TMS320DM8165

활성

DaVinci 디지털 미디어 프로세서

제품 상세 정보

DSP type 1 C674x DSP (max) (MHz) 1000 CPU 32-/64-bit Operating system Android, DSP/BIOS, Linux Ethernet MAC 2x 10/100/1000 PCIe 1 Rating Catalog Operating temperature range (°C) 0 to 0
DSP type 1 C674x DSP (max) (MHz) 1000 CPU 32-/64-bit Operating system Android, DSP/BIOS, Linux Ethernet MAC 2x 10/100/1000 PCIe 1 Rating Catalog Operating temperature range (°C) 0 to 0
FCBGA (CYG) 1031 625 mm² 25 x 25
  • High-Performance DaVinci Digital Media Processors
    • ARM® Cortex-A8 RISC Processor
      • Up to 1.20 GHz
    • C674x VLIW DSP
      • Up to 1 GHz
      • Up to 8000 MIPS and 6000 MFLOPS
      • Fully Software-Compatible with C67x+ and C64x+
  • ARM Cortex-A8 Core
    • ARMv7 Architecture
      • In-Order, Dual-Issue, Superscalar Processor Core
      • NEON Multimedia Architecture
    • Supports Integer and Floating Point (VFPv3-IEEE754 Compliant)
      • Jazelle RCT Execution Environment
  • ARM Cortex-A8 Memory Architecture
    • 32-KB Instruction and Data Caches
    • 256-KB L2 Cache
    • 64-KB RAM, 48-KB of Boot ROM
  • TMS320C674x Floating-Point VLIW DSP
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32-Bit and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision, 32-Bit) and DP (IEEE Double Precision, 64-Bit) Floating Point
      • Supports up to Four SP Adds Per Clock and Four DP Adds Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Approximate Reciprocal or Square Root Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP x SP → SP Per Clock
        • 2 SP x SP → DP Every Two Clocks
        • 2 SP x DP → DP Every Three Clocks
        • 2 DP x DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 x 32 Multiplies, Four 16 x 16-Bit Multiplies Including Complex Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle
  • C674x Two-Level Memory Architecture
    • 32-KB L1P and L1D RAM and Cache
    • 256-KB L2 Unified Mapped RAM and Caches
  • System Memory Management Unit (System MMU)
    • Maps C674x DSP and EMDA TCB Memory Accesses to System Addresses
  • 512KB of On-Chip Memory Controller (OCMC) RAM
  • Media Controller
    • Manages HDVPSS and HDVICP2 Modules
  • Up to Three Programmable High-Definition Video Image Coprocessing (HDVICP2) Engines
    • Encode, Decode, Transcode Operations
    • H.264, MPEG-2, VC-1, MPEG-4 SP and ASP
  • SGX530 3D Graphics Engine (Available Only on the DM8168 Device)
    • Delivers up to 30 MTriangles per Second
    • Universal Scalable Shader Engine
    • Direct3D Mobile, OpenGL ES 1.1 and 2.0, OpenVG 1.1, OpenMax API Support
    • Advanced Geometry DMA Driven Operation
    • Programmable HQ Image Anti-Aliasing
  • Endianness
    • ARM, DSP Instructions and Data – Little Endian
  • HD Video Processing Subsystem (HDVPSS)
    • Two 165-MHz HD Video Capture Channels
      • One 16-Bit or 24-Bit and One 16-Bit Channel
      • Each Channel Splittable Into Dual 8-Bit Capture Channels
    • Two 165-MHz HD Video Display Channels
      • One 16-Bit, 24-Bit, 30-Bit Channel and One 16-Bit Channel
    • Simultaneous SD and HD Analog Output
    • Digital HDMI 1.3 Transmitter with PHY with HDCP up to 165-MHz Pixel Clock
    • Three Graphics Layers
  • Dual 32-Bit DDR2 and DDR3 SDRAM Interfaces
    • Supports up to DDR2-800 and DDR3-1600
    • Up to Eight x8 Devices Total
    • 2GB of Total Address Space
    • Dynamic Memory Manager (DMM)
      • Programmable Multi-Zone Memory Mapping and Interleaving
      • Enables Efficient 2D Block Accesses
      • Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
      • Optimizes Interlaced Accesses
  • One PCI Express (PCIe) 2.0 Port with Integrated PHY
    • Single Port with 1 or 2 Lanes at 5.0 GT per Second
    • Configurable as Root Complex or Endpoint
  • Serial ATA (SATA) 3.0 Gbps Controller with Integrated PHYs
    • Direct Interface for Two Hard Disk Drives
    • Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
    • Supports Port Multiplier and Command-Based Switching
  • Two 10 Mbps, 100 Mbps, and 1000 Mbps Ethernet MACs (EMAC)
