TPD5E003
- Provides System-Level ESD Protection for Low-
Voltage I/O Interface - IEC 61000-4-2 Level 4
- ±15 kV (Contact Discharge)
- ±15 kV (Air-Gap Discharge)
- Typical I/O Capacitance 7 pF (VIO = 2.5 V)
- DC Breakdown Voltage: 6 V (Minimum)
- Low Leakage Current: 100 nA (Maximum)
- Low ESD Clamping Voltage
- Industrial Temperature Range: –40°C to 125°C
- IEC 61000-4-5 (Surge): 40 W (8/20-µs Pulse)
- Small, Easy-to-Route DPF Package
The TPD5E003 is a five-channel electrostatic discharge (ESD) transient voltage
suppression (TVS) device. This device offers ±15-kV IEC contact and ±15-kV air-gap (level 4) ESD
protection, and features five identical ESD clamping diodes that can be used to protect either five
unidirectional (0 V to 5 V) I/O lines or four bidirectional (–5 V to 5 V) I/O lines. The compact
DPF package is an industry standard and is convenient for component placement in
space-constrained applications. Typical application interfaces include SIM card interfaces,
audio lines (mics, earphones, and speakerphones), SD interfaces, and keypads, or other buttons.
Typical end equipment includes cell phones, tablets, remote controllers, and wearables.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TPD5E003 Five-Channel Space-Saving ESD Protection Device datasheet (Rev. B) | PDF | HTML | 2015/09/29 |
User guide | Reading and Understanding an ESD Protection Data Sheet (Rev. A) | PDF | HTML | 2023/09/19 | |
Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022/08/18 | |
User guide | Generic ESD Evaluation Module User's Guide (Rev. A) | PDF | HTML | 2021/09/27 | |
White paper | Designing USB for short-to-battery tolerance in automotive environments | 2016/02/10 | ||
Analog Design Journal | Design Considerations for System-Level ESD Circuit Protection | 2012/09/25 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
ESDEVM — ESD 평가 모듈
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
X2SON (DPF) | 6 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.