제품 상세 정보

Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 250 CON (typ) (pF) 40 ON-state leakage current (max) (µA) 0.025 Supply current (typ) (µA) 250 Bandwidth (MHz) 80 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection, Powered-off protection Input/output continuous current (max) (mA) 5 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -44
Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 250 CON (typ) (pF) 40 ON-state leakage current (max) (µA) 0.025 Supply current (typ) (µA) 250 Bandwidth (MHz) 80 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection, Powered-off protection Input/output continuous current (max) (mA) 5 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -44
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RRP) 16 16 mm² 4 x 4
  • Wide supply range:
    • Dual supply: ±5 V to ±22 V
    • Single supply: 8 V to 44 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Non-fault channels continue to operate
    • Known state without logic inputs present
    • Output clamped to the supply in overvoltage condition
  • Latch-up immune
  • 1.8-V Logic capable
  • Fail-safe logic: up to 44 V independent of supply
  • Integrated pull-down resistor on logic pins
  • Break-before-make switching
  • Industry standard TSSOP and smaller WQFN packages
  • Wide supply range:
    • Dual supply: ±5 V to ±22 V
    • Single supply: 8 V to 44 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Non-fault channels continue to operate
    • Known state without logic inputs present
    • Output clamped to the supply in overvoltage condition
  • Latch-up immune
  • 1.8-V Logic capable
  • Fail-safe logic: up to 44 V independent of supply
  • Integrated pull-down resistor on logic pins
  • Break-before-make switching
  • Industry standard TSSOP and smaller WQFN packages

The TMUX7308F and TMUX7309F are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX7308F and TMUX7309F devices suitable for applications where power supply sequencing cannot be precisely controlled.

The device blocks fault voltage up to +60 V or –60 V relative to ground in both powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of switch input conditions and logic control status. Under normal operation conditions, if the analog input signal level on any Sx pin exceeds the supply voltage (V DD or V SS) by a threshold voltage (V T), the channel turns OFF and the Sx pin becomes high impedance. When the fault channel is selected, the drain pin (D or Dx) is pulled to the supply (V DD or V SS) that was exceeded.

The low capacitance, low charge injection, and integrated fault protection enables the TMUX7308F and TMUX7309F devices to be used in front end data acquisition applications where high performance and high robustness are both critical. The devices are available in a standard TSSOP package and smaller WQFN package (ideal if PCB space is limited).

The TMUX7308F and TMUX7309F are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX7308F and TMUX7309F devices suitable for applications where power supply sequencing cannot be precisely controlled.

The device blocks fault voltage up to +60 V or –60 V relative to ground in both powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of switch input conditions and logic control status. Under normal operation conditions, if the analog input signal level on any Sx pin exceeds the supply voltage (V DD or V SS) by a threshold voltage (V T), the channel turns OFF and the Sx pin becomes high impedance. When the fault channel is selected, the drain pin (D or Dx) is pulled to the supply (V DD or V SS) that was exceeded.

The low capacitance, low charge injection, and integrated fault protection enables the TMUX7308F and TMUX7309F devices to be used in front end data acquisition applications where high performance and high robustness are both critical. The devices are available in a standard TSSOP package and smaller WQFN package (ideal if PCB space is limited).

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기술 자료

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TMUX73XXF-EVM — PW 패키지용 TMUX73XXF 평가 모듈

이 사용 설명서에서는 TMUX73XXF 평가 모듈(EVM)과 그 의도된 애플리케이션을 설명합니다. 이 보드는 TSSOP(PW) 패키지의 텍사스 인스트루먼트의 TMUX73XXF 부품 시리즈의 빠른 프로토타이핑 및 DC 특성화를 지원합니다. 또한 다양한 신호를 테스트할 수 있는 유연성을 제공하는 온보드 테스트 포인트를 갖추고 있습니다.

사용 설명서: PDF | HTML
인터페이스 어댑터

LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

사용 설명서: PDF
인터페이스 어댑터

LEADLESS-ADAPTER1 — TI의 6, 8, 10, 12, 14, 16 및 20핀 리드 없는 패키지의 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
사용 설명서: PDF
시뮬레이션 모델

TMUX7308F IBIS Model

SCDM281.ZIP (31 KB) - IBIS Model
시뮬레이션 모델

TMUX7308F PSPICE Model

SCDM297.ZIP (56 KB) - PSpice Model
패키지 CAD 기호, 풋프린트 및 3D 모델
TSSOP (PW) 16 Ultra Librarian
WQFN (RRP) 16 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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