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • MII and GMII Media Independent Interfaces
    • Management Data I/O (MDIO) Module
  • Dual USB 2.0 Ports with Integrated PHYs
    • USB 2.0 High-Speed and Full-Speed Client
    • USB 2.0 High-Speed, Full-Speed, and Low-Speed Host
    • Supports Endpoints 0-15
  • General-Purpose Memory Controller (GPMC)
    • 8-Bit and 16-Bit Multiplexed Address and Data Bus
    • Up to 6 Chip Selects with up to 256-MB Address Space per Chip Select Pin
    • Glueless Interface to NOR Flash, NAND Flash (with BCH and Hamming Error Code Detection), SRAM and Pseudo-SRAM
    • Error Locator Module (ELM) Outside of GPMC to Provide up to 16-Bit and 512-Byte Hardware ECC for NAND
    • Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs
  • Enhanced Direct-Memory-Access (EDMA) Controller
    • Four Transfer Controllers
    • 64 Independent DMA Channels and 8 Quick DMA (QDMA) Channels
  • Seven 32-Bit General-Purpose Timers
  • One System Watchdog Timer
  • Three Configurable UART, IrDA, and CIR Modules
    • UART0 with Modem Control Signals
    • Supports up to 3.6864 Mbps UART
    • SIR, MIR, FIR (4.0 MBAUD), and CIR
  • One 40-MHz Serial Peripheral Interface (SPI) with Four Chip Selects
  • SD and SDIO Serial Interface (1-Bit and 4-Bit)
  • Dual Inter-Integrated Circuit (I2C bus) Ports
  • Three Multichannel Audio Serial Ports (McASPs)
    • One Six-Serializer Transmit and Receive Port
    • Two Dual-Serializer Transmit and Receive Ports
    • DIT-Capable For SDIF and PDIF (All Ports)
  • Multichannel Buffered Serial Port (McBSP)
    • Transmit and Receive Clocks up to 48 MHz
    • Two Clock Zones and Two Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
  • Real-Time Clock (RTC)
    • One-Time or Periodic Interrupt Generation
  • Up to 64 General-Purpose I/O (GPIO) Pins
  • On-Chip ARM ROM Bootloader (RBL)
  • Power, Reset, and Clock Management
    • SmartReflex Technology (Level 2)
    • Seven Independent Core Power Domains
    • Clock Enable and Disable Control For Subsystems and Peripherals
  • IEEE 1149.1 (JTAG) and IEEE 1149.7 (cJTAG) Compatible
  • Via Channel Technology Enables use of
    0.8-mm Design Rules
  • 40-nm CMOS Technology
  • 3.3-V Single-Ended LVCMOS I/Os (Except for DDR3 at 1.5 V, DDR2 at 1.8 V, and DEV_CLKIN at 1.8 V)
  • High-Performance DaVinci Digital Media Processors
    • ARM® Cortex-A8 RISC Processor
      • Up to 1.20 GHz
    • C674x VLIW DSP
      • Up to 1 GHz
      • Up to 8000 MIPS and 6000 MFLOPS
      • Fully Software-Compatible with C67x+ and C64x+
  • ARM Cortex-A8 Core
    • ARMv7 Architecture
      • In-Order, Dual-Issue, Superscalar Processor Core
      • NEON Multimedia Architecture
    • Supports Integer and Floating Point (VFPv3-IEEE754 Compliant)
      • Jazelle RCT Execution Environment
  • ARM Cortex-A8 Memory Architecture
    • 32-KB Instruction and Data Caches
    • 256-KB L2 Cache
    • 64-KB RAM, 48-KB of Boot ROM
  • TMS320C674x Floating-Point VLIW DSP
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32-Bit and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision, 32-Bit) and DP (IEEE Double Precision, 64-Bit) Floating Point
      • Supports up to Four SP Adds Per Clock and Four DP Adds Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Approximate Reciprocal or Square Root Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP x SP → SP Per Clock
        • 2 SP x SP → DP Every Two Clocks
        • 2 SP x DP → DP Every Three Clocks
        • 2 DP x DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 x 32 Multiplies, Four 16 x 16-Bit Multiplies Including Complex Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle
  • C674x Two-Level Memory Architecture
    • 32-KB L1P and L1D RAM and Cache
    • 256-KB L2 Unified Mapped RAM and Caches
  • System Memory Management Unit (System MMU)
    • Maps C674x DSP and EMDA TCB Memory Accesses to System Addresses
  • 512KB of On-Chip Memory Controller (OCMC) RAM
  • Media Controller
    • Manages HDVPSS and HDVICP2 Modules
  • Up to Three Programmable High-Definition Video Image Coprocessing (HDVICP2) Engines
