미디어 시스템 온 칩
회로도

TMS320DM646x Orcad Symbols

SPRR103.ZIP (10 KB)
패키지 CAD 기호, 풋프린트 및 3D 모델
FCBGA (CUT) 529 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상