    • Encode, Decode, Transcode Operations
    • H.264, MPEG-2, VC-1, MPEG-4 SP and ASP
  • SGX530 3D Graphics Engine (Available Only on the DM8168 Device)
    • Delivers up to 30 MTriangles per Second
    • Universal Scalable Shader Engine
    • Direct3D Mobile, OpenGL ES 1.1 and 2.0, OpenVG 1.1, OpenMax API Support
    • Advanced Geometry DMA Driven Operation
    • Programmable HQ Image Anti-Aliasing
  • Endianness
    • ARM, DSP Instructions and Data – Little Endian
  • HD Video Processing Subsystem (HDVPSS)
    • Two 165-MHz HD Video Capture Channels
      • One 16-Bit or 24-Bit and One 16-Bit Channel
      • Each Channel Splittable Into Dual 8-Bit Capture Channels
    • Two 165-MHz HD Video Display Channels
      • One 16-Bit, 24-Bit, 30-Bit Channel and One 16-Bit Channel
    • Simultaneous SD and HD Analog Output
    • Digital HDMI 1.3 Transmitter with PHY with HDCP up to 165-MHz Pixel Clock
    • Three Graphics Layers
  • Dual 32-Bit DDR2 and DDR3 SDRAM Interfaces
    • Supports up to DDR2-800 and DDR3-1600
    • Up to Eight x8 Devices Total
    • 2GB of Total Address Space
    • Dynamic Memory Manager (DMM)
      • Programmable Multi-Zone Memory Mapping and Interleaving
      • Enables Efficient 2D Block Accesses
      • Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
      • Optimizes Interlaced Accesses
  • One PCI Express (PCIe) 2.0 Port with Integrated PHY
    • Single Port with 1 or 2 Lanes at 5.0 GT per Second
    • Configurable as Root Complex or Endpoint
  • Serial ATA (SATA) 3.0 Gbps Controller with Integrated PHYs
    • Direct Interface for Two Hard Disk Drives
    • Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
    • Supports Port Multiplier and Command-Based Switching
  • Two 10 Mbps, 100 Mbps, and 1000 Mbps Ethernet MACs (EMAC)
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • MII and GMII Media Independent Interfaces
    • Management Data I/O (MDIO) Module
  • Dual USB 2.0 Ports with Integrated PHYs
    • USB 2.0 High-Speed and Full-Speed Client
    • USB 2.0 High-Speed, Full-Speed, and Low-Speed Host
    • Supports Endpoints 0-15
  • General-Purpose Memory Controller (GPMC)
    • 8-Bit and 16-Bit Multiplexed Address and Data Bus
    • Up to 6 Chip Selects with up to 256-MB Address Space per Chip Select Pin
    • Glueless Interface to NOR Flash, NAND Flash (with BCH and Hamming Error Code Detection), SRAM and Pseudo-SRAM
    • Error Locator Module (ELM) Outside of GPMC to Provide up to 16-Bit and 512-Byte Hardware ECC for NAND
    • Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs
  • Enhanced Direct-Memory-Access (EDMA) Controller
    • Four Transfer Controllers
    • 64 Independent DMA Channels and 8 Quick DMA (QDMA) Channels
  • Seven 32-Bit General-Purpose Timers
  • One System Watchdog Timer
  • Three Configurable UART, IrDA, and CIR Modules
    • UART0 with Modem Control Signals
    • Supports up to 3.6864 Mbps UART
    • SIR, MIR, FIR (4.0 MBAUD), and CIR
  • One 40-MHz Serial Peripheral Interface (SPI) with Four Chip Selects
  • SD and SDIO Serial Interface (1-Bit and 4-Bit)
  • Dual Inter-Integrated Circuit (I2C bus) Ports
  • Three Multichannel Audio Serial Ports (McASPs)
    • One Six-Serializer Transmit and Receive Port
    • Two Dual-Serializer Transmit and Receive Ports
    • DIT-Capable For SDIF and PDIF (All Ports)
  • Multichannel Buffered Serial Port (McBSP)
    • Transmit and Receive Clocks up to 48 MHz
    • Two Clock Zones and Two Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
  • Real-Time Clock (RTC)
    • One-Time or Periodic Interrupt Generation
  • Up to 64 General-Purpose I/O (GPIO) Pins
  • On-Chip ARM ROM Bootloader (RBL)
  • Power, Reset, and Clock Management
    • SmartReflex Technology (Level 2)
    • Seven Independent Core Power Domains
    • Clock Enable and Disable Control For Subsystems and Peripherals
  • IEEE 1149.1 (JTAG) and IEEE 1149.7 (cJTAG) Compatible
  • Via Channel Technology Enables use of
    0.8-mm Design Rules
  • 40-nm CMOS Technology
  • 3.3-V Single-Ended LVCMOS I/Os (Except for DDR3 at 1.5 V, DDR2 at 1.8 V, and DEV_CLKIN at 1.8 V)

The DM816x DaVinci video processors are a highly integrated, programmable platform that leverages TI's DaVinci technology to meet the processing needs of the following applications: video encode, decode, transcode, and transrate; video security; video conferencing; video infrastructure; media server; and digital signage.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The device combines programmable video and audio processing with a highly integrated peripheral set.

Key to the device are up to three high-definition video and imaging coprocessors (HDVICP2). Each coprocessor can perform a single 1080p60 H.264 encode or decode or multiple lower resolution or frame rate encodes and decodes. Multichannel HD-to-HD or HD-to-SD transcoding and multicoding are also possible. With the ability to simultaneously process 1080p60 streams, the TMS320DM816x device is a powerful solution for today's demanding HD video application requirements.

Programmability is provided by an ARM Cortex-A8 RISC CPU with NEON extension, TI C674x VLIW floating-point DSP core, and high-definition video and imaging coprocessors. The ARM processor lets developers keep control functions separate from audio and video algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software. The ARM Cortex-A8 32-bit RISC processor with NEON floating-point extension includes: 32KB of instruction cache; 32KB of data cache; 256KB of L2 cache; 48KB of public ROM, and 64KB of RAM.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections in this document and the associated peripheral reference guides. The peripheral set includes: HD video processing subsystem (HDVPSS), which provides output of simultaneous HD and SD analog video and dual HD video inputs; up to two Gigabit Ethernet MACs (10 Mbps,100, Mbps, 1000 Mbps) with GMII and MDIO interface; two USB ports with integrated 2.0 PHY; PCIe port x2 lanes GEN2 compliant interface, which allows the device to act as a PCIe root complex or device endpoint; one 6-channel McASP audio serial port (with DIT mode); two dual-channel McASP audio serial ports (with DIT mode); one McBSP multichannel buffered serial port; three UARTs with IrDA and CIR support; SPI serial interface; SD and SDIO serial interface; two I2C master and slave interfaces; up to 64 GPIO pins; seven 32-bit timers; system watchdog timer; dual DDR2 and DDR3 SDRAM interface; flexible 8-bit and 16-bit asynchronous memory interface; and up to two SATA interfaces for external storage on two disk drives or more with the use of a port multiplier.

The device also includes an SGX530 3D graphics engine (available only on the TMS320DM8168 device) to enable sophisticated GUIs and compelling user interfaces and interactions. Additionally, the device has a complete set of development tools for both the ARM and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Microsoft Windows debugger interface for visibility into source code execution.

The C674x DSP core is the high-performance floating-point DSP generation in the TMS320C6000 DSP platform. The C674x floating-point DSP processor uses 32KB of L1 program memory and 32KB of L1 data memory. Up to 32KB of L1P can be configured as program cache. The remaining is noncacheable no-wait-state program memory. Up to 32KB of L1D can be configured as data cache. The remaining is noncacheable no-wait-state data memory. The DSP has 256KB of L2 RAM, which can be defined as SRAM, L2 cache, or a combination of both. All C674x L3 and off-chip memory accesses are routed through a system MMU.

The device package has been specially engineered with Via Channel technology. This technology allows use of 0.8-mm pitch PCB feature sizes in this 0.65-mm pitch package, and substantially reduces PCB costs. Via Channel technology also allows PCB routing in only two signal layers due to the increased layer efficiency of the Via Channel BGA technology.

The DM816x DaVinci video processors are a highly integrated, programmable platform that leverages TI's DaVinci technology to meet the processing needs of the following applications: video encode, decode, transcode, and transrate; video security; video conferencing; video infrastructure; media server; and digital signage.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The device combines programmable video and audio processing with a highly integrated peripheral set.

Key to the device are up to three high-definition video and imaging coprocessors (HDVICP2). Each coprocessor can perform a single 1080p60 H.264 encode or decode or multiple lower resolution or frame rate encodes and decodes. Multichannel HD-to-HD or HD-to-SD transcoding and multicoding are also possible. With the ability to simultaneously process 1080p60 streams, the TMS320DM816x device is a powerful solution for today's demanding HD video application requirements.

Programmability is provided by an ARM Cortex-A8 RISC CPU with NEON extension, TI C674x VLIW floating-point DSP core, and high-definition video and imaging coprocessors. The ARM processor lets developers keep control functions separate from audio and video algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software. The ARM Cortex-A8 32-bit RISC processor with NEON floating-point extension includes: 32KB of instruction cache; 32KB of data cache; 256KB of L2 cache; 48KB of public ROM, and 64KB of RAM.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections in this document and the associated peripheral reference guides. The peripheral set includes: HD video processing subsystem (HDVPSS), which provides output of simultaneous HD and SD analog video and dual HD video inputs; up to two Gigabit Ethernet MACs (10 Mbps,100, Mbps, 1000 Mbps) with GMII and MDIO interface; two USB ports with integrated 2.0 PHY; PCIe port x2 lanes GEN2 compliant interface, which allows the device to act as a PCIe root complex or device endpoint; one 6-channel McASP audio serial port (with DIT mode); two dual-channel McASP audio serial ports (with DIT mode); one McBSP multichannel buffered serial port; three UARTs with IrDA and CIR support; SPI serial interface; SD and SDIO serial interface; two I2C master and slave interfaces; up to 64 GPIO pins; seven 32-bit timers; system watchdog timer; dual DDR2 and DDR3 SDRAM interface; flexible 8-bit and 16-bit asynchronous memory interface; and up to two SATA interfaces for external storage on two disk drives or more with the use of a port multiplier.

The device also includes an SGX530 3D graphics engine (available only on the TMS320DM8168 device) to enable sophisticated GUIs and compelling user interfaces and interactions. Additionally, the device has a complete set of development tools for both the ARM and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Microsoft Windows debugger interface for visibility into source code execution.

The C674x DSP core is the high-performance floating-point DSP generation in the TMS320C6000 DSP platform. The C674x floating-point DSP processor uses 32KB of L1 program memory and 32KB of L1 data memory. Up to 32KB of L1P can be configured as program cache. The remaining is noncacheable no-wait-state program memory. Up to 32KB of L1D can be configured as data cache. The remaining is noncacheable no-wait-state data memory. The DSP has 256KB of L2 RAM, which can be defined as SRAM, L2 cache, or a combination of both. All C674x L3 and off-chip memory accesses are routed through a system MMU.

The device package has been specially engineered with Via Channel technology. This technology allows use of 0.8-mm pitch PCB feature sizes in this 0.65-mm pitch package, and substantially reduces PCB costs. Via Channel technology also allows PCB routing in only two signal layers due to the increased layer efficiency of the Via Channel BGA technology.

다운로드 스크립트와 함께 비디오 보기 동영상

타사를 통해 지원

이 제품은 TI에서 지속적으로 직접 설계 지원을 제공하지 않습니다. 설계 작업 중 지원을 받으려면 다음 타사 중 하나에 문의할 수 있습니다. D3 Engineering, elnfochips, Ittiam Systems, Path Partner Technology 또는 Z3 Technologies.

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

Z3-3P-VIDEO-EVMS — Z3 기술 프로세서 비디오 평가 모듈

Z3 develops and supports open-source software architectures focused on TI's DaVinci and AM57x processors. Products include multimedia centric framework, peripheral drivers, production modules and complete product design services. Z3 also provides system level design and integration for both wired (...)
발송: Z3 Technology
디버그 프로브

TMDSEMU200-U — XDS200 USB 디버그 프로브

XDS200은 TI 임베디드 디바이스 디버깅에 사용되는 디버그 프로브(에뮬레이터)입니다. XDS200은 저렴한 XDS110 및 고성능 XDS560v2에 비해 저렴한 비용으로 우수한 성능을 균형 있게 제공합니다. 단일 포드에서 광범위한 표준(IEEE1149.1, IEEE1149.7, SWD)을 지원합니다. 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 Arm® 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 (...)

TI.com에서 구매 불가
디버그 프로브

TMDSEMU560V2STM-U — XDS560v2 시스템 추적 USB 디버그 프로브

XDS560v2는 디버그 프로브의 XDS560™ 제품군 중 최고의 성능을 가진 제품으로, 기존의 JTAG 표준(IEEE1149.1)과 cJTAG(IEEE1149.7)를 모두 지원합니다. SWD(직렬 와이어 디버그)는 지원하지 않습니다.

모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 ARM 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, (...)

TI.com에서 구매 불가
디버그 프로브

TMDSEMU560V2STM-UE — XDS560v2 시스템 추적 USB 및 이더넷 디버그 프로브

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

TI.com에서 구매 불가
소프트웨어 개발 키트(SDK)

LINUXEZSDK-DAVINCI Linux EZ Software Development Kit (EZSDK) for DM814x and DM816x - ALPHA

The Linux EZ Software Development Kit (EZ SDK) allows customers to evaluate their devices in minutes and begin development in less than an hour. This kit provides everything DaVinci™ developers need to evaluate and start developing on the DaVinci™ DM816x/DM814x processors. With the (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
TMS320DM8127 DaVinci 디지털 미디어 프로세서 TMS320DM8147 DaVinci 디지털 미디어 프로세서 TMS320DM8148 DaVinci 디지털 미디어 프로세서
DSP(디지털 신호 프로세서)
TMS320DM8165 DaVinci 디지털 미디어 프로세서 TMS320DM8167 DaVinci 디지털 미디어 프로세서 TMS320DM8168 DaVinci 디지털 미디어 프로세서
다운로드 옵션
드라이버 또는 라이브러리

SPRC264 — TMS320C5000/6000 이미지 라이브러리(IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
사용 설명서: PDF
드라이버 또는 라이브러리

SPRC265 — TMS320C6000 DSP 라이브러리(DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
사용 설명서: PDF
시뮬레이션 모델

DM816x CYG PG1x BSDL Model (Rev. A)

SPRM521A.ZIP (23 KB) - BSDL Model
시뮬레이션 모델

DM816x CYG PG2x BSDL Model

SPRM569.ZIP (23 KB) - BSDL Model
패키지 CAD 기호, 풋프린트 및 3D 모델
FCBGA (CYG) 1031 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상